What should be paid attention to for PCB copper coating?

We should pay attention to the following issues in order to achieve the desired effect of copper coating in copper coating:

1. If the PCB has many grounds, such as SGND, AGND, GND, etc., according to the position of the PCB board, the main “ground” should be used as a reference to independently pour copper, and the digital ground and analog ground should be separated. There is not much to say about copper pour. At the same time, before copper pour, first thicken the corresponding power connection: 5.0V, 3.3V, etc., in this way, a number of multi-deformation structures with different shapes are formed.


2. Single-point connection to different grounds, the method is to connect through 0 ohm resistors or magnetic beads or inductance;

3. Copper pour near the crystal oscillator. The crystal oscillator in the circuit is a high-frequency emission source. The method is to pour copper around the crystal oscillator, and then ground the outer shell of the crystal oscillator separately.

4Island (dead zone) problem, if you think it is too big, it won’t cost much to define a ground via and add it in.

5. At the beginning of wiring, the ground wire should be treated the same. When routing the ground wire, the ground wire should be routed well. You cannot rely on adding vias to eliminate the ground pins for the connection after copper plating. This effect is very bad.

6. It is best not to have sharp corners on the board, because from the perspective of electromagnetics, this constitutes a transmitting antenna! For other things, it is only large or small. I recommend using the edge of the arc.

7. Do not pour copper in the open area of ​​the middle layer of the multilayer board. Because it is difficult for you to make this copper clad “good grounding”

8. The metal inside the device, such as metal radiators, metal reinforcement strips, etc., must be “good grounding”.

9. The heat dissipation metal block of the three-terminal regulator must be well grounded. The ground isolation strip near the crystal oscillator must be well grounded.