Layout of special components in PCB design
1. High-frequency components: The shorter the connection between high-frequency components, the better, try to reduce the distribution parameters of the connection and the electromagnetic interference between each other, and the components that are susceptible to interference should not be too close. The distance between the input and output components should be as large as possible.
2. Components with high potential difference: The distance between the components with high potential difference and the connection should be increased to avoid damage to the components in the event of an accidental short circuit. In order to avoid the occurrence of creepage phenomenon, it is generally required that the distance between the copper film lines between the 2000V potential difference should be greater than 2mm. For higher potential differences, the distance should be increased. Devices with high voltage should be placed as hard as possible in a place that is not easy to reach during debugging.
3. Components with too much weight: These components should be fixed by brackets, and components that are large, heavy, and generate a lot of heat should not be installed on the circuit board.
4. Heating and heat-sensitive components: Note that the heating components should be far away from the heat-sensitive components.