LTCC materials have undergone a development process from simple to composite, from low dielectric constant to high dielectric constant, and the use of frequency bands continues to increase. From the perspectives of technology maturity, industrialization and wide application, LTCC technology is currently the mainstream technology of passive integration. LTCC is a cutting-edge product of high-tech, widely used in various fields of the microelectronics industry, and has a very broad application market and development prospects. At the same time, LTCC technology will also face competition and challenges from different technologies. How to continue to maintain its mainstream position in the field of wireless communication components must continue to strengthen its own technological development and vigorously reduce manufacturing costs, and continue to improve or urgently develop related technologies. For example, the United States (ITRI) is actively leading the development of PCB technology that can be embedded with resistors and capacitors, and is expected to reach a mature stage in 2 to 3 years. By then, it will become a strong player in the field of high-frequency communication modules in the form of MCM-L and LTCC/MLC. Strong competitors. As for the MCM-D technology developed with microelectronics technology as the core to make high-frequency communication modules, it is also being actively developed in major companies in the United States, Japan, and Europe. How to continue to maintain the mainstream position of LTCC technology in the field of wireless communication components must continue to strengthen its own technological development and vigorously reduce manufacturing costs, and continue to improve or urgently need to develop related technologies, such as solving the problem of matching heterogeneous materials in the integrated manufacturing process of devices. Burning, chemical compatibility, electromechanical performance and interface behavior.
China’s research on low-dielectric constant dielectric materials sintered at low temperature is obviously backward. Carrying out large-scale localization of low-temperature sintering dielectric materials and devices has not only important social benefits but also significant economic benefits. At present, how to develop/optimize and use independent intellectual property rights to make use of new principles, new technologies, new processes or new materials with new functions, new uses and new materials under the situation that advanced countries have a certain range of intellectual property protection monopolies Structure of new low-temperature sintered dielectric materials and devices, vigorously develop LTCC device design and processing technology, and large-scale product production lines applying LTCC devices, as soon as possible to promote the formation and development of my country’s LTCC technology industry is the main work in the future.