Intel seizes most 3nm capacity of TSMC

It is reported that TSMC has won a large number of orders for 3nm process from Intel. Intel will use new technology to develop its next generation chip.
Udn quoted sources in the supply chain as saying that Intel has obtained most of TSMC’s 3nm process orders for the production of its next generation chips. According to news media, TSMC’s 18B wafer plant is expected to start production in the second quarter of 2022 and mass production is expected to start in mid-2022. It is estimated that the production capacity will reach 4000 pieces by may 2022 and 10000 pieces per month during mass production

Intel seizes most 3nm capacity of TSMC
Intel seizes most 3nm capacity of TSMC

It has been reported that Intel will use TSMC 3nm in its next generation processors and display products. We first heard rumors from the beginning of 2021 that Intel may be producing mainstream consumer chips using N3 process to try to achieve the same process as AMD. Last month, we heard another news media quote TSMC’s two Intel designs to win.
It is now reported that TSMC’s 18B Fab will produce not two but at least four products at 3nm. It includes three designs for the server field and one design for the display field. We are not sure which products these are, but Intel has positioned its next-generation granite rapids Xeon CPU as an “Intel 4” (formerly 7Nm) product. Intel’s upcoming chips will adopt tile architecture design, mix and correspond to various small chips, and interconnect them through forveros / emib technology.
Some flat chips are likely to be produced in TSMC, while others will be produced in Intel’s own wafer factory. Intel’s flagship chip, the Ponte Vecchio GPU of “Intel 4”, is a product that well reflects this multi tile design. The design has multiple small chips in different processes produced by different wafer factories. Intel’s 2023 meteor Lake CPU is expected to adopt a similar tile configuration, and compute tile has tapeout on the “Intel 4” process. It is also possible to rely on external Fab I / O and display chips.
Intel has swallowed up the entire 3nm capacity of TSMC, which may put pressure on its competitors, mainly AMD and apple. Due to the process limitation of TSMC, AMD, which completely depends on TSMC to produce its latest 7Nm, has been facing serious supply problems. This may also be Intel’s strategy to prevent amd process development by prioritizing its own chips over TSMC, although it remains to be seen. For those who miss it, chipzilla has confirmed that it will outsource its chips to other wafer factories if necessary, so there is no speculation about this.