Discussion on the configuration of heat dissipation hole in PCB design

Como todos sabemos, o disipador de calor é un método para mellorar o efecto de disipación de calor dos compoñentes montados na superficie Placa PCB. In terms of structure, it is to set through holes on the PCB board. If it is a single-layer double-sided PCB board, it is to connect the surface of the PCB board with the copper foil on the back to increase the area and volume for heat dissipation, that is, to reduce the thermal resistance. Se se trata dunha placa PCB de varias capas, pódese conectar á superficie entre as capas ou a parte limitada da capa conectada, etc., o tema é o mesmo.

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A premisa dos compoñentes de montaxe superficial é reducir a resistencia térmica montándose na placa PCB (substrato). The thermal resistance depends on the copper foil area and thickness of the PCB acting as a radiator, as well as the thickness and material of the PCB. Basically, the heat dissipation effect is improved by increasing the area, increasing the thickness and improving the thermal conductivity. However, as the thickness of copper foil is generally limited by standard specifications, the thickness can not be increased blindly. Ademais, hoxe en día a miniaturización converteuse nun requisito básico, non só porque desexe a área do PCB e, de feito, o espesor da folla de cobre non é groso, polo que cando exceda unha determinada superficie non poderá obter o efecto de disipación de calor correspondente á zona.

Unha das solucións a estes problemas é o disipador de calor. To use the heat sink effectively, it is important to position the heat sink close to the heating element, such as directly under the component. Como se mostra na seguinte figura, pódese ver que é un bo método para facer uso do efecto de balance de calor para conectar a situación cunha gran diferenza de temperatura.

Discussion on the configuration of heat dissipation hole in PCB design

Configuración de buratos de disipación de calor

The following describes a specific layout example. Below is an example of the layout and dimensions of the heat sink hole for HTSOP-J8, a rear exposed heat sink package.

Para mellorar a condutividade térmica do burato de disipación de calor, recoméndase empregar un burato pequeno cun diámetro interno duns 0.3 mm que se poida encher mediante galvanoplastia. It is important to note that solder creep may occur during reflow processing if the aperture is too large.

Os orificios de disipación de calor están a uns 1.2 mm de distancia e están dispostos directamente baixo o disipador de calor na parte traseira do paquete. If only the back heat sink is not enough to heat, you can also configure heat dissipation holes around the IC. The point of configuration in this case is to configure as close to the IC as possible.

Discussion on the configuration of heat dissipation hole in PCB design

As for the configuration and size of the cooling hole, each company has its own technical know-how, in some cases may have been standardized, therefore, please refer to the above content on the basis of specific discussion, in order to obtain better results.

Puntos clave:

Heat dissipation hole is a way of heat dissipation through the channel (through hole) of PCB board.

The cooling hole should be configured directly below the heating element or as close to the heating element as possible.