Mutane da yawa PCB Masu sha’awar ƙira, musamman mafari, ba su da cikakkiyar fahimtar yadudduka daban-daban a ƙirar PCB. Ba su san aikinsa da amfaninsa ba. Ga cikakken bayani ga kowa da kowa:

1. Tsarin injin, kamar yadda sunan ke nunawa, shine bayyanar dukkan allon PCB don siffar injina. A gaskiya ma, idan muka yi magana game da inji Layer, muna nufin gaba ɗaya bayyanar da PCB hukumar. Hakanan za’a iya amfani dashi don saita ma’auni na allon kewayawa, alamomin bayanai, alamomin jeri, umarnin taro da sauran bayanan inji. Wannan bayanin ya bambanta dangane da buƙatun kamfanin ƙira ko masana’anta na PCB. Bugu da ƙari, za a iya ƙara ƙirar injiniyoyi zuwa wasu yadudduka don fitarwa da nunawa tare.

2. A kiyaye Layer (haramtaccen Layer wiring), ana amfani da shi don ayyana yanki inda za’a iya sanya abubuwan da aka gyara da wiring akan allon kewayawa. Zana rufaffiyar wuri akan wannan Layer a matsayin yanki mai inganci don kewayawa. Ba za a iya tsara shimfidu ta atomatik da tuƙi a wajen wannan yanki ba. Layin wayoyi da aka haramta yana bayyana iyaka lokacin da muka shimfiɗa halayen lantarki na jan karfe. Wato bayan da muka fara ayyana ma’aunin layin da aka haramta, a cikin tsarin na’ura mai ba da hanya tsakanin hanyoyin sadarwa na gaba, na’urar da ke da sifofin lantarki ba za su iya wuce wayoyi da aka haramta ba. A kan iyakar Layer, sau da yawa akwai al’ada ta amfani da Layer Keepout azaman Layer na inji. Wannan hanyar a zahiri ba daidai ba ce, don haka ana ba da shawarar cewa ku bambanta, in ba haka ba masana’antar allo za ta canza muku sifa a duk lokacin da kuka samar.

3. Sigina Layer: Ana amfani da siginar siginar galibi don shirya wayoyi a kan allon kewayawa. Ciki har da Top Layer (saman Layer), Layer na ƙasa (Layer na ƙasa) da 30 MidLayer (Layer na tsakiya). Sama da kasa yadudduka sanya na’urorin, da kuma ciki yadudduka suna fatattaka.

4. Top paste and Bottom paste are the top and bottom pad stencil layers, which are the same size as the pads. This is mainly because we can use these two layers to make the stencil when we do SMT. Just dug a hole the size of a pad on the net, and then we cover the stencil on the PCB board, and apply the solder paste evenly with a brush with solder paste, as shown in Figure 2-1.

5. Top Solder da Bottom Solder Wannan shine abin rufe fuska don hana koren mai daga rufewa. Sau da yawa muna cewa “bude taga”. An rufe jan ƙarfe ko wayoyi na al’ada da koren mai ta tsohuwa. Idan muka yi amfani da abin rufe fuska idan an sarrafa shi, zai hana koren mai ya rufe shi kuma ya fallasa tagulla. Ana iya ganin bambanci tsakanin su biyu a cikin wannan adadi mai zuwa:

6. Layin jirgin sama na ciki (ƙarfin ciki / ƙasa Layer): Irin wannan nau’in Layer ana amfani dashi kawai don allunan multilayer, galibi ana amfani dasu don tsara layin wuta da layin ƙasa. Muna kiran allunan Layer Layer, allunan Layer huɗu, da allunan Layer shida. Adadin siginar yadudduka da ƙarfin ciki / yadudduka na ƙasa.

7. Silkscreen Layer: Ana amfani da Layer na silkscreen ɗin don sanya bayanan da aka buga, kamar jerin abubuwan da aka buga da lakabi, haruffan annotation daban-daban, da dai sauransu. fayilolin siliki na kasa bi da bi.

8. Multi Layer (multi-Layer): The pads da shigar vias a kan kewaye allon dole ne su shiga dukan kewaye hukumar da kafa lantarki sadarwa tare da daban-daban conductive juna yadudduka. Saboda haka, tsarin ya kafa wani m Layer-multi-Layer . Gabaɗaya, pads da vias dole ne a shirya su akan yadudduka da yawa. Idan an kashe wannan Layer, pads da ta hanyar ba za a iya nuna su ba.

9. Drill Drawing (dilling Layer): Layer na hakowa yana ba da bayanan hakowa yayin aikin kera jirgin (kamar pads, vias buƙatar da za a haƙa). Altium yana samar da yadudduka na hakowa guda biyu: gride Drill da Drill zane.