PCB pressing common problems

PCB pressing common problems

1. White, revealing the texture of the glass cloth

matsalolin da ke haifar da:

1. The resin fluidity is too high;

2. The pre-pressure is too high;

3. Lokacin ƙara matsa lamba ba daidai ba ne;

4. Abinda ke ciki na resin na takardar haɗin gwiwa yana da ƙasa, lokacin gel yana da tsawo, kuma ruwa yana da girma;

ipcb

Magani:

1. Rage zafin jiki ko matsa lamba;

2. Reduce pre-pressure;

3. Yi hankali da kula da resin gudu a lokacin lamination, bayan canjin matsa lamba da hawan zafin jiki, daidaita lokacin farawa na yin amfani da matsa lamba;

4. Adjust the pre-pressure\temperature and the start time of high pressure;

Two, foaming, foaming

matsalolin da ke haifar da:

1. Pre-matsa lamba yana da ƙasa;

2. The temperature is too high and the interval between pre-pressure and full pressure is too long;

3. The dynamic viscosity of the resin is high, and the time to add full pressure is too late;

4. The volatile content is too high;

5. Ƙasar haɗin gwiwa ba ta da tsabta;

6. Poor mobility or insufficient pre-stress;

7. The jirgin zafin jiki ne low.

Magani:

1. Ƙara pre-matsa lamba;

2. Cool down, ƙara pre-matsa lamba ko rage pre-matsawa sake zagayowar;

3. The time-activity relationship curve should be compared to make the pressure, temperature and fluidity coordinate with each other;

4. Reduce the pre-compression cycle and reduce the temperature rise rate, or reduce the volatile content;

5. Ƙarfafa ƙarfin aiki na tsaftacewa magani.

6. Increase the pre-pressure or replace the bonding sheet.

7. Bincika wasan hita kuma daidaita yanayin zafi mai zafi

3. Akwai ramuka, guduro da wrinkles a kan jirgin saman

matsalolin da ke haifar da:

1. Improper operation of LAY-UP, water stains on the surface of the steel plate that have not been wiped dry, causing the copper foil to wrinkle;

2. Fuskar allon yana rasa matsi yayin danna allon, wanda ke haifar da asarar guduro mai yawa, rashin manne a ƙarƙashin murfin tagulla, da wrinkles a saman fuskar tagulla;

Magani:

1. A hankali tsaftace farantin karfe da kuma santsi saman murfin tagulla;

2. Kula da daidaitawa na babba da ƙananan faranti tare da faranti lokacin shirya faranti, rage matsa lamba, yi amfani da ƙananan RF% fim, rage lokacin gudu na gudu da sauri da sauri;

Fourth, the inner layer graphics shift

matsalolin da ke haifar da:

1. Bakin ƙarfe na ciki na ciki yana da ƙarancin peeling ƙarfi ko ƙarancin zafin jiki ko faɗin layi yana da bakin ciki sosai;

2. The pre-pressure is too high; the dynamic viscosity of the resin is small;

3. Samfurin latsa ba daidai ba ne;

Magani:

1. Canja zuwa babban inganci na ciki-Layer mai rufin katako;

2. Reduce the pre-pressure or replace the adhesive sheet;

3. Adjust the template;

Five, uneven thickness, inner layer slippage

matsalolin da ke haifar da:

1. The total thickness of the forming plate of the same window is different;

2. The accumulated thickness deviation of the printed board in the forming board is large; the parallelism of the hot-pressing template is poor, the laminated board can move freely, and the entire stack is off the center of the hot-pressing template;

Magani:

1. Daidaita kauri iri ɗaya;

2. Daidaita kauri, zaɓi laminate clad tagulla tare da ƙananan karkatacciyar kauri; daidaita daidaiton allon fim mai zafi mai zafi, iyakance ‘yancin amsawa da yawa don allon laminated, kuma kuyi ƙoƙarin sanya laminate a tsakiyar yankin samfuri mai zafi;

Six, interlayer dislocation

matsalolin da ke haifar da:

1. The thermal fadada na ciki Layer abu da guduro kwarara na bonding takardar;

2. Heat shrinkage during lamination;

3. Thermal fadada coefficient na laminate abu da samfuri ne quite daban-daban.

Magani:

1. Sarrafa halaye na takardar m;

2. An yi amfani da farantin zafi a gaba;

3. Yi amfani da allo mai rufi na jan ƙarfe na ciki da takardar haɗin gwiwa tare da kwanciyar hankali mai kyau.

Seven, plate curvature, plate warpage

matsalolin da ke haifar da:

1. Tsarin asymmetric;

2. Rashin isasshen sake zagayowar warkewa;

3. The cutting direction of the bonding sheet or the inner copper clad laminate is inconsistent;

4. The multi-layer board uses plates or bonding sheets from different manufacturers.

5. Ana amfani da allon multilayer ba daidai ba bayan bayan-cutarwa da sakewa da matsa lamba

Magani:

1. Strive for symmetrical wiring design density and symmetrical placement of bonding sheets in lamination;

2. Guarantee the curing cycle;

3. Yi ƙoƙari don madaidaiciyar jagorar yankewa.

4. Zai zama da amfani don amfani da kayan da aka samar da wannan masana’anta a cikin haɗin haɗin gwiwa

5. The multilayer board is heated to above Tg under pressure, and then kept under pressure and cooled to below room temperature

Takwas, stratification, zafi stratification

matsalolin da ke haifar da:

1. High humidity or volatile content in the inner layer;

2. High volatile content in the adhesive sheet;

3. Pollution of the inner surface; pollution of foreign substances;

4. The surface of the oxide layer is alkaline; there are chlorite residues on the surface;

5. Rashin iskar shaka ba shi da kyau, kuma crystal Layer oxide ya yi tsayi sosai; kafin magani bai samar da isasshen fili ba.

6. Insufficient passivation

Magani:

1. Before lamination, bake the inner layer to remove moisture;

2. Improve the storage environment. The adhesive sheet must be used up within 15 minutes after being removed from the vacuum drying environment;

3. Improve the operation and avoid touching the effective area of ​​the bonding surface;

4. Strengthen the cleaning after the oxidation operation; monitor the PH value of the cleaning water;

5. Shorten the oxidation time, adjust the concentration of the oxidation solution or operate the temperature, increase the micro-etching, and improve the surface condition.

6. Follow the process requirements