Ƙididdigar dalilai na matalauta PCB shafi

1. Filhu

Matsakaicin ramukan suna saboda hydrogen da aka tallata a saman sassan da aka yi da su, kuma ba a sake su na dogon lokaci ba. Yi maganin plating ɗin ba zai iya jika saman sassan da aka yi da shi ba, ta yadda ba za a iya ajiye Layer ɗin ta hanyar lantarki ba. Yayin da kaurin rufin da ke kusa da ma’aunin juyin halittar hydrogen ya karu, ana samun ramin rami a wurin juyin halittar hydrogen. Ana siffanta shi da ramin zagaye mai sheki da kuma wani lokacin ƙaramar wutsiya ta sama. Lokacin da plating bayani rasa jike wakili da kuma halin yanzu yawa ne high, pinholes suna sauƙi kafa.

2. Alaji

Ramin yana faruwa ne sakamakon ƙazantaccen saman da aka lulluɓe, ƙaddamar da ƙaƙƙarfan kwayoyin halitta, ko kuma dakatar da wani abu mai ƙarfi a cikin maganin plating. Lokacin da ya isa saman kayan aikin a ƙarƙashin aikin filin lantarki, ana tallata shi a kai, wanda ke shafar electrolysis kuma ya haɗa waɗannan abubuwa masu ƙarfi a cikin Layer na electroplating, ƙananan kumbura (ramuka) suna samuwa. Halin shi ne cewa yana da kullun, babu wani abu mai haske, kuma babu tsayayyen siffar. A takaice, yana faruwa ta hanyar datti workpiece da datti plating bayani.

3. Guguwar iska

Rage kwararar iska ya faru ne saboda abubuwan da suka wuce kima ko babban adadin cathode na yanzu ko babban wakili mai rikitarwa, wanda ke rage tasirin cathode na yanzu, yana haifar da babban adadin juyin halittar hydrogen. Idan plating bayani yana gudana sannu a hankali kuma cathode yana motsawa a hankali, iskar hydrogen zai shafi tsari na lu’ulu’u na electrolytic yayin aiwatar da tashi sama da saman aikin, samar da ratsi na kwararar gas na kasa zuwa sama.

4. Masking (bayyana)

Masking shi ne saboda gaskiyar cewa ba a cire filasha mai laushi a kan fil ɗin da ke saman aikin ba, kuma ba za a iya aiwatar da murfin daftarin lantarki a nan ba. Tushen kayan yana bayyane bayan electroplating, don haka ana kiran shi fallasa (saboda filasha mai laushi shine ɓangaren resin translucent ko m).

5. Rufewa yana karye

Bayan SMD electroplating, bayan yanke hakarkarin da kafa, za a iya ganin cewa akwai fasa a cikin lankwasa fil. Lokacin da akwai tsaga tsakanin nickel Layer da substrate, ana yin hukunci cewa Layer na nickel ya karye. Lokacin da aka sami tsaga tsakanin Layer tin da Layer nickel, ana yanke hukunci cewa kwandon ya karye. Abin da ke haifar da ɓarna shine galibin abubuwan da ake ƙara ƙarawa, ƙarar haske mai yawa, ko ƙazanta marasa ƙarfi ko na halitta da yawa a cikin maganin plating.