Ma’ana da aikin yadudduka na PCB

1. Drilling Layer: Layer na hakowa yana ba da bayanin hakowa yayin aikin masana’anta na Kwamitin Circuit da aka Buga (misali, ta hanyar rami na kushin yana buƙatar hakowa).

2. Siginar sigina: ana amfani da siginar siginar galibi don shirya wayoyi akan allon kewayawa.

3. Sayar da abin rufe fuska: a shafa fenti, kamar abin rufe fuska, ga dukkan sassa sai kushin don hana yin amfani da tin a waɗannan sassa. Ana amfani da abin rufe fuska don dacewa da kushin a cikin tsarin ƙira kuma ana haifar da shi ta atomatik.

4. Solder manna m Layer, s-md faci Layer: yana da wannan aiki a matsayin solder tsayayya Layer, sai dai daidai bonding kushin na surface bonded aka gyara a lokacin inji waldi.

5. Haramtaccen Layer wiring: ana amfani da shi don ayyana yanki inda za’a iya sanya abubuwan haɗin gwiwa da wayoyi yadda ya kamata akan Kwamitin Circuit da aka Buga. Zana rufaffiyar wuri akan wannan Layer a matsayin yanki mai inganci don yin waya. Ba za a iya shimfida shi ta atomatik da fitar da shi a wajen wannan yanki ba.

6. Silk screen Layer: Layer allon siliki ana amfani da shi ne don sanya bayanan bugu, kamar zane da alamar abubuwan da aka gyara, haruffan annotation daban-daban, da dai sauransu. Gabaɗaya, haruffan annotation daban-daban suna kan saman saman allo, da allon ƙasa. Za a iya rufe Layer na bugawa.

7. Internal samar da wutar lantarki / grounding Layer: wannan nau’i na Layer ana amfani ne kawai don multilayer allon kuma an yafi amfani da shi don shirya wutar lantarki da kuma grounding wayoyi Muna kira biyu-Layer board, hudu Layer board da shida Layer board, wanda kullum yana nufin adadin siginar siginar da ƙarfin ciki / ƙasan ƙasa.

8. Mechanical Layer: ana amfani da shi gabaɗaya don saita ma’auni gabaɗaya, alamomin bayanai, alamomin jeri, umarnin taro da sauran bayanan inji na allon kewayawa. Bayanan sun bambanta bisa ga bukatun kamfanin ƙira ko PCB manufacturer. Bugu da ƙari, za a iya haɗa Layer na inji zuwa wasu yadudduka don fitar da nuni tare.