Ba tare da na zamani ba PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Fasahar HDI tana ba masu zanen kaya damar sanya ƙananan abubuwan da ke kusa da juna. Yawan fakiti mafi girma, ƙaramin girman jirgi da ƙarancin yadudduka suna haifar da tasiri ga ƙirar PCB.

Amfanin HDI

Let’s take a closer look at the impact. Ƙara yawan fakitin yana ba mu damar rage hanyoyin lantarki tsakanin abubuwan. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Rage adadin yadudduka na iya sanya ƙarin haɗin kai a kan jirgi ɗaya da inganta sanyawa, wayoyi da haɗi. Daga can, za mu iya mai da hankali kan dabarar da ake kira interconnect per Layer (ELIC), wanda ke taimaka wa ƙungiyoyin ƙira su motsa daga katako masu kauri zuwa masu sassauƙa masu sauƙi don kula da ƙarfi yayin barin HDI don ganin girman aiki.

HDI PCBS rely on lasers rather than mechanical drilling. Hakanan, ƙirar HDI PCB tana haifar da ƙaramin buɗewa da ƙaramin girman kushin. Rage buɗewa ya ba da damar ƙungiyar ƙira ta ƙara shimfidar yankin hukumar. Rage hanyoyin wutar lantarki da ba da damar ƙarin wayoyi masu ƙarfi suna haɓaka amincin siginar ƙira da haɓaka aikin sigina. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Tsarin HDB PCB ba sa amfani da ramuka, amma makafi da ramukan da aka binne. Tsaye da madaidaicin sanya jana’iza da ramukan makafi yana rage matsin lamba na injin akan farantin kuma yana hana kowane damar warkewa. Bugu da ƙari, zaku iya amfani da ramukan da aka tara don haɓaka wuraren haɗin kai da haɓaka dogaro. Amfani da ku akan pads na iya rage asarar sigina ta rage jinkirin giciye da rage tasirin cutar.

Ƙirƙirar HDI yana buƙatar haɗin gwiwa

Tsarin ƙira (DFM) yana buƙatar tunani, madaidaicin tsarin ƙirar PCB da daidaitaccen sadarwa tare da masana’antun da masana’antun. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. A taƙaice, ƙira, ƙerawa da aiwatarwa na HDI PCBS yana buƙatar haɗin gwiwa tare da kulawa ga takamaiman dokokin DFM da suka shafi aikin.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Sanin kayan aikin da’irar ku da bayanai dalla -dalla

Saboda samar da HDI yana amfani da nau’ikan hanyoyin hakowa na laser daban -daban, tattaunawa tsakanin ƙungiyar ƙira, mai ƙira da masana’anta dole ne su mai da hankali kan nau’in allon lokacin tattauna batun hakowa. Aikace -aikacen samfur wanda ke haifar da tsarin ƙira na iya samun buƙatun girma da nauyi waɗanda ke motsa tattaunawar ta wata hanya ko wata. High frequency applications may require materials other than standard FR4. Bugu da ƙari, yanke shawara game da nau’in kayan FR4 yana shafar yanke shawara game da zaɓin tsarin hakowa ko wasu albarkatun masana’antu. Yayin da wasu tsarin ke hakowa ta hanyar tagulla cikin sauƙi, wasu ba sa shiga cikin filayen gilashi akai -akai.

Baya ga zaɓar nau’in kayan da ya dace, ƙungiyar ƙira dole ne ta tabbatar cewa mai ƙera da masana’anta na iya amfani da madaidaicin farantin faifai da dabarun sakawa. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Kodayake faranti masu kauri suna ba da damar ƙaramin buɗewa, buƙatun injin na aikin na iya ƙayyade faranti mafi ƙanƙanta waɗanda ke iya yin rauni a ƙarƙashin wasu yanayin muhalli. Dole ƙungiyar ƙira ta bincika cewa mai ƙera yana da ikon yin amfani da fasahar “interconnect Layer” da haƙa ramuka a daidai zurfin, da kuma tabbatar da cewa maganin sinadarin da ake amfani da shi don yin amfani da wutar lantarki zai cika ramukan.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Sakamakon ELIC, ƙirar PCB na iya amfani da fa’ida mai yawa, hadaddun haɗe-haɗe da ake buƙata don da’irori masu saurin gudu. Saboda ELIC yana amfani da microholes cike da jan ƙarfe don haɗawa, ana iya haɗa shi tsakanin kowane yadudduka biyu ba tare da raunana hukumar da’irar ba.

Zaɓin ɓangaren yana shafar shimfidawa

Duk wani tattaunawa tare da masana’antun da masana’antun dangane da ƙirar HDI suma ya kamata su mai da hankali kan madaidaicin shimfidar abubuwan da ke da ƙarfi. The selection of components affects wiring width, position, stack and hole size. Misali, ƙirar HDI PCB galibi sun haɗa da tsararren ƙwallon ƙwallon ƙwallon ƙafa (BGA) da BGA mai nisan gaske wanda ke buƙatar tserewa fil. Dole ne a gane abubuwan da ke lalata wutan lantarki da mutuncin sigina gami da mutuncin hukumar a lokacin amfani da waɗannan na’urori. Waɗannan abubuwan sun haɗa da samun keɓancewar da ta dace tsakanin saman da ƙasa don rage raɗaɗin juna da sarrafa EMI tsakanin yadudduka siginar ciki.Symmetrically spaced components will help prevent uneven stress on the PCB.

Kula da sigina, iko da mutuncin jiki

Baya ga inganta mutuncin sigina, Hakanan zaka iya haɓaka amincin ikon. Saboda HDB PCB tana motsa murfin ƙasa kusa da farfajiya, an inganta amincin ikon. Layer na saman jirgin yana da faɗin ƙasa da mai samar da wutar lantarki, wanda za a iya haɗa shi da layin ƙasa ta hanyar ramukan makafi ko microholes, kuma yana rage yawan ramukan jirgin.

HDI PCB yana rage adadin ramukan ta cikin layin jirgin. In turn, reducing the number of perforations in the power plane provides three major advantages:

Yankin jan ƙarfe mafi girma yana ciyar da AC da DC a cikin fil ɗin guntu

L resistance decreases in the current path

L Saboda ƙarancin haɓaka, madaidaicin madaidaicin halin yanzu yana iya karanta fil ɗin wutar.

Wani mahimmin batun tattaunawa shine a kiyaye mafi ƙarancin faɗin layin, tazara mai aminci da daidaiton waƙa. A kan fitowar ta ƙarshe, fara cimma kaurin jan ƙarfe iri ɗaya da daidaiton wayoyi yayin aikin ƙira kuma ci gaba da aiwatar da ƙira da ƙira.

Rashin amintaccen tazara na iya haifar da ragowar fina -finai a yayin aikin fim ɗin bushewar ciki, wanda zai iya haifar da gajerun da’irori. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Ƙungiyoyin ƙira da masana’antun dole ne su yi la’akari da riƙe daidaiton waƙa a matsayin hanyar sarrafa ƙarancin siginar siginar.

Kafa da amfani da takamaiman dokokin ƙira

Tsarin shimfida mai yawa yana buƙatar ƙaramin girma na waje, mafi kyawun wayoyi da tazara mai ƙarfi, sabili da haka yana buƙatar tsarin ƙirar daban. Tsarin masana’antu na HDI PCB ya dogara da hakowa na laser, CAD da software na CAM, hanyoyin sarrafa kai tsaye na laser, kayan aikin masana’antu na musamman, da ƙwarewar mai aiki. Nasarar dukkan tsarin ya dogara da sashi akan ƙa’idodin ƙira waɗanda ke gano buƙatun rashin ƙarfi, faɗin jagora, girman rami, da sauran abubuwan da ke shafar shimfidar. Samar da cikakkun ƙa’idodin ƙira yana taimakawa zaɓi madaidaicin mai ƙera ko masana’anta don hukumar ku kuma yana kafa harsashin sadarwa tsakanin ƙungiyoyi.