Kev tsim khoom ntawm HDI PCB: Cov ntaub ntawv PCB thiab cov lus qhia tshwj xeeb

Tsis niaj hnub PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. HDI thev naus laus zis tso cai rau cov tsim qauv tso cov khoom me me nyob ze ib leeg. Cov pob ntim ntau dua, cov pawg me me thiab cov txheej tsawg dua ua rau muaj qhov cuam tshuam rau PCB tsim.

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Qhov zoo ntawm HDI

Let’s take a closer look at the impact. Kev nce pob khoom ceev tso cai rau peb kom luv txoj hauv kev ntawm cov khoom siv hluav taws xob. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Txo cov txheej txheej tuaj yeem tso ntau qhov kev sib txuas ntawm tib lub rooj tsavxwm thiab txhim kho cov khoom sib txuas, txuas thiab txuas. Los ntawm qhov ntawd, peb tuaj yeem tsom mus rau cov txheej txheem hu ua kev sib txuas ib txheej (ELIC), uas pab tsim pab pawg txav los ntawm cov laug cam tuab mus rau cov thwjtim nyias nyias kom tswj tau lub zog thaum tso cai rau HDI kom pom kev ua haujlwm ntom ntom.

HDI PCBS rely on lasers rather than mechanical drilling. Nyob rau hauv lem, LUB HDI PCB tsim tau ua rau lub qhov taub me dua thiab cov ntaub qhwv me me. Txo qhov lub qhov taub tso cai rau pab pawg tsim los txhawm rau teeb tsa thaj tsam ntawm pawg thawj coj saib. Txoj hauv kev hluav taws xob luv thiab ua kom muaj kev sib txuas ntau ntxiv txhim kho lub teeb liab ncaj ncees ntawm kev tsim qauv thiab ua kom cov teeb liab ua tiav. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

HDI PCB tsim tsis siv los ntawm qhov, tab sis qhov muag tsis pom thiab faus qhov. Staggered thiab raug tso rau qhov faus thiab qhov muag tsis pom qhov txo cov neeg kho tshuab siab ntawm lub phaj thiab tiv thaiv txhua txoj hauv kev ntawm kev ua rog. Ib qho ntxiv, koj tuaj yeem siv teeb tsa los ntawm qhov ua kom txhim kho cov ntsiab lus sib txuas thiab txhim kho kev ntseeg tau. Koj siv cov ntaub qhwv kuj tseem tuaj yeem txo qis teeb liab los ntawm kev txo qis hla thiab txo cov kab mob cuam tshuam.

HDI kev tsim khoom xav tau kev sib koom tes

Kev tsim khoom tsim tawm (DFM) xav tau kev txawj ntse, meej PCB tsim txoj hauv kev thiab kev sib txuas lus zoo ib yam nrog cov tuam ntxhab thiab cov chaw tsim khoom. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Hauv ntej, tsim, qauv tsim thiab txheej txheem tsim khoom ntawm HDI PCBS xav tau kev sib koom tes ua haujlwm thiab saib xyuas tshwj xeeb cov cai DFM siv rau txoj haujlwm.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Paub koj cov khoom siv hluav taws xob thiab cov lus qhia tshwj xeeb

Vim tias HDI kev tsim khoom siv ntau hom txheej txheem laser drilling, kev sib tham ntawm pab pawg tsim qauv, cov chaw tsim khoom thiab cov chaw tsim khoom yuav tsum tsom mus rau cov khoom siv ntawm cov laug cam thaum tham txog cov txheej txheem drilling. Daim ntawv thov cov khoom lag luam uas ua kom cov txheej txheem tsim khoom tuaj yeem muaj qhov loj me thiab qhov hnyav xav tau uas txav kev sib tham hauv ib qho lossis lwm qhov. High frequency applications may require materials other than standard FR4. Ib qho ntxiv, kev txiav txim siab txog hom khoom FR4 cuam tshuam rau kev txiav txim siab txog kev xaiv cov txheej txheem drilling lossis lwm yam peev txheej tsim khoom. Thaum qee lub tshuab siv los ntawm tooj liab yooj yim, lwm tus tsis cuam tshuam nrog cov iav fiber ntau.

Ntxiv nrog rau xaiv cov khoom siv kom raug, pab pawg tsim qauv yuav tsum xyuas kom meej tias cov chaw tsim khoom thiab cov chaw tsim khoom tuaj yeem siv cov phaj tuab tuab thiab cov txheej txheem plating raug. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Txawm hais tias cov phaj tuab tso cai rau lub qhov me me, qhov xav tau ntawm cov phiaj xwm ntawm qhov haujlwm tuaj yeem hais qhia cov phaj nyias nyias uas ua rau tsis ua raws qee qhov xwm txheej ib puag ncig. Pab neeg tsim qauv yuav tsum txheeb xyuas tias cov chaw tsim khoom muaj peev xwm siv “txheej txheej sib txuas” txheej txheem thiab siv qhov taub ntawm qhov tob raug, thiab xyuas kom meej tias cov tshuaj siv tshuaj rau electroplating yuav ua rau lub qhov.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Raws li qhov tshwm sim ntawm ELIC, PCB tsim qauv tuaj yeem ua kom zoo dua ntawm qhov ntom ntom ntom ntom, kev sib txuas sib txuas uas xav tau rau kev siv hluav taws xob nrawm. Vim tias ELIC siv cov txheej tooj liab uas muaj cov tooj liab sib sau ua ke rau kev sib txuas, nws tuaj yeem txuas nrog ntawm ob txheej uas tsis muaj zog ua rau pawg thawj coj saib xyuas tsis muaj zog.

Kev xaiv cov khoom cuam tshuam rau kev teeb tsa

Ib qho kev sib tham nrog cov tuam txhab thiab cov tsim khoom hais txog HDI tsim qauv yuav tsum tsom mus rau qhov tseeb txheej txheem ntawm cov khoom sib txuam siab. The selection of components affects wiring width, position, stack and hole size. Piv txwv li, HDI PCB tsim qauv feem ntau suav nrog cov pob ntom ntom kab (BGA) thiab qhov sib nrug zoo BGA uas xav tau tus pin khiav. Cov xwm txheej uas cuam tshuam rau lub hwj chim thiab teeb liab kev ncaj ncees nrog rau lub cev ruaj khov ntawm pawg thawj coj yuav tsum raug lees paub thaum siv cov khoom siv no. Cov xwm txheej no suav nrog ua tiav qhov tsim nyog cais tawm ntawm txheej txheej saum toj thiab hauv qab kom txo qis kev sib koom ua ke thiab tswj EMI ntawm cov teeb liab sab hauv.Symmetrically spaced components will help prevent uneven stress on the PCB.

Ua tib zoo mloog lub teeb liab, lub zog thiab lub cev ncaj ncees

Ntxiv rau kev txhim kho teeb liab kev ntseeg siab, koj tseem tuaj yeem txhim kho lub zog ncaj ncees. Vim tias HDI PCB txav cov txheej hauv av ze rau saum npoo, lub zog muaj zog tau zoo dua. Sab saum toj txheej ntawm pawg thawj coj muaj txheej txheej hauv av thiab txheej txheej fais fab, uas tuaj yeem txuas nrog txheej av hauv av los ntawm qhov muag tsis pom lossis microholes, thiab txo tus lej ntawm lub dav hlau qhov.

HDI PCB txo cov naj npawb ntawm qhov hla los ntawm txheej sab hauv ntawm pawg thawj coj saib. In turn, reducing the number of perforations in the power plane provides three major advantages:

Cov cheeb tsam tooj liab loj dua pub AC thiab DC tam sim no rau hauv lub zog fais fab tus pin

L resistance decreases in the current path

L Vim tias qhov qis qis, qhov hloov pauv raug tam sim no tuaj yeem nyeem tus lej fais fab.

Lwm qhov ntsiab lus tseem ceeb ntawm kev sib tham yog kom muaj kab dav dav yam tsawg kawg nkaus, sib nrug kom nyab xeeb thiab taug qab qhov sib xws. Ntawm qhov teeb meem tom kawg, pib ua tiav cov tooj liab tuab tuab thiab thaiv cov kab sib xws thaum lub sijhawm tsim cov txheej txheem thiab txuas ntxiv nrog kev tsim khoom thiab txheej txheem tsim khoom.

Qhov tsis muaj qhov chaw nyab xeeb tuaj yeem ua rau cov yeeb yaj kiab ntau dhau thaum lub sijhawm ua cov txheej txheem zaj duab xis qhuav, uas tuaj yeem ua rau luv luv Circuit Court. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Pab pawg tsim qauv thiab cov tsim khoom lag luam yuav tsum txiav txim siab saib xyuas kev sib koom ua ke raws li kev tswj hwm cov teeb liab kab impedance.

Tsim thiab siv cov cai tsim tshwj xeeb

High-density layouts yuav tsum tau me me sab nraud ntev, finer thaiv thiab tighter tivthaiv yov, thiab yog li ntawd yuav tsum tau ib tug txawv tsim cov txheej txheem. HDI PCB kev tsim txheej txheem tso siab rau kev siv tshuab laser, CAD thiab CAM software, txheej txheem laser ncaj qha, cov cuab yeej tsim khoom tshwj xeeb, thiab cov kws tshaj lij kev paub. Kev ua tiav ntawm tag nrho cov txheej txheem nyob ntawm ib feem ntawm cov cai tsim uas txheeb xyuas qhov tsis xav tau, tus neeg xyuas pib dav, qhov loj me, thiab lwm yam uas cuam tshuam rau kev teeb tsa. Kev tsim cov txheej txheem tsim qauv ntxaws ntxaws pab xaiv lub chaw tsim khoom lossis tus tsim khoom rau koj pawg thawj coj thiab tso lub hauv paus rau kev sib txuas lus ntawm pab pawg.