Ka hana a me ke ano o ka OSP Film i ka Lead-Free Kaʻina o PCB Papa kope

Ua manaʻo ʻia ʻo OSP (Organic Solderable Protective Film) ʻo ia ke kaʻina hana lapaʻau maikaʻi loa ma muli o kāna mea hoʻoheheʻe maikaʻi, kaʻina maʻalahi a me ke kumu kūʻai haʻahaʻa.

Ma kēia pepa, hoʻohana ʻia ka thermal desorption-gas chromatography-mass spectrometry (TD-GC-MS), thermogravimetric analysis (TGA) a me photoelectron spectroscopy (XPS) e kālailai i nā hiʻohiʻona pale wela o kahi hanauna hou o nā kiʻi ʻoniʻoni OSP kiʻekiʻe. Ke hoʻāʻo nei ka chromatography kinoea i nā ʻāpana molekala liʻiliʻi i loko o ke kiʻi ʻoniʻoni OSP kūʻokoʻa kiʻekiʻe (HTOSP) e pili ana i ka solderability. I ka manawa like, e hōʻike ana i ka alkylbenzimidazole-HT i ka kiʻi ʻoniʻoni OSP kūʻokoʻa kiʻekiʻe he liʻiliʻi loa. Hōʻike ka ʻikepili TGA i ka kiʻiʻoniʻoni HTOSP i ʻoi aku ka kiʻekiʻe o ka wela hoʻohaʻahaʻa ma mua o ke kiʻi ʻoniʻoni OSP maʻamau o kēia manawa. Hōʻike ka ʻikepili XPS ma hope o 5 mau alakaʻi hou ʻole o ka OSP wela kiʻekiʻe, ua hoʻonui wale ʻia ka ʻike oxygen ma kahi o 1%. ʻO nā hoʻomaikaʻi ma luna e pili pono ana i nā koi o ka solderability manuahi ʻoihana.

Ua hoʻohana ʻia ke kiʻi ʻoniʻoni OSP i nā papa kaapuni no nā makahiki he nui. He kiʻiʻoniʻoni polymer organometallic i hana ʻia e ka hopena o nā pūhui azole me nā mea metala hoʻololi, e like me ke keleawe a me ka zinc. He nui nā haʻawina [1,2,3] i hōʻike i ke ʻano hana inhibition corrosion o nā hui azole ma nā ʻili metala. Ua hoʻohui maikaʻi ʻo GPBrown [3] i ka benzimidazole, ke keleawe (II), ka zinc (II) a me nā mea metala hoʻololi ʻē aʻe o nā polymers organometallic, a wehewehe i ka maikaʻi o ke kūpaʻa wela kiʻekiʻe o ka poly(benzimidazole-zinc) ma o ke ʻano TGA. Hōʻike ka ʻikepili TGA a GPBrown i ka kiʻekiʻe o ka wela hoʻohaʻahaʻa o ka poly(benzimidazole-zinc) e like me 400 ° C i ka lewa a me 500 ° C i loko o kahi lewa nitrogen, aʻo ka mahana degradation o poly(benzimidazole-copper) he 250 ° C wale nō. . Hoʻokumu ʻia ka kiʻiʻoniʻoni HTOSP hou i kūkulu ʻia i nā waiwai kemika o ka poly(benzimidazole-zinc), nona ka pale wela maikaʻi loa.

ʻO ke kiʻi ʻoniʻoni OSP ka mea nui i haku ʻia me nā polymers organometallic a me nā molekala liʻiliʻi i hoʻopaʻa ʻia i ka wā o ka deposition, e like me nā momona momona a me nā pūhui azole. Hāʻawi nā polymers organometallic i ke kūpaʻa corrosion e pono ai, ka hoʻopili ʻana o ke keleawe, a me ka paʻakikī o ka ʻili o OSP. Pono e ʻoi aku ka kiʻekiʻe o ka wela hoʻohaʻahaʻa o ka organometallic polymer ma mua o ka helu heheʻe o ka solder lead-free no ke kū ʻana i ke kaʻina alakaʻi ʻole. A i ʻole, e hoʻohaʻahaʻa ka kiʻiʻoniʻoni OSP ma hope o ka hana ʻia ʻana e kahi kaʻina alakaʻi ʻole. ʻO ka wela hoʻohaʻahaʻa o ka kiʻiʻoniʻoni OSP e hilinaʻi nui ʻia i ka pale wela o ka polymer organometallic. ʻO kekahi kumu koʻikoʻi e pili ana i ka pale ʻana o ka oxidation o ke keleawe, ʻo ia ka volatility o nā pūhui azole, e like me benzimidazole a me phenylimidazole. E hoʻoheheʻe ʻia nā ʻāpana liʻiliʻi o ka kiʻiʻoniʻoni OSP i ka wā o ke kaʻina hoʻihoʻi hou ʻole ke alakaʻi, e hoʻopilikia i ka pale ʻana o ke keleawe. Hiki ke hoʻohana ʻia ke kinoea chromatography-mass spectrometry (GC-MS), thermogravimetric analysis (TGA) a me photoelectron spectroscopy (XPS) e wehewehe ʻepekema i ke kū ʻana o ka wela o OSP.

1. Ke kinoea chromatography-mass spectrometry kālailai

Ua uhi ʻia nā pā keleawe i hoʻāʻo ʻia me: a) kahi kiʻiʻoniʻoni HTOSP hou; b) kahi kiʻiʻoniʻoni OSP maʻamau; a c) kekahi kiʻiʻoniʻoni OSP ʻoihana. E ʻoki ma kahi o 0.74-0.79 mg o ke kiʻi ʻoniʻoni OSP mai ka pā keleawe. ʻAʻole i hana ʻia kēia mau papa keleawe i uhi ʻia a me nā laʻana i ʻoki ʻia. Hoʻohana kēia hoʻokolohua i ka mea hana H/P6890GC/MS, a hoʻohana i ka syringe me ka ʻole o ka syringe. Hiki i nā syringe-free syringes ke hoʻopau pololei i nā laʻana paʻa i loko o ke keʻena hāpana. Hiki i ka syringe me ka syringe ke hoʻololi i ka hāpana i loko o ka pahu aniani liʻiliʻi i ka puka o ka chromatograph kinoea. Hiki i ke kinoea halihali ke lawe mau i nā mea hoʻohuihui kino i ke kolamu chromatograph kinoea no ka hōʻiliʻili ʻana a me ka hoʻokaʻawale ʻana. E kau i ka hāpana ma kahi kokoke i ka piko o ke kolamu i hiki ke hana hou ʻia ka wela wela. Ma hope o ka lawa ʻana o nā laʻana, hoʻomaka ka hana ʻana o ka chromatography kinoea. Ma kēia hoʻokolohua, ua hoʻohana ʻia kahi kolamu chromatography RestekRT-1 (0.25mmid×30m, mānoanoa kiʻiʻoniʻoni o 1.0μm). ʻO ka papahana piʻi wela o ke kolamu chromatography kinoea: Ma hope o ka hoʻomehana ʻana ma 35 ° C no 2 mau minuke, hoʻomaka ka mahana e piʻi i 325 ° C, a ʻo ka helu wela he 15 ° C / min. ʻO nā kūlana desorption thermal: ma hope o ka hoʻomehana ʻana ma 250 ° C no 2 mau minuke. ʻIke ʻia ka lakio nui / uku o nā mea hoʻohui i hoʻokaʻawale ʻia e ka spectrometry ma ka laulā o 10-700daltons. Hoʻopaʻa pū ʻia ka manawa paʻa o nā molekala liʻiliʻi liʻiliʻi.

2. Ka nānā ‘ana i ka Thermogravimetric (TGA)

Pēlā nō, ua uhi ʻia kahi kiʻiʻoniʻoni HTOSP hou, kahi kiʻiʻoniʻoni OSP maʻamau, a me kahi kiʻi ʻoniʻoni OSP ʻē aʻe i uhi ʻia ma nā laʻana. Ma kahi o 17.0 mg o ke kiʻiʻoniʻoni OSP i ʻoki ʻia mai ka pā keleawe ma ke ʻano he laʻana hoʻāʻo waiwai. Ma mua o ka ho’āʻo TGA, ʻaʻole hiki i ka hāpana a i ʻole ke kiʻiʻoniʻoni ke hana i kekahi lapaʻau hoʻihoʻi ʻole ke alakaʻi. E hoʻohana i ka TA Instruments ‘2950TA e hana i ka hoʻāʻo TGA ma lalo o ka pale nitrogen. Ua mālamaʻia ka mahana hana ma kahi lumi lumi no nā minuke 15, a laila hoʻonuiʻia i 700 ° C ma kahi o 10 ° C / min.

3. Kiʻi kiʻi kiʻi ʻoniʻoni (XPS)

ʻO ka Photoelectron Spectroscopy (XPS), i ʻike ʻia ʻo Chemical Analysis Electron Spectroscopy (ESCA), he ʻano loiloi ʻili kemika. Hiki i ka XPS ke ana i ka 10nm chemical composition o ka uhi uhi. E uhi i ke kiʻiʻoniʻoni HTOSP a me ke kiʻi ʻoniʻoni OSP maʻamau ma luna o ka pā keleawe, a laila e hele i loko o 5 mau kahe hou ʻole ke alakaʻi. Ua hoʻohana ʻia ʻo XPS no ka nānā ʻana i ke kiʻiʻoniʻoni HTOSP ma mua a ma hope o ka mālama ʻana i ka reflow. ʻO ke kiʻiʻoniʻoni OSP maʻamau ma hope o 5 mau alakaʻi-free reflow ua nānā pū ʻia e XPS. ʻO ka mea hana i hoʻohana ʻia ʻo VGESCALABMarkII.

4. Ma o ka ho’āʻo solderability hole

Ke hoʻohana nei i nā papa hoʻāʻo solderability (STVs) no ka hoʻāʻo solderability through-hole. He 10 ka nui o 4 solderability test board STV arrays (ʻo kēlā me kēia papa he 0.35 STVs) i uhi ʻia me kahi kiʻiʻoniʻoni ma kahi o 5μm, kahi o 5 STV arrays i uhi ʻia me ka kiʻi HTOSP, a ʻo nā 0 STV arrays i uhi ʻia me ka maʻamau o ka ʻoihana. Kiʻiʻoniʻoni OSP. A laila, loaʻa nā STV i uhi ʻia i kahi ʻano o ka wela kiʻekiʻe, ke alakaʻi ʻole i ka hoʻihoʻi hou ʻana i ka umu hoʻoheheʻe solder paste. Loaʻa i kēlā me kēia kūlana hoʻāʻo he 1, 3, 5, 7 a i ʻole 4 mau reflows. Aia he XNUMX STV no kēlā me kēia ʻano kiʻiʻoniʻoni no kēlā me kēia kūlana hoʻāʻo reflow. Ma hope o ka reflow kaʻina hana, nā STV a pau no ka kiʻekiʻe wela a me ke alakaʻi-noa nalu soldering. Hiki ke hoʻoholo ʻia ka solderability through-hole ma ka nānā ʻana i kēlā me kēia STV a me ka helu ʻana i ka helu o nā puka i hoʻopiha pono ʻia. ʻO ka ʻae ʻana no ka puka ʻana, pono e hoʻopiha ʻia ka solder i hoʻopiha ʻia a hiki i ka piko o ka plated ma o ka lua a i ʻole ka lihi o luna o ka lua.