He aha nā mea maikaʻi a me nā pōʻino o ke kaʻina hana o ka papa PCB?

Me ka hoʻomau mau ʻana o ka ʻepekema uila a me ka ʻenehana, PCB Ua hoʻololi nui ʻia ka ʻenehana, a pono e hoʻomaikaʻi ʻia ke kaʻina hana. I ka manawa like, ua hoʻomaikaʻi maikaʻi ʻia nā koi kaʻina no nā papa kaapuni PCB i kēlā me kēia ʻoihana. Eia kekahi laʻana, ma nā papa kaapuni o nā kelepona a me nā kamepiula, hoʻohanaʻia ke gula a me ke keleawe, kahi e maʻalahi ai kaʻikeʻana i nā pono a me nā pōʻino o nā papa kaapuni.

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E lawe i nā mea a pau e hoʻomaopopo i ka ʻenehana ili o ka papa PCB, a hoʻohālikelike i nā pono a me nā pōʻino a me nā hiʻohiʻona kūpono o nā kaʻina hana lapaʻau PCB papa.

Mai waho mai, ʻekolu kala o ka papa waho o ka papa kaapuni: ke gula, ke kālā, a me ka ʻulaʻula māmā. Hoʻokaʻawale ʻia e ke kumu kūʻai: ʻo ke gula ke kumu kūʻai nui loa, ʻo ke kālā ka lua, a ʻo ka ʻulaʻula māmā ka mea liʻiliʻi loa. ʻOiaʻiʻo, maʻalahi ka hoʻoholo ʻana mai ka waihoʻoluʻu inā e ʻoki ana nā mea hana lako. Eia naʻe, ʻo ka uea i loko o ka papa kaapuni he keleawe maʻemaʻe, ʻo ia hoʻi, ka papa keleawe ʻole.

1. Pā keleawe bare

ʻIke ʻia nā mea maikaʻi a me nā mea maikaʻi ʻole:

Nā pōmaikaʻi: ke kumu kūʻai haʻahaʻa, kahi ʻoluʻolu, hiki ke hoʻopaʻa maikaʻi ʻia (i ka loaʻa ʻole o ka hoʻohaʻahaʻa).

Nā pōʻino: He maʻalahi ke hoʻopili ʻia e ka waikawa a me ka haʻahaʻa a ʻaʻole hiki ke mālama ʻia no ka manawa lōʻihi. Pono e hoʻohana ʻia i loko o 2 mau hola ma hope o ka wehe ʻana, no ka mea ua maʻalahi ke keleawe i ka wā e ʻike ʻia ai i ka lewa; ʻAʻole hiki ke hoʻohana ʻia no nā papa ʻaoʻao ʻelua no ka mea ʻo ka ʻaoʻao ʻelua ma hope o ka hoʻoheheʻe hou ʻana mua Ua oxidized. Inā loaʻa kahi helu hoʻāʻo, pono e paʻi ʻia ka solder paste i mea e pale ai i ka oxidation, inā ʻaʻole ia e pili maikaʻi me ka probe.

He mea maʻalahi ke keleawe maʻemaʻe inā ʻike ʻia i ka lewa, a pono e loaʻa i ka ʻaoʻao waho ka papa pale i ʻōlelo ʻia ma luna. A manaʻo kekahi poʻe he keleawe ka melemele gula, he hewa ia no ka mea ʻo ia ka pale pale ma ke keleawe. No laila, pono e hoʻopaʻa i kahi wahi gula nui ma ka papa kaapuni, ʻo ia ke kaʻina gula immersion aʻu i aʻo ai iā ʻoe ma mua.

ʻO ka lua, ʻo ka pā gula

He gula maoli ke gula. ʻOiai ʻo kahi ʻāpana lahilahi wale nō i hoʻopaʻa ʻia, ʻo ia ka mea ma kahi o 10% o ke kumukūʻai o ka papa kaapuni. Ma Shenzhen, nui nā mea kālepa e kūʻai i nā papa kaapuni ʻōpala. Hiki iā lākou ke holoi i ke gula ma o kekahi mau ala, ʻo ia ka loaʻa kālā maikaʻi.

E hoʻohana i ke gula ma ke ʻano he papa plating, ʻo kekahi e hoʻomaʻamaʻa i ka wili, a ʻo kekahi e pale i ka corrosion. ʻOiai ʻo ka manamana gula o ka lāʻau hoʻomanaʻo i hoʻohana ʻia no kekahi mau makahiki e paʻa mau ana e like me ka wā ma mua. Inā hoʻohana mua ʻia ke keleawe, ka aluminika, a me ka hao, ua ʻeleʻele lākou i loko o kahi puʻu ʻōpala.

Hoʻohana nui ʻia ka papa i uhi ʻia i ke gula i nā pads component, nā manamana gula, a me nā shrapnel connector o ka papa kaapuni. Inā ʻike ʻoe he kālā maoli ka papa kaapuni, hele me ka ʻōlelo ʻole. Inā kāhea pololei ʻoe i ka hotline pono mea kūʻai aku, pono ka mea hana e ʻoki i nā kihi, ʻaʻole hoʻohana pono i nā mea, a me ka hoʻohana ʻana i nā metala ʻē aʻe e hoʻopunipuni i nā mea kūʻai. ʻO nā papa makuahine o nā papa kaapuni kelepona paʻa i hoʻohana nui ʻia, ʻo ia ka hapa nui o nā papa gula, nā papa gula i hoʻopaʻa ʻia, nā motherboards kamepiula, nā leo a me nā papa kaapuni kikohoʻe liʻiliʻi ʻaʻole nā ​​​​papa gula.

ʻAʻole paʻakikī ke kaha kiʻi i nā pono a me nā pōʻino o ka ʻenehana gula immersion:

Pōmaikaʻi: ʻAʻole maʻalahi ka oxidize, hiki ke mālama ʻia no ka manawa lōʻihi, a palahalaha ka ʻili, kūpono no ka wili ʻana i nā pine liʻiliʻi a me nā ʻāpana me nā hui solder liʻiliʻi. ʻO ka koho mua o nā papa PCB me nā pihi (e like me nā papa kelepona paʻa). Hiki ke hana hou ʻia ka hoʻoheheʻe ʻana i nā manawa he nui me ka hōʻemi ʻole ʻana i kona solderability. Hiki ke hoʻohana ʻia ma ke ʻano he substrate no ka hoʻopili uea COB (ChipOnBoard).

Nā hemahema: ke kumu kūʻai kiʻekiʻe, ka ikaika wiliwili maikaʻi ʻole, no ka mea, hoʻohana ʻia ke kaʻina hana electroless nickel plating, maʻalahi ka pilikia o ka disk ʻeleʻele. E oxidize ka papa nickel i ka manawa, a he pilikia ka hilinaʻi lōʻihi.

I kēia manawa ua ʻike mākou he gula ke gula a he kālā ke kālā? ʻAʻole naʻe, he tini.

ʻEkolu, kāpī kaapuni kaapuni

Ua kapa ʻia ka papa kālā ʻo ka papa pāpaʻi. ʻO ka pīpī ʻana i kahi papa o ka pī ma ka ʻaoʻao o waho o ke kaapuni keleawe hiki ke kōkua pū i ke kūʻai ʻana. Akā ʻaʻole hiki ke hāʻawi i ka hilinaʻi pili lōʻihi e like me ke gula. ʻAʻohe hopena i nā mea i hoʻopili ʻia, akā ʻaʻole lawa ka hilinaʻi no nā pads i hōʻike ʻia i ka lewa no ka manawa lōʻihi, e like me nā papa lepo a me nā kumu pine. Hiki ke hoʻohana lōʻihi i ka oxidation a me ka corrosion, ka hopena o ka pilina maikaʻi ʻole. Hoʻohana nui ʻia e like me ka papa kaapuni o nā huahana kikohoʻe liʻiliʻi, me ka ʻole, ʻo ka spray tin board, ʻo ke kumu he ʻuʻuku.

Ua hōʻuluʻulu ʻia kona mau pono a me nā pōʻino e like me:

Pōmaikaʻi: kumu kūʻai haʻahaʻa a me ka hana kuʻi maikaʻi.

Nā pōʻino: ʻAʻole kūpono no ka hoʻopaʻa ʻana i nā pine me nā āpau maikaʻi a me nā mea liʻiliʻi liʻiliʻi, no ka mea, ʻaʻole maikaʻi ka palahalaha o ka ʻili. Hiki ke hana ʻia nā peʻa solder i ka wā o ka hana PCB, a ʻoi aku ka maʻalahi o ka hana ʻana i nā pōkole pōkole i nā ʻāpana pitch maikaʻi. Ke hoʻohana ʻia i ke kaʻina hana SMT ʻaoʻao ʻelua, no ka mea ua loaʻa ka lua o ka ʻaoʻao i kahi kiʻekiʻe-mehana reflow soldering, he mea maʻalahi loa ka pīpī ʻana i ka tin a hoʻoheheʻe hou ʻia, ka hopena i nā pahu tin a i ʻole nā ​​​​droplets like i hoʻopili ʻia e ka umekaumaha i loko o ka tin spherical. nā kiko, e ʻoi aku ka ʻino o ka ʻili. Hoʻopili ka palahalaha i nā pilikia wili.

Ma mua o ka kamaʻilio ʻana e pili ana i ka papa kaapuni ʻulaʻula māmā loa, ʻo ia hoʻi, ke kukui thermoelectric separation copper substrate.

ʻEhā, papa hana OSP

Kiʻiʻoniʻoni hoʻoheheʻe organik. No ka mea, ʻo ia ka mea kūlohelohe, ʻaʻole metala, ʻoi aku ka maikaʻi ma mua o ka pulupulu ʻana.

Pōmaikaʻi: Loaʻa iā ia nā mea maikaʻi a pau o ka hoʻoheheʻe ʻia ʻana o ka pā keleawe ʻole, a hiki ke mālama hou ʻia ka papa i hala.

Nā pōʻino: hiki ke hoʻopilikia ʻia e ka waikawa a me ka haʻahaʻa. Ke hoʻohana ʻia i ka lua reflow soldering, pono e hoʻopau ʻia i loko o kekahi manawa, a maʻamau ka hopena o ka lua reflow soldering e ʻilihune. Inā ʻoi aku ka lōʻihi o ka mālama ʻana i ʻekolu mahina, pono e hoʻāla hou ʻia. Pono e hoʻohana ʻia i loko o 24 mau hola ma hope o ka wehe ʻana i ka pūʻolo. He papa insulating ka OSP, no laila, pono e paʻi ʻia ka wahi hoʻāʻo me ka solder paste e wehe i ka papa OSP mua ma mua o ka hiki ke hoʻopili i ke kiko pine no ka hoʻāʻo uila.

ʻO ka hana wale nō o kēia kiʻiʻoniʻoni kūlohelohe ʻo ia ka hōʻoia ʻana ʻaʻole e hoʻoheheʻe ʻia ka foil keleawe o loko ma mua o ke kuʻi ʻana. ʻO kēia papa o ke kiʻiʻoniʻoni volatilizes i ka wā e wela ai i ka wā welding. Hiki i ka solder ke wili i ka uwea keleawe a me nā ʻāpana.

Akā ʻaʻole ia e kū i ka corrosion. Inā ʻike ʻia kahi papa kaapuni OSP i ka lewa no nā lā he ʻumi, ʻaʻole hiki ke hoʻopili ʻia nā ʻāpana.

Nui nā motherboards kamepiula e hoʻohana i ka ʻenehana OSP. No ka mea he nui loa ka ʻāpana o ka papa kaapuni, ʻaʻole hiki ke hoʻohana ʻia no ka uhi gula.