Ka papa helu o nā kumu no ka ʻilihune PCB ka penaʻana

1. Puka

ʻO nā pinholes ma muli o ka hydrogen adsorbed ma ka ʻili o nā ʻāpana plated, a ʻaʻole i hoʻokuʻu ʻia no ka manawa lōʻihi. E hoʻomālu i ka ʻili o nā ʻāpana i hoʻopaʻa ʻia, i hiki ʻole ke hoʻopaʻa ʻia ka papa hoʻopalapala. I ka piʻi ʻana o ka mānoanoa o ka uhi ʻana ma ka wahi a puni ke kiko hoʻololi hydrogen, ua hoʻokumu ʻia kahi pinhole ma ke kiko hoʻololi hydrogen. Hōʻike ʻia ʻo ia me ka puka poepoe ʻālohilohi a i kekahi manawa he huelo liʻiliʻi i luna. Ke nele ka mea hoʻoheheʻe plating a kiʻekiʻe ka nui o kēia manawa, maʻalahi ka hana ʻana i nā pinhole.

2. Pockmark

Hoʻokumu ʻia ka lua e ka ʻili maʻemaʻe o ka ʻili i hoʻopaʻa ʻia, ka adsorption o ka mea paʻa, a i ʻole ka hoʻokuʻu ʻia ʻana o ka mea paʻa i loko o ka hopena plating. Ke hiki i ka ili o ka workpiece ma lalo o ka hana o ka uila kahua, ua adsorbed ma luna o ia, e pili ana i ka electrolysis a hoʻokomo i kēia mau mea paʻa i loko o I loko o ka electroplating papa, liʻiliʻi bumps (lua). ʻO ka hiʻohiʻona he convex, ʻaʻohe mea ʻālohilohi, ʻaʻohe ʻano paʻa. I ka pōkole, kumu ia e ka mea hana lepo a me ka hoʻonā plating lepo.

3. ʻO nā kaha ea

ʻO ke kahe o ka ea ma muli o nā mea hoʻohui kiʻekiʻe a i ʻole ka cathode kiʻekiʻe o kēia manawa a i ʻole ka mea paʻakikī kiʻekiʻe, e hōʻemi ana i ka pono o ka cathode i kēia manawa, ka hopena i ka nui o ka hydrogen evolution. Inā e kahe mālie ana ka hoʻonā plating a neʻe mālie ka cathode, e hoʻopili ke kinoea hydrogen i ka hoʻonohonoho ʻana o nā kristal electrolytic i ka wā e piʻi ai i ka ʻili o ka mea hana, e hana ana i nā kaha kahe mai lalo a i luna.

4. Ka huna huna (hōʻike ʻia)

ʻO ka masking no ka mea ʻaʻole i wehe ʻia ka uila palupalu ma nā pine ma ka ʻili o ka mea hana, a ʻaʻole hiki ke hoʻokō ʻia ka uhi electrolytic deposition. ʻIke ʻia ka mea kumu ma hope o ka electroplating, no laila ua kapa ʻia ʻo ia e hōʻike ʻia (no ka mea, ʻo ka uila palupalu he mea translucent a i ʻole ka transparent resin component).

5. He palupalu ka uhi

Ma hope o ka SMD electroplating, ma hope o kaʻokiʻana i nā iwiʻaoʻao a me ka hanaʻana, hiki keʻikeʻia he mau māwae ma nā piko o nā pine. Ke loaʻa kahi māwae ma waena o ka papa nickel a me ka substrate, ua hoʻoholo ʻia he brittle ka papa nickel. Ke loaʻa ka māwae ma waena o ka papa pīni a me ka papa nickel, ua manaʻo ʻia he palupalu ka papa tin. ʻO ke kumu o ka brittleness ka hapa nui o nā mea hoʻohui, nā mea hoʻomālamalama nui, a i ʻole ka nui o nā haumia inorganic a i ʻole nā ​​​​mea hoʻomaʻemaʻe i loko o ka hopena plating.