He aha ke kumu o ka uhi gula ma pcb?

1. PCB kūlana maʻamau:

Anti-oxidation, tin spray, lead-free tin spray, immersion gula, immersion tin, immersion silver, hard gold plateing, piha papa gula pale, gula manamana lima, nickel palladium gula OSP: kumu kūʻai haʻahaʻa, solderability maikaʻi, nā kūlana mālama paʻakikī, manawa Pōkole, ʻenehana pili kaiapuni, maikaʻi kuʻihao a laumania.

ʻO ka pā pāpaʻi: ʻO ka pā pāpaʻi pahu he multilayer (4-46 layer) kiʻekiʻe kiʻekiʻe PCB kumu hoʻohālike, i hoʻohana ʻia e nā kamaʻilio kūloko nui, kamepiula, nā mea lapaʻau a me nā ʻoihana aerospace a me nā ʻāpana noiʻi. ʻO ka manamana gula (manamana hoʻohui) ʻo ia ka ʻāpana hoʻohui ma waena o ka pahu hoʻomanaʻo a me ka slot hoʻomanaʻo, hoʻouna ʻia nā hōʻailona āpau ma o nā manamana gula.

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Hoʻokumu ʻia ka manamana gula me nā mea hoʻopili conductive melemele gula he nui. No ka mea he gula-plated ka ʻili a ua hoʻonohonoho ʻia nā pilina conductive e like me nā manamana lima, ua kapa ʻia ʻo ia “manamana gula”.

Hoʻopili maoli ʻia ka manamana gula me kahi papa gula ma ka papa keleawe ma o ke kaʻina hana kūikawā, no ka mea, ʻoi aku ka pale o ke gula i ka oxidation a me ka conductivity ikaika.

Eia nō naʻe, ma muli o ke kumukūʻai kiʻekiʻe o ke gula, ua hoʻololi ʻia ka hapa nui o ka hoʻomanaʻo ʻana e ka paʻi tin. Mai ka 1990s, ua hoʻolaha ʻia nā mea tin. I kēia manawa, hoʻohana ʻia nā “manamana gula” o nā motherboards, ka hoʻomanaʻo a me nā kāleka kiʻi. ʻO nā mea tin, ʻo kahi hapa wale nō o nā wahi pili o nā kikowaena hana kiʻekiʻe / hana e hoʻomau ʻia i ke gula-plated, he kumu kūʻai maoli.

2. No ke aha e hoʻohana ai i nā papa gula

Ke piʻi aʻe a kiʻekiʻe ka pae hoʻohui o IC, ʻoi aku ka paʻa o nā pine IC. He mea paʻakikī ke kaʻina hana pāpaʻi kuʻekuʻe e hoʻopalapala i nā pad lahilahi, kahi e pilikia ai ke kau ʻana o SMT; Eia kekahi, pōkole loa ke ola o ka pā pāpaʻi.

Hoʻopau wale ka papa gula i kēia mau pilikia:

1. No ka ‘ilikai mauna kaʻina, o ka oi aku no ka 0603 a me 0402 ultra-liʻiliʻi ili mau mauna, no ka mea, o ka palahalaha o ka pa i pili pono i ka maikai o ka solder paste kaʻina paʻi, he decisive mana i ka maikaʻi o ka reflow hope. soldering, no laila ka papa holoʻokoʻa Gold plating mea maʻamau i kiʻekiʻe-density a me ka ultra-liʻiliʻi ili mauna kaʻina.

2. Ma ka hana ho’āʻo ʻana, ma muli o nā kumu e like me ke kūʻai ʻana i nā ʻāpana, ʻaʻole pinepine ʻia ka papa i kūʻai koke ʻia i ka wā e hiki mai ai, akā hoʻohana pinepine ʻia no kekahi mau pule a i ʻole mau mahina. ʻOi aku ka maikaʻi o ke ola o ka papa gula ma mua o ke kēpau. ʻOi aku ka lōʻihi o ka alloy tin, no laila hauʻoli nā mea a pau e hoʻohana.

Ma waho aʻe, ʻo ke kumu kūʻai o ka PCB i uhi ʻia i ke gula ma ke kahua hoʻohālike ua aneane like me ka papa alakaʻi.

Akā i ka lilo ʻana o ka wili, ua hiki ka laulā laina a me ka spacing i 3-4MIL.

No laila, lawe ʻia ka pilikia o ka uea gula kaapuni pōkole: ʻoiai ke piʻi aʻe a kiʻekiʻe ka alapine o ka hōʻailona, ​​​​ʻo ka hoʻouna ʻana i ka hōʻailona ma ka papa multi-plated i hoʻokumu ʻia e ka hopena ʻili i ʻoi aku ka mana o ka maikaʻi o ka hōʻailona.

ʻO ka hopena o ka ʻili e pili ana i: ke alapine kiʻekiʻe alternating current, ke ʻano o kēia manawa e noʻonoʻo i ka ʻili o ka uea e kahe. E like me ka helu ʻana, pili ka hohonu o ka ʻili i ka pinepine.

I mea e hoʻoponopono ai i nā pilikia ma luna o nā papa gula-plated, nā PCB e hoʻohana ana i nā papa gula-plated ka nui o nā ʻano aʻe:

1. No ka mea, ʻokoʻa ka hale aniani i hoʻokumu ʻia e ke gula immersion a me ka uhi gula, e ʻoi aku ka melemele gula o ke gula ma mua o ka uhi gula, a ʻoi aku ka māʻona o nā mea kūʻai aku.

2. ʻOi aku ka maʻalahi o ka hoʻopaʻa ʻana i ke gula ma mua o ka uhi ʻana i ke gula, ʻaʻole ia e hoʻopiʻi maikaʻi ʻole a hoʻopiʻi i nā mea kūʻai aku.

3. No ka mea, he nickel a me ke gula wale nō ka papa gula immersion ma ka pad, ʻaʻole e hoʻopili ka hoʻouna ʻana i ka hōʻailona i ka hopena o ka ʻili i ka hōʻailona ma ka papa keleawe.

4. No ka mea, ʻoi aku ka ʻoi aku o ka ʻoi aku o ke gula immersion ma mua o ka uhi gula, ʻaʻole maʻalahi ka hana ʻana i ka oxidation.

5. No ka mea, he nickel a me ke gula wale nō ka papa gula kaiapuni ma nā pads, ʻaʻole ia e hana i nā uwea gula a hoʻopōkole iki.

6. No ka mea, ʻo ka nickel a me ke gula wale nō ka papa gula i loko o nā pads, ʻoi aku ka paʻa o ka solder mask ma ke kaapuni a me ka papa keleawe.

7. ʻAʻole pili ka papahana i ka mamao i ka wā e hana ai i ka uku.

8. No ka mea, ʻokoʻa ke ʻano aniani i hana ʻia e ke gula immersion a me ka uhi gula, ʻoi aku ka maʻalahi o ke koʻikoʻi o ka pā gula immersion, a no nā huahana me ka hoʻopaʻa ʻana, ʻoi aku ka maikaʻi o ka hoʻopili ʻana. I ka manawa like, no ka mea ʻoi aku ka palupalu o ke gula immersion ma mua o ka gilding, no laila ʻaʻole paʻa ka pā gula immersion e like me ka manamana gula.

9. ʻO ka palahalaha a me ke ola kūpaʻa o ka papa gula immersion e like me ka papa gula i uhi ʻia.

No ke kaʻina hana gilding, hoʻemi nui ʻia ka hopena o ka tinning, ʻoiai ʻoi aku ka maikaʻi o ka hopena tinning o ke gula immersion; Inā ʻaʻole pono ka mea hana e hoʻopaʻa, e koho ka hapa nui o nā mea hana i ke kaʻina gula immersion, ka mea maʻamau Ma lalo o nā kūlana, ʻo ka mālama ʻana o ka PCB surface penei:

Ka uhi gula (electroplating gula, immersion gula), kala kala, OSP, tin spraying (leaded and lead-free).

ʻO kēia mau ʻano no ka FR-4 a i ʻole CEM-3 a me nā papa ʻē aʻe. ʻO ka waihona kumu pepa a me ke ʻano o ka mālama ʻana i ka ʻili o ka rosin coating; inā ʻaʻole maikaʻi ke kī (ʻai ʻino i ka pā), inā ʻaʻole i hoʻokomo ʻia ka paʻi solder a me nā mea hana papa ʻē aʻe No nā kumu o ka hana ʻana a me ka ʻenehana waiwai.

Eia wale no ka pilikia PCB, aia na kumu penei:

1. I ka paʻi ʻana o ka PCB, inā he ʻili kiʻi ʻaila-permeable ma ke kūlana PAN, hiki ke pale i ka hopena o ka tinning; hiki ke hōʻoia ʻia kēia me ka hoʻāʻo ʻana i ka bleaching tin.

2. Inā kūpono ke kūlana lubrication o ke kūlana PAN i nā koi hoʻolālā, ʻo ia hoʻi, hiki ke hōʻoia ʻia ka hana kākoʻo o ka ʻāpana i ka wā o ka hoʻolālā ʻana o ka pad.

3. Inā haumia ka pad, hiki ke loaʻa kēia ma ka hoʻāʻo ʻana i ka pollution ion; ʻO nā helu ʻekolu ma luna nei ke kumu nui i manaʻo ʻia e nā mea hana PCB.

E pili ana i nā pono a me nā pōʻino o kekahi mau ʻano o ka mālama ʻana i ka ʻili, ua loaʻa i kēlā me kēia me kona mau ikaika a me nā nāwaliwali!

Ma ke ‘ano o ka pale gula, hiki ke malama i ka PCB no ka manawa loihi, a hiki ke hoololi iki i ka wela a me ka ha’aha’a o ke kaiapuni o waho (i ka ho’ohālikelike ‘ia me na lapaau ‘ē a’e), a hiki ke mālama ‘ia no ho’okahi makahiki; ʻO ka lua o ka lāʻau lapaʻau tin-sprayed, ʻo OSP hou, ʻo kēia A nui ka nānā ʻana e uku ʻia i ka manawa mālama o nā mālama ʻili ʻelua i ka mahana a me ka haʻahaʻa.

Ma lalo o nā kūlana maʻamau, ʻokoʻa iki ka mālama ʻana o ke kālā immersion, ʻoi aku ka kiʻekiʻe o ke kumukūʻai, a ʻoi aku ka koi o nā kūlana mālama, no laila pono e hoʻopili ʻia i ka pepa sulfur-free! A ʻo ʻekolu mahina ka manawa mālama! Ma ke ʻano o ka hopena o ka tinning, ke gula immersion, OSP, tin spraying, a me nā mea ʻē aʻe he like maoli nō, a noʻonoʻo nui nā mea hana i ka uku-effectiveness!