He aha ka papa PCB HDI (High Density Interconnect)?

High Density Interconnect (HDI) PCB, he ʻano o ka paʻi ʻia ʻana o ka papa kaapuni (ʻenehana), ka hoʻohana ʻana i ka lua micro-blind, ʻenehana lua kanu, kahi papa kaapuni me ka puʻupuʻu kiʻekiʻe. Ma muli o ka hoʻomau mau ʻana o ka ʻenehana no nā koi uila hōʻailona kiʻekiʻe, pono ka papa kaapuni e hāʻawi i ka mana impedance me nā ʻano ac, hiki ke hoʻouna i nā alapine kiʻekiʻe, hoʻemi i ka radiation pono ʻole (EMI) a pēlā aku. Ke hoʻohana nei i ka Stripline, ka hoʻolālā Microstrip, pono ka hoʻolālā multi-layer. I mea e hōʻemi ai i ka pilikia maikaʻi o ka hoʻouna ʻana i ka hōʻailona, ​​​​e lawe ʻia ka mea insulation me ka dielectric coefficient haʻahaʻa a me ka helu attenuation haʻahaʻa. I mea e hoʻohālikelike ai i ka miniaturization a me nā ʻāpana uila, e hoʻonui mau ʻia ka nui o ka papa kaapuni e hoʻokō i ka koi.

ʻO ka HDI (high density interconnection) ka papa kaapuni maʻamau ka puka makapō laser a me ka puka makapō mechanical;
ʻO ka maʻamau ma o ka lua i kanu ʻia, ka puka makapō, ka lua overlapping, ka lua staggered, ka lua i kanu ʻia, ma ka lua, ka puka makapō hoʻopiha electroplating, ka laina liʻiliʻi liʻiliʻi liʻiliʻi, ka microhole plate a me nā kaʻina hana ʻē aʻe e hoʻokō ai i ka conduction ma waena o nā papa o loko a me waho, maʻamau ka makapō. ʻAʻole ʻoi aku ka nui o ke anawaena ma mua o 6mil.

Hoʻokaʻawale ʻia ka papa kaapuni HDI i nā ʻāpana like ʻole

ʻO ka papa hana HDI kauoha mua: 1+N+1 (ke kaomi ʻana i ʻelua manawa, laser hoʻokahi)

ʻO ka papa hana HDI ʻelua: 2+N+2 (ke kaomi ʻana no 3 mau manawa, laser no 2 mau manawa)

ʻO ke kolu o ka papa hana HDI: 3+N+3 (ke kaomi ʻana i 4 mau manawa, laser 3 mau manawa) ʻEhā kauoha.

HDI structure: 4+N+4 (pressing 5 times, laser 4 times)

A me kēlā me kēia ʻāpana HDI