Alumina Ceramic PCB

He aha nā mea kiko’ī o ka alumina ceramic substrate

I ka PCB proofing, alumina ceramic substrate ua hoʻohana nui ʻia i nā ʻoihana he nui. Eia nō naʻe, i nā noi kikoʻī, ʻokoʻa ka mānoanoa a me nā kikoʻī o kēlā me kēia alumina ceramic substrate. He aha ke kumu o kēia?

1. Hoʻoholo ʻia ka mānoanoa o ka alumina ceramic substrate e like me ka hana o ka huahana
ʻOi aku ka mānoanoa o ka alumina ceramic substrate, ʻoi aku ka maikaʻi o ka ikaika a ʻoi aku ka ikaika o ka pale ʻana i ke kaomi, akā ʻoi aku ka maikaʻi o ka conductivity thermal ma mua o ka mea lahilahi; ʻO ka mea ʻē aʻe, ʻoi aku ka lahilahi o ka alumina ceramic substrate, ʻaʻole ikaika ka ikaika a me ke kūpaʻa ʻana i ke kaomi e like me ka mānoanoa, akā ʻoi aku ka ikaika o ka conductivity thermal ma mua o nā mānoanoa. ʻO ka mānoanoa o ka alumina ceramic substrate he 0.254mm, 0.385mm a me 1.0mm/2.0mm/3.0mm/4.0 Mm, etc.

2. ʻOkoʻa nō hoʻi nā kikoʻī a me nā nui o nā substrates ceramic alumina
ʻO ka maʻamau, ʻoi aku ka liʻiliʻi o ka substrate ceramic alumina ma mua o ka papa PCB maʻamau ma ke ʻano holoʻokoʻa, a ʻo kona nui ʻaʻole i ʻoi aku ma mua o 120mmx120mm. Pono e hoʻopilikino ʻia nā mea i ʻoi aku ma mua o kēia nui. Eia kekahi, ʻaʻole ʻoi aku ka maikaʻi o ka nui o ka alumina ceramic substrate, no ka mea, ua hana ʻia kāna substrate i nā seramika. I ke kaʻina hana o ka PCB proofing, he mea maʻalahi ke alakaʻi i ka ʻāpana pā, ka hopena i ka nui o ka ʻōpala.

3. He okoa ke ano o ka alumina ceramic substrate
ʻO ka hapa nui o nā pāpaʻi seramika alumina he papa hoʻokahi a ʻelua ʻaoʻao, me nā ʻano ʻāpana ʻehā, ʻāpana a me nā ʻano pōʻai. I ka hōʻoia ʻana o ka PCB, e like me ke kaʻina hana, pono kekahi e hana i nā grooves ma ke kaʻina ceramic substrate a me ke kaʻina hana dam.

ʻO nā hiʻohiʻona o ka alumina ceramic substrate ka:
1. Ke koʻikoʻi ikaika a me ke ʻano paʻa; Ka ikaika kiʻekiʻe, kiʻekiʻe thermal conductivity a me ka insulation kiʻekiʻe; ʻO ka pili ikaika a me ka anti-corrosion.
2. Hana maikaʻi ka pōʻai wela, me 50000 cycles a me ka hilinaʻi kiʻekiʻe.
3. E like me ka papa PCB (a i ʻole IMS substrate), hiki iā ia ke kālai i ke ʻano o nā kiʻi like ʻole; ʻAʻohe pollution a me ka pollution.
4. Hoʻohana wela wela: – 55 ℃ ~ 850 ℃; ʻO ka coefficient o ka hoʻonui wela e kokoke ana i ke silika, e hoʻomaʻamaʻa i ke kaʻina hana o ka module mana.

He aha nā mea maikaʻi o ka alumina ceramic substrate?
A. ʻO ke koena hoʻonui wela o ka substrate ceramic kokoke i ka chip silicon chip, hiki ke mālama i ka papa hoʻololi Mo chip, mālama i ka hana, nā mea a me ka hoʻemi ʻana i ke kumukūʻai;
B. Welding layer, ho’ēmi i ka pale wela, ho’ēmi i ka lua a hoʻonui i ka hua;
C. ʻO ka laulā laina o 0.3mm mānoanoa keleawe pepa he 10% wale nō ia o ka papa kaapuni paʻi maʻamau;
D. ʻO ka thermal conductivity o ka puʻupuʻu e hana i ka puʻupuʻu o ka puʻupuʻu i mea paʻa loa, kahi e hoʻomaikaʻi nui ai i ka nui o ka mana a hoʻomaikaʻi i ka hilinaʻi o ka ʻōnaehana a me ka mea hana;
E. Type (0.25mm) ceramic substrate hiki ke hoʻololi i ka BeO me ka ʻole o ke kaiapuni;
F. Nui, 100A kēia manawa e hele mau ana ma 1mm ākea a me 0.3mm manoanoa kino keleawe, a ʻo ka piʻi ʻana o ka wela ma kahi o 17 ℃; ʻO 100A ke hele mau nei i ka 2mm ākea a me 0.3mm mānoanoa kino keleawe, a ʻo ka piʻi ʻana o ka mahana ma kahi o 5 ℃ wale nō;
G. Haʻahaʻa, 10 × ʻO ke kūpaʻa wela o ka 10mm seramika substrate, 0.63mm mānoanoa ceramic substrate, 0.31k/w, 0.38mm mānoanoa ceramic substrate a me 0.14k/w pākahi;
H. Ke kūpale kiʻekiʻe kiʻekiʻe, e hōʻoia i ka palekana pilikino a me ka hiki ke pale i nā lako;
1. E hoʻomaopopo i nā ʻano hōʻailona hou a me nā ʻano hui, i hui pū ʻia nā huahana a hoʻemi ʻia ka nui.