Ma PCB, hoʻohana ʻia ka nickel ma ke ʻano he substrate coating o nā metala makamae a kumu. I ka manawa like, no kekahi mau papa paʻi ʻaoʻao hoʻokahi, hoʻohana maʻamau ʻia ka nickel e like me ka papa honua. A laila, e kaʻana aku au iā ʻoe i nā ʻāpana o PCB hoʻoheheʻe nickel plating

1. ʻO ka paʻakai nui: nickel sulfamate a me nickel sulfate nā paʻakai nui i loko nickel solution, ka mea nui e hāʻawi i nā ion nickel metala e pono ai no ka nickel plating a ke pāʻani nei hoʻi i ka hana o ka paʻakai conductive. Me ka maʻiʻo paʻakai nickel kiʻekiʻe, hiki ke hoʻohana ʻia ke kiʻekiʻe cathode kiʻekiʻe, a wikiwiki ka wikiwiki o ka deposition. Hoʻohana maʻamau ia no ka paʻi nickel mānoanoa kiʻekiʻe. ʻO ka haʻahaʻa haʻahaʻa o ka paʻakai nickel e alakaʻi i ka haʻahaʻa deposition rate, akā maikaʻi loa ka hiki ke hoʻopuehu, a hiki ke loaʻa nā uhi crystalline maikaʻi a ʻālohilohi.

2. Buffer: hoʻohana ʻia ka waika boric ma ke ʻano he pale e mālama i ka waiwai pH o ka hopena nickel plating i loko o kahi ākea. ʻAʻole wale ʻo Boric acid ka hana o ka pH buffer, akā hiki ke hoʻomaikaʻi i ka polarization cathodic, i mea e hoʻomaikaʻi ai i ka hana o ka ʻauʻau.

3. Anode activator: nickel anode mea maʻalahi e passivate i ka mana ma. I mea e hōʻoia ai i ka hoʻoheheʻe maʻamau o ka anode, ua hoʻohui ʻia kahi nui o ka anode activator i ka hopena plating.

4. Hoʻohui: ʻo ka mea nui o ka mea hoʻohui he mea hoʻoluhi koʻikoʻi. ʻO nā mea hoʻohui maʻamau ka naphthalene sulfonic acid, p-toluenesulfonamide, saccharin, etc.

5. Wetting agent: i mea e hōʻemi ai a pale aku paha i ka hana ʻana o nā pinholes, pono e hoʻohui ʻia kahi mea liʻiliʻi o ka mea hoʻomaʻemaʻe i ka hopena plating, e like me ka sodium dodecyl sulfate, sodium diethylhexyl sulfate, sodium octyl sulfate, etc.