Nā mea hana paʻa paʻa: hoʻolauna iā BT, ABF a me MIS

1. Kēpau BT
ʻO ka inoa piha o ka resin BT “bismaleimide triazine resin”, i hoʻomohala ʻia e Mitsubishi Gas Company o Iapana. ʻOiai ua hala ka manawa o ka patent o ka resin BT, aia nō ke Mitsubishi Gas Company i ke kūlana alakaʻi i ka honua i ka R & D a me ka noi o ka resin BT. He nui nā pōmaikaʻi o ka BT resin e like me ke kiʻekiʻe Tg, ke kūpaʻa wela nui, ke kūpaʻa o ka wai, ke kūmau dielectric haʻahaʻa (DK) a me ke kumu haʻahaʻa haʻahaʻa (DF). Eia nō naʻe, ma muli o ka pale wili pulupulu aniani, ʻoi aku ka paʻakikī ma mua o ka substrate FC i hana ʻia o ABF, nā uea pilikia a me ka paʻakikī kiʻekiʻe i ka ʻeli ʻana i ka laser, ʻaʻole hiki ke hoʻokō i nā koi o nā laina maikaʻi, akā hiki iā ia ke hoʻopaʻa i ka nui a pale i ka hoʻonui ʻana o ka wela. a me ke anuanu e hoʻoliʻiliʻi mai ka hopena ʻana i ka hua o ka laina, No laila, hoʻohana ʻia nā mea BT no ka ʻāpana pūnaewele a me nā ʻōpala logic programmable me nā koina pono kiʻekiʻe. I kēia manawa, hoʻohana nui ʻia nā substrates BT i nā ʻāpana kelepona MEMS kelepona, nā ʻāpana kamaʻilio, nā ʻāpana hoʻomanaʻo a me nā huahana ʻē aʻe. Me ka hoʻomohala wikiwiki o nā ʻāpana LED, ke ulu wikiwiki nei ka noi o nā substrates BT i ka ʻāpana chip chip LED.

2 、ABF
ʻO ABF kahi mea i alakaʻi ʻia a hoʻomohala ʻia e Intel, i hoʻohana ʻia no ka hana ʻana i nā papa lawe pae kiʻekiʻe e like me ka chip flip. Hoʻohālikelike ʻia me ka substrate BT, hiki ke hoʻohana ʻia nā mea ABF e like me IC me ke kaapuni lahilahi a kūpono no ka helu pin kiʻekiʻe a me ka lawe kiʻekiʻe. Hoʻohana nui ʻia ia no nā ʻāpana kiʻekiʻe kiʻekiʻe loa e like me CPU, GPU a me ka set chip. Hoʻohana ʻia ʻo ABF ma ke ʻano he mea papa. Hiki ke hoʻopili pololei ʻia ʻo ABF i ka mea keleawe fox substrate ma ke ʻano he kaapuni me ka ʻole o ke kaʻina hana pāhana. I ka wā ma mua, loaʻa i ka abffc ka pilikia o ka mānoanoa. Eia nō naʻe, ma muli o ka ʻenehana hou aʻe o ka substrate keleawe keleawe, hiki i ka abffc ke hoʻoponopono i ka pilikia o ka mānoanoa ke lōʻihi ia e lawe i ka pā lahilahi. I nā lā mua, ua hoʻohana ʻia ka hapa nui o nā CPU o nā papa ABF i nā kamepiula a me nā console pāʻani. Me ka piʻi ʻana o nā kelepona paʻalima a me ka loli o ka ʻenehana hōʻiliʻili, hāʻule ka ʻoihana ABF i kahi kai haʻahaʻa. Eia nō naʻe, i nā makahiki i hala iho nei, me ka hoʻomaikaʻi o ka wikiwiki o ka pūnaewele a me ka breakthrough ʻenehana, ua puka aʻe nā noi hou o ka hoʻomākaukau pono kiʻekiʻe, a ua hoʻonui hou ʻia ka noi no ABF. Mai ke kuanaʻike o ke ʻano o ka ʻoihana, hiki i ka mea substrate ABF ke hoʻomau me ka wikiwiki o ka semiconductor holomua, hiki ke hoʻokō i nā koi o ka laina lahilahi, ka laina ākea / ka mamao o ka laina, a hiki ke manaʻo ʻia ka ulu ulu mākeke i ka wā e hiki mai ana.
Ka palena hana hana, ua hoʻomaka nā alakaʻi ʻoihana e hoʻonui i ka hana. I Mei 2019, ua hoʻolaha ʻo Xinxing e manaʻo ʻia e hoʻopukapuka 20 biliona yuan mai ka makahiki 2019 a 2022 e hoʻonui i ka mea hoʻoliʻiliʻi kiʻekiʻe me ka hoʻomoana nui i nā mea kanu ABF. E pili ana i nā mea kanu Taiwan ʻē aʻe, manaʻo ʻo jingshuo e hoʻolilo i nā papa lawe papa i ka hana ABF, a ke hoʻomau mau nei ʻo Nandian i ka hiki ke hana. ʻO nā huahana uila o kēia lā ʻaneʻane kokoke iā SOC (ʻōnaehana ma kahi chip), a aneane pau nā hana a me nā hana i wehewehe ʻia e nā kikoʻī IC. No laila, ʻo ka ʻenehana a me nā pono o ka hue hoʻoliʻiliʻi hope e hana nui i mea e hōʻoia ai hiki iā lākou ke kākoʻo i ka hana wikiwiki loa o nā ʻāpana IC. I kēia manawa, ʻo ABF (Ajinomoto e kūkulu i ke kiʻi ʻoniʻoni) ka papa i makemake nui ʻia e hoʻohui ana i nā mea no ka mea lawe IC kiʻekiʻe ma ka mākeke, a ʻo nā mea hoʻolako nui i nā mea ABF he mea hana Iapana, e like me Ajinomoto a me Sekisui kemika.
ʻO ka ʻenehana ʻo Jinghua ka mea hana mua ma Kina e hoʻomohala kūʻokoʻa i nā mea ABF. I kēia manawa, ua hōʻoia ʻia nā huahana e nā mea hana he nui ma ka home a me nā ʻāina ʻē a ua hoʻouna ʻia i nā mea liʻiliʻi.

3 、MIS
ʻO kaʻenehana hōʻiliʻili MIS substrate kahi ʻenehana hou, e ulu wikiwiki nei i nā mākeke o ka analog, ka mana IC, ke kālā uila a pēlā aku. ʻOkoʻa mai ka substrate kuʻuna, MIS kahi hoʻokahi a ʻoi paha mau papa o ka hana i hoʻopaʻa ʻia i mua. Hoʻohui ʻia kēlā me kēia papa e ka electroplating keleawe e hāʻawi i ka pilina uila i ke kaʻina hoʻopili. Hiki iā MIS ke pani i kekahi pūʻolo kuʻuna e like me ka pūʻulu QFN a i ʻole ka pūʻulu kēpau kēpau, no ka mea he mana ʻoihana finer finer, ʻoi aku ka maikaʻi o ka uila a me ka hana thermal, a me nā kiʻi liʻiliʻi.