Me ke ao hou ʻole PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. ʻAe ʻenehana HDI e hoʻonohonoho nā mea hoʻolālā i nā mea liʻiliʻi kokoke i kekahi i kekahi. ʻO ke kiʻekiʻena pūʻolo, ka nui o ka papa a me nā papa liʻiliʻi e lawe i kahi hopena cascading i ka hoʻolālā PCB.

ʻO ka maikaʻi o HDI

Let’s take a closer look at the impact. ʻO ka hoʻonui ʻana i ka nui o ka pūʻolo e ʻae iā mākou e hoʻopōkole i nā ala uila ma waena o nā mea. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Hiki i ka hoʻemi ʻana i ka nui o nā papa ke waiho i nā pilina hou aʻe ma ka papa like a hoʻomaikaʻi i ka hoʻonohonoho ʻana i nā mea, nā uila a me nā pilina. Mai laila, hiki iā mākou ke nānā i kahi hana i kapa ʻia interconnect per Layer (ELIC), kahi e kōkua ai i nā kime hoʻolālā e neʻe mai nā papa mānoanoa a i nā mea lahilahi e mālama i ka ikaika ʻoiai e ʻae iā HDI e ʻike i ka nui o ka hana.

HDI PCBS rely on lasers rather than mechanical drilling. Ma ka huli, THE HDI PCB hoʻolālā hopena i kahi puka liʻiliʻi a me ka nui o ka pad. ʻO ka hōʻemi ʻana i ka puka i ʻae ʻia i ka hui hoʻolālā e hoʻonui i ka hoʻonohonoho o ka wahi o ka papa. ʻO ka hoʻopōkole ʻana i nā ala uila a me ka hiki ʻana i nā uea ʻoi aku ka maikaʻi e hoʻomaikaʻi i ka pono o ka hoʻolālā a hoʻonui i ka hana hōʻailona. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

ʻAʻole hoʻohana nā hoʻolālā HDI PCB ma o nā lua, akā nā makapō a kanu ʻia nā lua. ʻO ke kau ʻana a me ka pololei o ka waiho ʻana o nā lua kanu a me nā makapō e hōʻemi ana i ka kaomi mīkini ma ka pā a pale i ka manawa kūpono o ka warping. Hoʻohui ʻia, hiki iā ʻoe ke hoʻohana i nā lua kuapo e hoʻonui i nā kiko interconnect a hoʻomaikaʻi i ka hilinaʻi. Hiki i kāu hoʻohana ʻana i nā pads ke hōʻemi i ka nalo o ka hōʻailona ma ka hōʻemi ʻana i ke keʻa keʻa a me ka hōʻemi ʻana i nā hopena parasite.

Pono ka hana HDI i ka hana hui

Pono ka hoʻolālā ʻana i ka hana ʻana (DFM) i kahi ʻano noʻonoʻo pono, pololei PCB a me ke kamaʻilio kūlike me nā mea hana a me nā mea hana. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. I ka pōkole, ʻo ka hoʻolālā, prototyping a me ke kaʻina hana o HDI PCBS e koi pono i ka hana hui like ʻana a me ka nānā ʻana i nā lula DFM kikoʻī e pili ana i ka papahana.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

E ʻike i kāu mau papa kaapuni a me nā kikoʻī

Ma muli o ka hoʻohana ʻana o HDI i nā ʻano ʻokoʻa o ke kaʻina ʻeli laser, pono ke kamaʻilio ma waena o ka pūʻulu hoʻolālā, ka mea hana a me ka mea hana i ka ʻano mea o nā papa ke kūkā kamaʻilio nei i ka hana ʻeli. ʻO ka noi huahana e hoʻāla i ke kaʻina hoʻolālā e loaʻa paha ka nui a me nā koi kaumaha e hoʻoneʻe i ke kamaʻilio ma kekahi ala a i ʻole. High frequency applications may require materials other than standard FR4. Hoʻohui ʻia, hoʻoholo nā hoʻoholo e pili ana i ke ʻano o nā mea FR4 e pili ana i ke koho ʻana o nā ʻōnaehana ʻeli a i ʻole nā ​​kumuwaiwai hana ʻē aʻe. ʻOiai kahi o nā ʻōnaehana e wili ai i ke keleawe, ʻaʻole e komo mau kekahi i nā olonā aniani.

Ma waho aʻe o ke koho ʻana i ka ʻano pono pono, pono pū ka pūʻulu hoʻolālā e hiki i ka mea hana a me ka mea hana ke hoʻohana i ka mānoanoa o ka pā a me nā hana plating. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. ʻOiai ʻo nā pā mānoanoa e ʻae no nā puka liʻiliʻi, hiki i nā koi ʻenekini o ka papahana ke kikoʻī i nā pā lahilahi i hiki i ka holomua ma lalo o kekahi mau ʻano kaiapuni. Pono e kime hoʻolālā e nānā i ka hiki i ka mea hana ke hoʻohana i ka ʻenehana “interconnect layer” a wili i nā lua i ka hohonu kūpono, a e hōʻoia e hoʻopiha ka hopena kemika no ka electroplating i nā lua.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Ma muli o ka hopena o ELIC, hiki i nā hoʻolālā PCB ke hoʻohana i ka pilina paʻa a paʻakikī e pono ai no nā kaapuni wikiwiki. Ma muli o ka hoʻohana ʻana o ELIC i nā microholes piha i ke keleawe no ka pilina, hiki ke hoʻopili ʻia ma waena o nā papa ʻelua me ka nāwaliwali ʻole o ka papa kaapuni.

Hoʻopili ka koho ʻana i ka hoʻonohonoho

ʻO nā kūkākūkā ʻana me nā mea hana a me nā mea hana e pili ana i ka hoʻolālā HDI pono e kau i ka hoʻonohonoho kikoʻī o nā mea kiʻekiʻena kiʻekiʻe. The selection of components affects wiring width, position, stack and hole size. Eia kekahi laʻana, hoʻokomo pinepine nā hoʻolālā HDI PCB i kahi hoʻonohonoho pā pōlele nunui (BGA) a me kahi BGA spaced spaces e pono ai e pakele pin. ʻO nā mea e hōʻino ana i ka lako mana a me ka hōʻailona pono a me ka kūpaʻa o ke kino o ka papa e pono ke ʻike ʻia i ka hoʻohana ʻana i kēia mau hāmeʻa. Hoʻopili kēia mau mea i ka loaʻa ʻana o ka hoʻokaʻawale kūpono ma waena o nā papa luna a me lalo e hōʻemi ai i ka crosstalk a me ka kaohi ʻana iā EMI ma waena o nā papa hōʻailona kūloko.Symmetrically spaced components will help prevent uneven stress on the PCB.

E nānā i ka hōʻailona, ​​ka mana a me ka pono o ke kino

Ma waho o ka hoʻomaikaʻi ʻana i ka pono o ka hōʻailona, ​​hiki iā ʻoe ke hoʻomaikaʻi i ka pono o ka mana. Ma muli o ka neʻe ʻana o ka HDI PCB i ka papa hoʻokumu kokoke i ka papa, ua hoʻomaikaʻi ʻia ka pono o ka mana. ʻO ka papa luna o ka papa he papa honua a me kahi mana lako, i hiki ke hoʻopili ʻia i ka papa o ka papahele ma o nā puka makapō a i ʻole microholes, a hoʻemi i ka helu o nā lua mokulele.

Hoʻoemi ʻo HDI PCB i ka helu o nā puka ma o ka papa o loko o ka papa. In turn, reducing the number of perforations in the power plane provides three major advantages:

ʻO ka wahi keleawe nui e hānai ai iā AC a me DC i loko o ka pine mana chip

L resistance decreases in the current path

L Ma muli o ka hoʻohaʻahaʻa haʻahaʻa, hiki i ke kuapo hoʻololi pololei ke heluhelu i ka pin mana.

ʻO kekahi kumu nui o ke kūkākūkā ʻana e mālama i ka laulā laina liʻiliʻi, palekana spacing a me ke ala like ʻana. Ma ka hopena hope, e hoʻomaka e hoʻokō i ka lahilahi o ke keleawe a me ke kaulike kaulike i ka manawa o ka hoʻolālā ʻana a hoʻomau i ka hana ʻana a me ke kaʻina hana.

Hiki i ka nele o ka spacing palekana i ke koena o ke kiʻi ʻoniʻoni i ka wā o ke kiʻi ʻoniʻoni maloʻo i loko, kahi e hiki ai i nā kaapuni pōkole. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Pono nā kime hoʻolālā a me nā mea hana e noʻonoʻo pono i ka mālama ʻana i ke kūlike me ke ʻano o ka kaohi ʻana i ka impedance laina hōʻailona.

Hoʻokumu a pili i nā lula hoʻolālā kikoʻī

Koi ʻia nā hoʻolālā kiʻekiʻe-ʻoi aku ka nui o nā kūwaho kūwaho, ʻoi aku ka maikaʻi o ka hoʻopili ʻana a me ka hoʻokaʻawale ʻana i nā ʻāpana ʻoi aku, a no laila koi i kahi kaʻina hoʻolālā ʻokoʻa. Hilinaʻi ka hana hana HDI PCB i ka ʻeli ʻana o ka laser, nā polokalamu CAD a me CAM, nā kaʻina hana kiʻi pololei a ka laser, nā pono hana hana loea, a me ka ʻike ʻoihana. ʻO ka kūleʻa o ke kaʻina holoʻokoʻa i ka ʻāpana i nā lula hoʻolālā e ʻike i nā koi impedance, ka laulā alakaʻi, ka nui o ka puka, a me nā kumu ʻē aʻe e hoʻopili i ka ʻōnaehana. Ke hoʻomohala nei i nā lula hoʻolālā kikoʻī e kōkua i ke koho ʻana i ka mea hana kūpono a mea hana paha no kāu papa a waiho i ke kahua no ke kamaʻilio ma waena o nā kime.