Ọrụ nke ọ bụla oyi akwa na PCB osisi na imewe echiche

ọtụtụ PCB ndị na-anụ ọkụ n’obi imewe, ọkachasị ndị mbido, aghọtachaghị ọkwa dị iche iche na imepụta PCB. Ha amaghị ọrụ na ojiji ya. Nke a bụ nkọwa nhazi maka onye ọ bụla:

1. The n’ibu oyi akwa, dị ka aha na-egosi, bụ ọdịdị nke dum PCB osisi maka n’ibu nhazi. N’ezie, mgbe anyị na-ekwu banyere n’ibu oyi akwa, anyị pụtara n’ozuzu ọdịdị nke PCB osisi. Enwere ike iji ya ịtọ akụkụ nke bọọdụ sekit, akara data, akara ntinye, ntuziaka mgbakọ na ozi ndị ọzọ na-arụ ọrụ. Ozi a dịgasị iche dabere na ihe achọrọ nke ụlọ ọrụ imewe ma ọ bụ onye nrụpụta PCB. Tụkwasị na nke ahụ, enwere ike ịgbakwunye oyi akwa ígwè ọrụ na ọkwa ndị ọzọ iji mepụta ma gosipụta ọnụ.

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2. Debe oyi akwa (machibidoro wiring oyi akwa), nke a na-eji kọwaa mpaghara ebe akụrụngwa na wiring nwere ike itinye nke ọma na bọọdụ sekit. Denye ebe mechiri emechi na oyi akwa a dị ka ebe dị irè maka ntụgharị. Nhazi akpaaka na ụzọ agaghị ekwe omume na mpụga mpaghara a. Okpokoro wiwi a machibidoro iwu na-akọwa oke mgbe anyị debere njirimara eletriki nke ọla kọpa. Nke ahụ bụ, mgbe anyị bu ụzọ kọwapụta oyi akwa a machibidoro iwu, na usoro wiwi n’ọdịnihu, wiwi nwere àgwà eletrik enweghị ike ịgafe wiwi a machibidoro iwu. N’ókè nke oyi akwa, a na-enwekarị àgwà nke iji Keepout oyi akwa dị ka ihe eji arụ ọrụ. Usoro a ezighi ezi, n’ihi ya, a na-atụ aro ka ị mee ihe dị iche iche, ma ọ bụghị ya, ụlọ ọrụ ụlọ ọrụ ga-agbanwe àgwà gị mgbe ọ bụla ị na-emepụta.

3. Signal Layer: A na-ejikarị oyi akwa mgbama mee ndokwa wires na bọọdụ sekit. Gụnyere Top oyi akwa (oke oyi akwa), oyi akwa ala (okpukpu ala) na 30 MidLayer (okpukpu etiti). N’elu na ala ala na-edobe ngwaọrụ ndị ahụ, a na-apụkwa n’ime ime.

4. Top paste and Bottom paste are the top and bottom pad stencil layers, which are the same size as the pads. This is mainly because we can use these two layers to make the stencil when we do SMT. Just dug a hole the size of a pad on the net, and then we cover the stencil on the PCB board, and apply the solder paste evenly with a brush with solder paste, as shown in Figure 2-1.

5. Top Solder na Bottom Solder Nke a bụ ihe mkpuchi mkpuchi iji gbochie mmanụ ndụ ndụ na-ekpuchi. Anyị na-ekwukarị “mepee windo”. A na-ekpuchi ọla kọpa ma ọ bụ wiwi a na-ahụkarị na mmanụ ndụ ndụ na ndabara. Ọ bụrụ na anyị na-etinye ihe mkpuchi na-ere ahịa n’ihi ya Ọ bụrụ na ejiri ya mee ihe, ọ ga-egbochi mmanụ akwụkwọ ndụ akwụkwọ ndụ na-ekpuchi ya ma kpughee ọla kọpa. Enwere ike ịhụ ọdịiche dị n’etiti ha na foto a:

6. Ngwunye ụgbọ elu dị n’ime (ike dị n’ime / ala oyi akwa): Ụdị oyi akwa a na-eji naanị maka mbadamba multilayer, nke a na-ejikarị eme ndokwa maka eriri ọkụ na ala ala. Anyị na-akpọ bọọdụ okpukpu abụọ, bọọdụ nwere oyi akwa anọ na mbadamba isii. Ọnụ ọgụgụ nke ọkwa mgbaàmà na ike ime / ala ala.

7. Silkscreen oyi akwa: The silkscreen oyi akwa na tumadi na-eji na-edebe e biri ebi ozi, dị ka components ndepụta na labels, dị iche iche annotation odide, wdg Altium na-enye abụọ silk screen layers, Top Overlay na Bottom Overlay, na-etinye n’elu silk ihuenyo faịlụ na n’elu. na ala silk ihuenyo faịlụ n’otu n’otu.

8. Multi oyi akwa (multi-layer): The mpe mpe akwa na penetrating vias na sekit osisi ga-abanye n’ime dum circuit osisi na guzosie ike eletriki njikọ dị iche iche conductive ụkpụrụ n’ígwé. Ya mere, usoro ahụ ewepụtala oyi akwa abstract-multi-layer. N’ozuzu, a ga-ahazi pads na vias n’ọtụtụ ọkwa. Ọ bụrụ na agbanyụrụ oyi akwa a, enweghị ike igosipụta pads na vias.

9. Drill Drawing (akwa akwa akwa): Igwe mmiri na-egwupụta ihe na-enye ozi mgbapu n’oge usoro nhazi nke sekit (dị ka pads, vias mkpa ka a ga-agbapụta). Altium na-enye akwa akwa abụọ: Drill gride na Drill Drill.