Mgbe a na-edozi laminate ọla kọpa iji mepụta PCB mbadamba, dị iche iche site na oghere, na oghere mgbakọ, ihe dị iche iche na-agbakọta. Mgbe ị gbakọtara, iji mee ka ihe ndị ahụ nweta njikọ na sekit ọ bụla nke PCB, ọ dị mkpa iji mee usoro ịgbado ọkụ Xuan. A na-ekewa brazing n’ụzọ atọ: ire ere, reflow soldering na akwụkwọ ntuziaka. A na-ejikọkarị ihe ndị etinyere oghere site na ire ere; njikọ brazing nke n’elu-ndokwasa components n’ozuzu na-eji reflow soldering; onye components na components bụ n’otu n’otu akwụkwọ ntuziaka (electric chrome) n’ihi na echichi usoro chọrọ na onye mmezi ịgbado ọkụ. Ígwè) ịgbado ọkụ.

1. Solder eguzogide nke ọla kọpa clad laminate

Copper clad laminate bụ ihe mkpụrụ nke PCB. N’oge brazing, ọ na-ezute kọntaktị nke ihe na-ekpo ọkụ n’otu ntabi anya. Ya mere, usoro ịgbado ọkụ Xuan bụ ụdị dị mkpa nke “ụjọ ọkụ” na laminate ọla kọpa na ule nke nguzogide okpomọkụ nke ọla kọpa clad laminate. Ihe mkpuchi ọla kọpa na-eme ka ngwaahịa ha dị mma n’oge ujo ọkụ, nke bụ akụkụ dị mkpa nke nyochaa nguzogide okpomọkụ nke ọla kọpa clad laminates. N’otu oge ahụ, ntụkwasị obi nke ọla kọpa clad laminate n’oge Xuan ịgbado ọkụ na-metụtara ya onwe-wepụ ike, bee ike n’okpuru elu okpomọkụ, na mmiri na okpomọkụ iguzogide. N’ihi na brazing usoro chọrọ nke ọla kọpa clad laminates, na mgbakwunye na nke ot immersion eguzogide ihe, na-adịbeghị anya, iji melite ntụkwasị obi nke ọla kọpa clad laminates na Xuan ịgbado ọkụ, ụfọdụ ngwa arụmọrụ nha na ntule ihe agbakwunyere. Dị ka mmiri absorption na okpomọkụ na-eguzogide ule (ọgwụgwọ maka 3 h, mgbe ahụ 260 ℃ dip soldering test), mmiri absorption reflow soldering test (dobere na 30 ℃, ikwu iru mmiri 70% maka oge a kapịrị ọnụ, maka reflow soldering test) na na na. . Tupu ngwaahịa laminate ọla kọpa ahapụ ụlọ ọrụ mmepụta ihe, onye na-emepụta laminate nke ọla kọpa ga-eme nnwale nkwụsi ike siri ike (nke a na-akpọkwa blistering thermal shock) dị ka ọkọlọtọ si dị. Ndị na-emepụta bọọdụ sekit e biri ebi kwesịkwara ịchọpụta ihe a ka oge na-aga ka laminate ọla kọpa abanyechara n’ụlọ ọrụ ahụ. N’otu oge ahụ, mgbe emechara ihe nlele PCB, a ga-anwale arụmọrụ ahụ site na ịmegharị ọnọdụ ịgbanye mmiri na obere batches. Mgbe ekwenyechara na ụdị mkpụrụ a na-emezu ihe onye ọrụ chọrọ n’ihe gbasara iguzogide immersion soldering, PCB nke ụdị a nwere ike imepụta ọtụtụ ma zigara ya na ụlọ ọrụ igwe zuru oke.

Usoro maka ịlele nkwụsi ike nke ọla kọpa clad laminates bụ otu ihe ahụ dị ka mba ụwa (GBIT 4722-92), ọkọlọtọ American IPC (IPC-410 1), na ọkọlọtọ JIS Japanese (JIS-C-6481-1996). . Isi ihe achọrọ bụ:

① Usoro nke mkpebi ikpe bụ “usoro ịgbanye mmiri na-ese n’elu mmiri” (ihe nlele ahụ na-ese n’elu ala);

② Nha nlele bụ 25 mm X 25 mm;

③Ọ bụrụ na ọnụ ọgụgụ ọnọdụ okpomọkụ bụ temometa mercury, ọ pụtara na ọnọdụ yiri nke mercury isi na ọdụ na solder bụ (25 ± 1) mm; ọkọlọtọ IPC bụ 25.4 mm;

④ Omimi nke ịsa ahụ na-ere ahịa abụghị ihe na-erughị 40 mm.

Okwesiri iburu n’uche na: onodu onodu onodu onodu a na-enwe mmetụta di nkpa na ngosiputa ziri ezi na ezi ntule nke nguzogide dip solder nke osisi. N’ozuzu, ebe a na-ekpo ọkụ nke ịgba agba agba dị n’okpuru ebe ịsa ahụ. Ka ukwuu (dị omimi) ebe dị anya n’etiti ebe nlele okpomọkụ na elu nke ihe na-ere ahịa, ka ọdịiche dị n’etiti okpomọkụ nke ihe na-ere ahịa na okpomọkụ a tụrụ atụ. N’oge a, ala okpomọkụ nke mmiri mmiri elu dị ka tụrụ okpomọkụ, ogologo oge maka efere na itinye solder eguzogide tụrụ site sample sere n’elu ịgbado ọkụ usoro ka afụ.

2. Wave soldering nhazi

N’ime usoro ịgbanye ebili mmiri, okpomọkụ nke ire ere bụ n’ezie okpomọkụ nke ihe na-ere ahịa, na okpomọkụ a na-ejikọta ya na ụdị ire ere. Ekwesịrị ịchịkwa okpomọkụ nke ịgbado ọkụ n’okpuru 250’c. Okpomọkụ ịgbado ọkụ dị ala na-emetụta ogo ịgbado ọkụ. Ka okpomọkụ soldering na-abawanye, oge ire ere na-ebelata nke ukwuu nke ukwuu. Ọ bụrụ na ire ere dị oke elu, ọ ga-eme ka sekit (ọla kọpa tube) ma ọ bụ mkpụrụ ahụ ka ọ bụrụ ọnya, delamination, na nnukwu warpage nke osisi ahụ. Ya mere, a ghaghị ịchịkwa okpomọkụ nke ịgbado ọkụ.

Atọ, reflow nhazi ịgbado ọkụ

N’ozuzu, okpomọkụ soldering reflow dị ntakịrị ala karịa okpomọkụ soldering ife. Ntọala nke reflow soldering okpomọkụ metụtara akụkụ ndị a:

① Ụdị ngwá ọrụ maka reflow soldering;

② Ọnọdụ ntọala nke ọsọ ahịrị, wdg;

③ Ụdị na ọkpụrụkpụ nke ihe eji eme ihe;

④ PCB nha, wdg.

Ọnọdụ okpomọkụ nke reflow soldering dị iche na PCB elu okpomọkụ. N’otu ọnọdụ okpomọkụ maka reflow soldering, elu okpomọkụ nke PCB dịkwa iche n’ihi ụdị na ọkpụrụkpụ nke mkpụrụ ihe.

N’oge reflow soldering usoro, okpomọkụ na-eguzogide oke nke mkpụrụ n’elu okpomọkụ ebe ọla kọpa foil zaa (afụ) ga-agbanwe na preheating okpomọkụ nke PCB na ọnụnọ ma ọ bụ enweghị mmiri absorption. Enwere ike ịhụ site na foto 3 na mgbe okpomọkụ na-ekpo ọkụ nke PCB (okpomọkụ dị n’elu nke mkpụrụ ahụ) dị ala, njedebe okpomọkụ nke okpomọkụ dị elu ebe nsogbu ọzịza na-apụta na-adịkwa ala. N’okpuru ọnọdụ na okpomọkụ setịpụrụ site reflow soldering na preheating okpomọkụ nke reflow soldering na-adị mgbe nile, elu okpomọkụ na-adaba n’ihi na mmiri absorption nke mkpụrụ.

Anọ, ịgbado ọkụ n’aka

Na idozi ịgbado ọkụ ma ọ bụ iche iche akwụkwọ ntuziaka ịgbado ọkụ nke pụrụ iche components, elu okpomọkụ nke electric ferrochrome a chọrọ n’okpuru 260 ℃ maka akwụkwọ dabeere ọla kọpa clad laminates, na n’okpuru 300 ℃ maka iko eriri ákwà dabeere ọla kọpa clad laminates. Na dị ka o kwere mee ka ebelata oge ịgbado ọkụ, n’ozuzu chọrọ; akwụkwọ mkpụrụ 3s ma ọ bụ obere, iko eriri ákwà mkpụrụ bụ 5s ma ọ bụ obere.