Kedu ihe bụ bọọdụ PCB HDI (High Density Interconnect)?

High density Interconnect (HDI) PCB, bụ ụdị e biri ebi sekit osisi mmepụta (teknụzụ), ojiji nke Micro-kpuru oghere, liri oghere technology, a sekit osisi na dịtụ elu nkesa njupụta. N’ihi mmepe nke teknụzụ na-aga n’ihu maka ihe ndị chọrọ mgbama ọkụ eletrik dị elu, bọọdụ sekit ga-enye njikwa impedance na njirimara ac, ikike nnyefe dị elu, belata radieshon na-enweghị isi (EMI) na ihe ndị ọzọ. Iji Stripline, Microstrip Ọdịdị, multi-layer imewe na-aghọ mkpa. Iji belata nsogbu dị mma nke nnyefe mgbaàmà, a ga-anakwere ihe mkpuchi nke nwere obere ọnụọgụ dielectric na ọnụ ọgụgụ dị ala. Iji kwekọọ na miniaturization na n’usoro nke ngwa eletrọnịkị, a ga-abawanye njupụta nke bọọdụ sekit na-aga n’ihu iji gboo ihe achọrọ.

HDI (nchịkọta njupụta dị elu) bọọdụ sekit na-agụnye oghere laser kpuru na oghere igwe kpuru isi;
N’ozuzu site na-eli ozu oghere, kpuru oghere, overlapping oghere, staggered oghere, obe liri oghere, site oghere, kpuru oghere na-ejuputa electroplating, obere ahịrị obere oghere, efere microhole na ndị ọzọ usoro iji nweta conduction n’etiti n’ime na elu n’ígwé, na-emekarị ndị ìsì. dayameta e liri erughị 6mil.

A na-ekewa bọọdụ sekit HDI n’ime ọtụtụ na njikọ njikọ oyi akwa ọ bụla

Ọdịdị HDI mbụ: 1+N+1 (ịpịpịa ugboro abụọ, laser otu ugboro)

Usoro HDI nke abụọ: 2+N+2 (ịpị maka ugboro 3, laser maka ugboro abụọ)

Usoro HDI nke atọ: 3+N+3 (ịpị 4 ugboro, laser ugboro 3) Usoro nke anọ

Ọdịdị HDI: 4+N+4 (ịpị 5 ugboro, laser 4 ugboro)

Na onye ọ bụla HDI