Na PCB, a na-eji nickel eme ihe dị ka ihe mkpuchi nke ọla dị oke ọnụ ahịa na ntọala. N’otu oge ahụ, maka ụfọdụ bọọdụ e biri ebi nwere otu akụkụ, a na-ejikarị nickel eme ihe dị ka oyi akwa elu. Ọzọ, m ga-eso gị akụkụ nke PCB nickel plating ngwọta

1. Isi nnu: nickel sulfate na nickel sulfate bụ isi nnu na ngwọta nickel, nke tumadi na-enye nickel metal ion chọrọ maka nickel plating na-arụkwa ọrụ nke conductive nnu. N’inwe ọdịnaya nnu nickel dị elu, enwere ike iji njupụta cathode dị ugbu a, na ntinye ntinye ngwa ngwa. A na-ejikarị ya eme ihe maka ịkwa akwa nickel dị oke ọsọ. Ọdịnaya nnu nickel dị ala na-eduga n’ọkwa dị ala, mana ikike mgbasa ozi dị ezigbo mma, enwere ike nweta mkpuchi kristal dị mma ma na-egbuke egbuke.

2. Buffer: A na-eji boric acid mee ihe dị ka ihe nchekwa iji nọgide na-enwe uru pH nke ngwọta nickel plating n’ime ebe ụfọdụ. Boric acid ọ bụghị naanị nwere ọrụ nke pH buffer, kamakwa ọ nwere ike imeziwanye polarization cathodic, iji mee ka arụmọrụ nke ịsa ahụ dịkwuo mma.

3. Anode activator: nickel anode dị mfe passivate n’oge ike on. Iji hụ na mgbasa nke anode na-emekarị, a na-agbakwunye ihe ụfọdụ nke anode activator na ngwọta plating.

4. Ihe mgbakwunye: ihe bụ isi nke ihe mgbakwunye bụ ihe enyemaka na-enye nchekasị. Ihe mgbakwunye a na-ejikarị bụ naphthalene sulfonic acid, p-toluenesulfonamide, saccharin, wdg.

5. Onye na-ahụ maka mmiri: iji belata ma ọ bụ gbochie ọgbọ nke pinholes, a ga-agbakwunye obere mmiri mmiri na ngwọta plating, dị ka sodium dodecyl sulfate, sodium diethylhexyl sulfate, sodium octyl sulfate, wdg.