Enweghị oge a PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Teknụzụ HDI na -enye ndị na -emepụta ohere idowe obere ihe dị iche iche. Njupụta ngwugwu dị elu, nha bọọdụ pere mpe na akwa dị ole na ole na -eweta mmetụta dị egwu na imebe PCB.

Uru nke HDI

Let’s take a closer look at the impact. Ịbawanye njupụta ngwugwu na -enye anyị ohere ibelata ụzọ eletriki n’etiti ngwa. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Mbelata ọnụ ọgụgụ nke akwa nwere ike idobe njikọ ndị ọzọ na otu bọọdụ ma melite itinye akụkụ, eriri na njikọ. Site ebe ahụ, anyị nwere ike lekwasị anya na usoro akpọrọ interconnect per Layer (ELIC), nke na -enyere ndị otu nhazi aka isi na bọọdụ buru ibu gaa na ndị na -agbanwe agbanwe ka ha nwee ike ma na -enye ohere ka HDI hụ njupụta ọrụ.

HDI PCBS rely on lasers rather than mechanical drilling. N’aka nke ya, ihe nrụpụta HDI PCB na -ebute obere oghere na nha paịlị. Mbelata oghere mepere ka ndị otu mmebe ahụ nwekwuo ohere nke mpaghara bọọdụ. Mbelata ụzọ eletriki na ịgbanye eriri ọkụ siri ike na -akwalite iguzosi ike n’ezi ihe nke imewe ahụ yana ime ka mgbaama ngwa ngwa. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

HDI PCB aghụghọ anaghị eji oghere eme ihe, kama ọ bụ oghere kpuru ìsì na ili. Staggered and accurate placement of burial and blind holes reduces mechanical pressure on the plate and prevents any chance of warping. Tụkwasị na nke a, ị nwere ike iji oghere akpọchiri iji kwalite isi njikọta ma melite ntụkwasị obi. Ojiji gị na mpe mpe akwa nwekwara ike ibelata mfu mgbaama site na mbenata nkwụsị obe na ibelata mmetụta nrịanrịa.

Mmepụta HDI chọrọ ịrụkọ ọrụ ọnụ

Nrụpụta nrụpụta (DFM) chọrọ nlebara anya, usoro imebe PCB yana nkwukọrịta na -agbanwe agbanwe na ndị nrụpụta na ndị nrụpụta. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Na nkenke, imepụta, imepụta na usoro nrụpụta nke HDI PCBS chọrọ imekọ ihe ọnụ yana nlebara anya na iwu DFM akọwapụtara maka ọrụ a.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Mara akụrụngwa sekit gị na nkọwapụta ya

N’ihi na mmepụta HDI na -eji usoro mkpọpu mmiri laser dị iche iche, mkparịta ụka n’etiti ndị nrụpụta, onye nrụpụta na onye nrụpụta ga -elekwasị anya n’ụdị ihe mbadamba mgbe ị na -ekwu maka usoro mkpọpu ala. Ngwa ngwaahịa nke na -akpali usoro nhazi nwere ike ịnwe nha na ibu dị mkpa na -akpali mkparịta ụka n’otu ụzọ ma ọ bụ ọzọ. High frequency applications may require materials other than standard FR4. Na mgbakwunye, mkpebi gbasara ụdị ihe FR4 na -emetụta mkpebi gbasara nhọpụta nke usoro mkpọpu ala ma ọ bụ akụrụngwa nrụpụta ndị ọzọ. Ọ bụ ezie na sistemụ ụfọdụ na -egwu ọla kọpa n’ụzọ dị mfe, ndị ọzọ anaghị abanye n’ime eriri iko.

Na mgbakwunye na ịhọrọ ụdị ihe dị mma, ndị otu ahụ ga -ahụrịrị na onye nrụpụta na onye nrụpụta nwere ike iji oke ọkpụrụkpụ efere na usoro plating. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Ọ bụ ezie na efere buru ibu na -enye ohere oghere pere mpe, ihe achọrọ maka ọrụ ahụ nwere ike ịkọwapụta efere dị gịrịgịrị nke na -adabaghị adaba n’okpuru ụfọdụ ọnọdụ gburugburu ebe obibi. Ndị otu nrụpụta ahụ ga -enyocharịrị na onye nrụpụta nwere ikike iji usoro “interconnect layer” wee gwuo oghere na omimi miri emi, wee hụ na ihe kemịkalụ eji arụ ọrụ eletrik ga -ejupụta oghere ndị ahụ.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. N’ihi ELIC, atụmatụ PCB nwere ike irite uru dị ukwuu, njikọ dị mgbagwoju anya achọrọ maka okirikiri ọsọ ọsọ. N’ihi na ELIC na-eji microholes jupụtara ọla kọpa maka njikọta, enwere ike jikọta ya n’etiti ọkwa abụọ ọ bụla n’emebighị bọọdụ sekit.

Nhọrọ akụrụngwa na -emetụta nhazi

Mkparịta ụka ọ bụla na ndị nrụpụta na ndị na-emepụta ihe gbasara imewe HDI kwesịkwara ilekwasị anya na nhazi nke akụkụ dị elu. The selection of components affects wiring width, position, stack and hole size. Dịka ọmụmaatụ, atụmatụ HDI PCB na -agụnyekarị okirikiri okirikiri bọọlụ (BGA) na BGA nwere oghere nke chọrọ mgbapụ ntụtụ. A ga -amata ihe ndị na -emebi ọkụ eletrik na nkwụsi ike mgbaama yana nkwụsi ike anụ ahụ nke bọọdụ ahụ mgbe ị na -eji ngwaọrụ ndị a. Ihe ndị a gụnyere ị nweta mwepụ kwesịrị ekwesị n’etiti ọkwa dị elu na nke ala iji belata klọọkụ ibe gị yana ijikwa EMI n’etiti ọkwa mgbama dị n’ime.Symmetrically spaced components will help prevent uneven stress on the PCB.

Lezienụ anya na mgbama, ike na iguzosi ike n’ezi ihe nke anụ ahụ

Na mgbakwunye na ịkwalite iguzosi ike n’ezi ihe, ị nwekwara ike ịkwalite iguzosi ike n’ezi ihe ike. N’ihi na HDI PCB na -eme ka akwa ala dị nso n’elu, a na -emezi ike nke ike. Nkịtị dị elu nke bọọdụ nwere akwa ala na ike ọkọnọ ike, nke nwere ike jikọta ya na okpuru ala site na oghere kpuru ìsì ma ọ bụ microholes, ma belata ọnụ ọgụgụ oghere ụgbọelu.

HDI PCB na-ebelata ọnụọgụ oghere site na akwa ime. In turn, reducing the number of perforations in the power plane provides three major advantages:

Mpaghara ọla kọpa buru ibu na -enye AC na DC ugbu a n’ime ntụtụ ike mgbawa

L resistance decreases in the current path

L N’ihi ntakịrị inductance, ezigbo ịgbanye ọkụ nwere ike gụọ ntụtụ ike.

Isi ihe ọzọ dị mkpa maka mkparịta ụka bụ idobe obosara kacha nta, oghere dị nchebe yana idobe otu. N’okwu nke ikpeazụ, bido nweta ọkpụrụkpụ ọla kọpa na ịdị n’otu wiring n’oge usoro nhazi wee gaa n’ihu n’ichepụta na n’ichepụta ihe.

Enweghị oghere dị mma nwere ike ibute ihe fọdụrụ na fim n’oge usoro ihe nkiri akọrọ n’ime, nke nwere ike ibute obere sekit. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Ndị otu nrụpụta na ndị nrụpụta ga -atụlekwa idobe ịdị n’otu egwu dị ka ụzọ isi na -achịkwa impedance akara.

Guzosie ma tinye iwu imewe akọwapụtara nke ọma

Nhazi nke oke njupụta chọrọ obere akụkụ mpụga, wiresị kacha mma na oghere oghere siri ike, yabụ na-achọ usoro nhazi dị iche. Usoro nrụpụta PCB HDI na -adabere na mkpọpu mmiri laser, sọftụwia CAD na CAM, usoro onyonyo laser kpọmkwem, akụrụngwa nrụpụta pụrụ iche, na nka onye ọrụ. Ihe ịga nke ọma nke usoro a dabere na akụkụ nke iwu imewe nke na -achọpụta ihe chọrọ impedance, obosara onye na -eduzi ya, nha oghere, na ihe ndị ọzọ na -emetụta nhazi ahụ. Ịmepụta iwu nhazi zuru ezu na -enyere aka ịhọrọ onye nrụpụta ma ọ bụ onye nrụpụta kwesịrị ekwesị maka bọọdụ gị wee tọọ ntọala maka nkwukọrịta n’etiti otu.