FR4 ọkara mgbanwe PCB ụdị PCB n’ichepụta usoro

Mkpa ọ dị PCB na -agbanwe agbanwe cannot be underestimated in PCB manufacturing. Otu ihe kpatara ya bụ omume a na -achọkarị ime obere ihe. Na mgbakwunye, ọchịchọ maka PCBS siri ike na -arị elu n’ihi mgbanwe na arụmọrụ nke mgbakọ 3D. Agbanyeghị, ọ bụghị ndị nrụpụta PCB niile nwere ike izute usoro nrụpụta PCB siri ike na -agbanwe agbanwe. A na-arụpụta bọọdụ sekit semiizi na-agbanwe agbanwe site na usoro nke na-ebelata ọkpụrụkpụ osisi siri ike ruo 0.25mm +/- 0.05mm. Nke a, n’aka nke ya, na -enye ohere iji bọọdụ ahụ na ngwa ndị chọrọ ka ehulata bọọdụ ma kwụnye ya n’ime ụlọ. The plate can be used for one-time bending installation and multi-bending installation.

ipcb

Nke a bụ nchịkọta ụfọdụ njimara na -eme ka ọ pụọ iche:

Njirimara PCB ọkara – mgbanwe mgbanwe FR4

L Ihe kacha mkpa na -arụ ọrụ kacha mma maka ojiji nke gị bụ na ọ na -agbanwe agbanwe ma nwee ike ime mgbanwe na oghere dị.

L Ọdịdị ya na -abawanye site n’eziokwu na mgbanwe ya anaghị egbochi nnyefe mgbaàmà ya.

L Ọ dịkwa fechaa.

Na mkpokọta, PCBS na-agbanwe agbanwe na-amakwa maka ọnụ ahịa kacha mma n’ihi na usoro nrụpụta ha dakọtara na ike nrụpụta dị.

L Ha na -azọpụta oge imewe na oge mgbakọ.

L Ha bụ ndị ọzọ a pụrụ ịtụkwasị obi nke ukwuu, ọbụghị obere n’ihi na ha na -ezere ọtụtụ nsogbu, gụnyere tangles na ịgbado ọkụ.

Usoro nhazi PCB

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Usoro a na -ekpuchikarị akụkụ ndị a:

L Ịcha ihe

L Ihe mkpuchi ihe nkiri kpọrọ nkụ

L Nnyocha ngwa anya akpaghị aka

L Browning

L laminated

Nyocha X-ray

L mkpọpu ala

L electroplating

Ntughari eserese

L etching

L Mbipụta ihuenyo

L Ngosipụta na mmepe

L elu imecha

L Omimi njikwa igwe

L Nnwale eletriki

L Njikwa mma

L nkwakọ ngwaahịa

Gịnị bụ nsogbu na ihe ga -ekwe omume na nrụpụta PCB?

Nsogbu bụ isi n’ichepụta bụ ịhụ na izi ezi na ịdị omimi na -ejikwa nnwere onwe. Ọ dịkwa mkpa ijide n’aka na enweghị mgbawa resin ma ọ bụ mgbapụta mmanụ nke nwere ike ịkpata nsogbu ọ bụla dị mma. Nke a na -agụnye ịlele ihe ndị a n’oge njikwa njikwa omimi:

L ọkpụrụkpụ

L ọdịnaya Resin

L Nwe ndidi

Omimi akara igwe ule A

A na -arụ igwe igwe siri ike site na usoro nkewa iji kwekọọ na ọkpụrụkpụ nke 0.25 mm, 0.275 mm na 0.3 mm. Mgbe ahapụchara bọọdụ ahụ, a ga -anwale ya iji hụ ma ọ ga -eguzogide ogo 90 gbagọrọ agbagọ. N’ozuzu, ọ bụrụ na ọkpụrụkpụ fọdụrụ bụ 0.283mm, a na -ahụ na eriri iko ahụ emebiwo. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Nnwale nchịkwa igwe omimi B

Dabere na ihe dị n’elu, ọ dị mkpa iji hụ na ọkpụrụkpụ ọla kọpa nke 0.188mm ruo 0.213mm n’etiti akwa mgbochi ihe mgbochi na L2. Ọ dịkwa mkpa ka a kpachapụ anya nke ọma maka mgbagha ọ bụla nke nwere ike ime, na -emetụta ịdị n’otu niile.

Omimi akara igwe ule C

Ịgba igwe ihe omimi dị mkpa iji hụ na atọrọ nha ya na 6.3 “x10.5” ka ewepụtara ụdị ngosipụta panel. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.