Pabrikan HDI PCB: Bahan lan spesifikasi PCB

Tanpa modern PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Teknologi HDI ngidini para desainer nempatake komponen cilik sing cedhak. Kapadhetan paket sing luwih dhuwur, ukuran papan sing luwih cilik lan lapisan sing luwih sithik nggawa efek kasat kanggo desain PCB.

ipcb

Kauntungan saka HDI

Let’s take a closer look at the impact. Nambah kerapatan paket ngidini kita nyepetake jalur listrik ing antarane komponen. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Nyuda jumlah lapisan bisa nyedhiyakake luwih akeh sambungan ing papan sing padha lan ningkatake komponen, kabel lan sambungan komponen. Saka kana, kita bisa fokus ing teknik sing disebut interconnect per Layer (ELIC), sing mbantu tim desain pindhah saka papan sing luwih kenthel dadi fleksibel sing luwih tipis kanggo njaga kekuwatan nalika HDI bisa ndeleng kerapatan fungsional.

HDI PCBS rely on lasers rather than mechanical drilling. Sabanjure, desain HDB PCI ngasilake aperture sing luwih cilik lan ukuran pad sing luwih cilik. Ngurangi aperture ngidini tim desain nambah tata ruang area papan. Nyepetake jalur listrik lan ngaktifake kabel sing luwih intensif nambah integritas sinyal desain lan nyepetake proses sinyal. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Desain PCB HDI ora digunakake liwat bolongan, nanging bolongan wuta lan dikubur. Staggered and accurate placement of burial and blind holes reduces mechanical pressure on the plate and prevents any chance of warping. Kajaba iku, sampeyan bisa nggunakake bolongan sing ditumpuk kanggo nambah titik interkoneksi lan nambah reliabilitas. Panggunaan bantalan uga bisa nyuda kekurangan sinyal kanthi nyuda wektu tundha salib lan nyuda efek parasit.

Pabrikan HDI mbutuhake kerja sama tim

Desain pabrikan (DFM) mbutuhake pendekatan desain PCB sing tliti, lan komunikasi sing konsisten karo pabrikan lan pabrikan. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Cekakipun, desain, prototipe lan proses produksi HDI PCBS mbutuhake kerja sama tim lan perhatian kanggo aturan DFM tartamtu sing ditrapake kanggo proyek kasebut.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Ngerti bahan lan spesifikasi papan sirkuit sampeyan

Amarga produksi HDI nggunakake macem-macem jinis proses pengeboran laser, dialog antara tim desain, pabrikan lan pabrikan kudu fokus marang jinis material papan nalika ngrembug babagan proses pengeboran. Aplikasi produk sing nyebabake proses desain bisa uga nduweni ukuran lan bobot sing bisa mindhah obrolan ing arah utawa arah liyane. High frequency applications may require materials other than standard FR4. Kajaba iku, keputusan babagan jinis materi FR4 mengaruhi keputusan babagan pilihan sistem pengeboran utawa sumber daya manufaktur liyane. Nalika sawetara sistem ngebur liwat tembaga kanthi gampang, liyane ora sacara konsisten nembus serat kaca.

Saliyane milih jinis bahan sing pas, tim desain uga kudu mesthekake manawa pabrikan lan pabrikan bisa nggunakake teknik ketebalan piring lan plating sing bener. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Sanajan piring sing luwih kenthel ngidini aperture sing luwih cilik, persyaratan mekanik proyek kasebut bisa uga nemtokake piring sing luwih tipis sing gampang gagal ing kahanan lingkungan tartamtu. Tim desain kudu mriksa manawa pabrikan duwe kemampuan nggunakake teknik “lapisan interkoneksi” lan bolongan bor ing ambane sing bener, lan priksa manawa solusi kimia sing digunakake kanggo elektroplating bakal ngebaki bolongan kasebut.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Minangka asil ELIC, desain PCB bisa nggunakake sambungan sing padhet lan kompleks sing dibutuhake kanggo sirkuit kecepatan tinggi. Amarga ELIC nggunakake mikroholes tembaga sing ditumpuk kanggo interkoneksi, bisa disambungake ing antarane rong lapisan tanpa nggawe lemah papan sirkuit.

Pilihan komponen mengaruhi tata letak

Diskusi karo pabrikan lan pabrikan babagan desain HDI uga kudu fokus ing tata komponen sing dhuwur-kerapatan. The selection of components affects wiring width, position, stack and hole size. Contone, desain PCB HDI biasane ngemot susunan kothak bola (BGA) kandhungan lan BGA kanthi jarak sing apik sing mbutuhake pin pin. Faktor sing ngrusak pasokan listrik lan integritas sinyal uga integritas fisik dewan kudu dingerteni nalika nggunakake piranti kasebut. Faktor kasebut kalebu nggayuh isolasi sing pas ing antarane lapisan ndhuwur lan ngisor kanggo nyuda crosstalk lan kontrol EMI ing antarane lapisan sinyal internal.Symmetrically spaced components will help prevent uneven stress on the PCB.

Pay manungsa waé kanggo sinyal, daya lan integritas fisik

Saliyane nambah integritas sinyal, sampeyan uga bisa nambah integritas daya. Amarga HDI PCB mindhah lapisan grounding luwih cedhak karo permukaan, integritas daya luwih apik. Lapisan ndhuwur papan duwe lapisan grounding lan lapisan power supply, sing bisa disambungake menyang lapisan grounding liwat bolongan buta utawa mikroholes, lan nyuda jumlah bolongan pesawat.

HDI PCB nyuda jumlah bolongan liwat lapisan njero papan. In turn, reducing the number of perforations in the power plane provides three major advantages:

Wilayah tembaga sing luwih gedhe ngemot arus AC lan DC menyang pin daya chip

L resistance decreases in the current path

L Amarga induktansi sing kurang, arus switching sing bener bisa maca pin daya.

Titik utama diskusi yaiku njaga jembar baris minimal, jarak sing aman lan keseragaman trek. Ing masalah pungkasan, wiwiti entuk ketebalan tembaga seragam lan keseragaman kabel sajrone proses desain lan lanjutake karo proses manufaktur lan manufaktur.

Kekurangan jarak sing aman bisa nyebabake residu film sing gedhe banget sajrone proses film garing internal, sing bisa nyebabake sirkuit cendhak. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Tim desain lan pabrikan uga kudu nimbang njaga keseragaman trek minangka cara ngontrol impedansi garis sinyal.

Nggawe lan ngetrapake aturan desain tartamtu

Tata letak kepadatan tinggi mbutuhake dimensi eksternal sing luwih cilik, kabel sing luwih apik lan jarak komponen sing luwih kenceng, mula mbutuhake proses desain sing beda. Proses pabrikan HDI PCB gumantung karo pengeboran laser, piranti lunak CAD lan CAM, proses pencitraan langsung laser, peralatan manufaktur khusus, lan keahlian operator. Sukses kabeh proses gumantung karo aturan desain sing ngenali syarat impedansi, jembar dirijen, ukuran bolongan, lan faktor liyane sing mengaruhi tata letak. Nggawe aturan desain rinci mbantu milih pabrikan utawa pabrikan sing tepat kanggo papan sampeyan lan nyedhiyakake dhasar komunikasi antarane tim.