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BGA IC substrate

Product Name: BGA IC substrate

Plate: Mitsubishi Gas HF BT HL832NX-A-HS

Minimum width / spacing: 30 / 30um

Surface: ENEPIG(2U)

PCB thickness: 0.3mm

Layer: 4Layers

Structure: 1L-4L,1L-2L,3L-4L

Solder mask ink: TAIYO PSR4000 AUS308

Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

Application: BGA IC substrate