In PCB design, wiring momenti est gradus ad perficiendum productum design. Dici potest, quod praecedens praeparatio facienda est. In toto PCB, processus consilio wiring summum terminum habet, artes optimas, maximum inposuit quod inposuit. PCB wiring includit unum quadratum wiring, duplex wiring et multilayer wiring. Duo etiam sunt modi wiring: automatic wiring et interactive wiring. Priusquam automatic wiring, uti potes interactive ad prae filum magis poscentis lineas. Orae initus finis et output finis vitandae sunt vicinae ad parallelas vitandae reflexionis impedimentum. Si opus sit, filum pro solitudine adiciatur, et filum duarum stratorum adiacentium inter se perpendicularis debet. Copula parasitica in parallelis facile occurrat.

The layout rate of automatic routing depends on a good layout. The routing rules can be preset, including the number of bending times, the number of vias, and the number of steps. Generally, explore the warp wiring first, quickly connect the short wires, and then perform the labyrinth wiring. First, the wiring to be laid is optimized for the global wiring path. It can disconnect the laid wires as needed. And try to re-wire to improve the overall effect.

The current high-density PCB design has felt that the through-hole is not suitable, and it wastes a lot of valuable wiring channels. In order to solve this contradiction, blind and buried hole technologies have emerged, which not only fulfill the role of the through-hole It also saves a lot of wiring channels to make the wiring process more convenient, smoother, and more complete. The PCB board design process is a complex and simple process. To master it well, a vast electronic engineering design is required. Only when personnel experience it by themselves can they get the true meaning of it.

I treatment of power supply and ground wire .

Even if the wiring in the entire PCB board is completed very well, the interference caused by the improper consideration of the power supply and the ground wire will reduce the performance of the product, and sometimes even affect the success rate of the product. Therefore, the wiring of the electric and ground wires should be taken seriously, and the noise interference generated by the electric and ground wires should be minimized to ensure the quality of the product.

Every engineer who is engaged in the design of electronic products understands the cause of the noise between the ground wire and the power wire, and now only the reduced noise suppression is described:

(1) It is well known to add a decoupling capacitor between the power supply and ground.

(2) Dilatet latitudinem potentiae et filis humus quam maxime, potius filum filum latius quam filum potentiae, eorum relatio est: filum humus> potentia filum> signum filum, plerumque signum filum latitudo est: 0.2～ 0.3mm, latitudo tenuissima attingere potest 0.05～0.07mm, et funiculus potentia est 1.2～2.5 mm.

For the PCB of the digital circuit, a wide ground wire can be used to form a loop, that is, to form a ground net to use (the ground of the analog circuit cannot be used in this way)

(3) Magna area aeris iacuit ut filum humum utere, et insueta loca in circumitu tabulae impressae ad terram sicut filum humum coniunge. Vel potest fieri in tabula multilay, et potentia copia et filis humi singulas ordines occupant.

2 Common ground processing of digital circuit and analog circuit

Many PCBs are no longer single-function circuits (digital or analog circuits), but are composed of a mixture of digital and analog circuits. Therefore, it is necessary to consider the mutual interference between them when wiring, especially the noise interference on the ground wire.

Circuitus digitalis frequentia est altus, et sensibilitas analogi circuii est fortis. Siquidem signum lineae, quae summus frequentiae signum lineae fieri potest, a sensitivo analogo circuii notam esse potest. For the ground line, the whole PCB has only one node to the extra, so The problem of digital and analog the common ground must be deals with intra in PCB, and the digital ground and analog ground within the board are actually separate and they are. non inter se connexa, sed per interfaciem (ut plugae, etc.) PCB cum externo connectens. Brevis connexio inter terram digitalem et analog terram. Placere note punctum unum tantum nexum esse. Sunt etiam rationes non communes in PCB, quae per consilium systematis determinatur.

3 Signum linea super stratum electricum positum est

In multi-strati tabulae impressae wiring, quia non multa fila supersunt in strato signo dato quod non positum est, additis pluribus stratis vastum faciet et augebit quod inposuit productio, et sumptus augebunt. Ad hanc contradictionem solvendam, considerare potes wiring in strato electrico (terrae). Accumsan esse sit prima virtus, et accumsan humo secundum. Quia optimum est conservare integritatem formationis.

4 Treatment of connecting legs in large area conductors

In magna-area fundationis (electricitatis), crura partium communium ei annexa sunt. Curatio connexionis crurum comprehendi debet. Secundum electrica effectum, melius est pads crurum componentium cum superficie aeris coniungere. Pericula latent in glutino et in conventu partium commodis quaedam sunt, ut: ① Welding calentium potentia requirit summus. ② Virtualis solida compages causare facile est. Ideo tam electricae operationis quam processus requisita fiunt in transversos pads, clypeos caloris vocati, vulgo pads thermas (Thermal), ut solida virtualis compages generari possint propter nimiam sectionem caloris in solidatorio. Sexus valde deminutus est. Eadem processus potentiae cruris multilayer in tabula est.

5 Munus systematis retis in cabling

In many CAD systems, wiring is determined by the network system. The grid is too dense and the path has increased, but the step is too small, and the amount of data in the field is too large. This will inevitably have higher requirements for the storage space of the device, and also the computing speed of the computer-based electronic products. Great influence. Some paths are invalid, such as those occupied by the pads of the component legs or by mounting holes and fixed holes. Too sparse grids and too few channels have a great impact on the distribution rate. Therefore, there must be a well-spaced and reasonable grid system to support the wiring.

The distance between the legs of standard components is 0.1 inches (2.54mm), so the basis of the grid system is generally set to 0.1 inches (2.54 mm) or an integral multiple of less than 0.1 inches, such as: 0.05 inches, 0.025 inches, 0.02 Inches etc.

6 Design Rule Check (DRC)

Expleto consilio wiring, diligenter inspicias oportet utrum consilium wiring occurrat regulas ab designatore statutas, et simul, necesse est ad confirmandum num regulae propositae cum exigentiis processus edificationis tabulae impressae. Inspectio generalis habet sequentes aspectus:

(1) Utrum intervallum inter lineam et lineam, et per lineam et codex componens, linea et per foramen, codex componens et per foramen, per foramen et per foramen, ratio sit, et an productio occurrat requisita.

Secundo, utrum latitudo virtutis sit conveniens linea et terra. Estne potestas copia et linea humus arcte copulata? Estne locus in PCB ubi filum humus ampliari potest?

(3) Utrum optimae mensurae ductae sint pro clavibus lineae signo, ut brevissimae longitudinis, linea tutelae addatur, et linea input et linea output distincte distinguantur.

(4.) Utrum fila terrae sint separatae pro ambitu analogi et circuli digitalis.

(5) Utrum graphicae (ut icones et annotationes) ad PCB additae brevissimo ambitu signum faciam.

(6) Modificare aliquas commoditates figuras lineares.

(7) Is there a process line on the PCB? Whether the solder mask meets the requirements of the production process, whether the solder mask size is appropriate, and whether the character logo is pressed on the device pad, so as not to affect the quality of the electrical equipment.

(8) Utrum in margine exteriore potentiae terrae iacuit in tabula multilateri reducitur, ita ut bracteae cupreae potentiae humi iacuit extra tabulam expositae, quae brevem ambitum causant.