SiP package IC Substrate PCB Board

Product Name: SiP Package Substrate

Material: Shengyi SI10U

Layers: 6L

Thickness: 0.5-0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.075/0.1mm

Minimum line distance: 30um

Minimum line width: 50um

Application: SiP package IC Substrate PCB Board