Everyone knows how to prevent PCB bending and board warping from going through the reflow furnace. The following is an explanation for everyone:

1. Reduce the influence of temperature on PCB board stress

Satria ny “temperature” no tena fototry ny adin-tsain’ny birao, raha toa ka mihena ny mari-pana amin’ny lafaoro reflow na mihena ny tahan’ny hafanana sy ny fampangatsiahana ny solaitrabe ao amin’ny lafaoro reflow, dia mety ho be dia be ny fisehoan’ny fiondrika sy ny warpage. mihena. Na izany aza, mety hisy vokany hafa, toy ny solder short circuit.

2. Mampiasa takelaka Tg avo

Ny Tg dia ny mari-pana fifindran’ny vera, izany hoe ny mari-pana amin’ny fiovan’ny fitaovana avy amin’ny toetran’ny fitaratra mankany amin’ny fanjakana fingotra. Ny ambany ny sandan’ny Tg amin’ny fitaovana, ny haingana kokoa ny birao dia manomboka manalefaka rehefa avy niditra tao amin’ny lafaoro reflow, ary ny fotoana tokony ho lasa malefaka fingotra fanjakana Ho lasa lava kokoa, ary ny deformation ny birao dia mazava ho azy ho matotra kokoa. . Ny fampiasana takelaka Tg avo kokoa dia mety hampitombo ny fahafahany manohitra ny adin-tsaina sy ny fanimbana, fa ny vidin’ny fitaovana dia somary avo.

3. Ampitomboy ny hatevin’ny board circuit

In order to achieve the purpose of lighter and thinner for many electronic products, the thickness of the board has left 1.0mm, 0.8mm, and even a thickness of 0.6mm. It is really difficult for such a thickness to keep the board from deforming after the reflow furnace. It is recommended that if there is no requirement for lightness and thinness, the board* can use a thickness of 1.6mm, which can greatly reduce the risk of bending and deformation of the board.

4. Reduce the size of the circuit board and reduce the number of puzzles

Since most of the reflow furnaces use chains to drive the circuit board forward, the larger the size of the circuit board will be due to its own weight, dent and deformation in the reflow furnace, so try to put the long side of the circuit board as the edge of the board. On the chain of the reflow furnace, the depression and deformation caused by the weight of the circuit board can be reduced. The reduction in the number of panels is also based on this reason. Low dent deformation.

5. Lafaoro efa nampiasaina

If the above methods are difficult to achieve, *reflow carrier/template is used to reduce the amount of deformation. The reason why the reflow carrier/template can reduce the bending of the plate is because it is hoped whether it is thermal expansion or cold contraction. The tray can hold the circuit board and wait until the temperature of the circuit board is lower than the Tg value and start to harden again, and can also maintain the size of the garden.

Raha toa ka tsy afaka mampihena ny fiovaovan’ny boards ny pallet tokana, dia tsy maintsy asiana fonony mba hamehezana ny boards amin’ny pallets ambony sy ambany. Izany dia afaka mampihena be ny olana amin’ny faritra deformation board amin’ny alalan’ny lafaoro reflow. Na izany aza, ity lovia lafaoro ity dia lafo be, ary tsy maintsy apetraka amin’ny tanana sy manodina azy.

6. Ampiasao ny router fa tsy V-Cut raha hampiasa ny zana-kazo
Koa satria ny V-Cut dia handrava ny tanjaky ny tontolon’ny tontonana eo anelanelan’ny boards circuit, andramo ny tsy hampiasa ny zana-kazo V-Cut na hampihenana ny halalin’ny V-Cut.