Foto-kevitra fototra ny Birao PCB

1. Ny foto-kevitry ny “Layer”
Mitovy amin’ny foto-kevitry ny “sosona” nampidirina tamin’ny fanodinana teny na rindrambaiko maro hafa mba hahatsapana ny fanaingoana sy ny fampifangaroana ny sary, soratra, loko, sns., Ny “sosona” an’ny Protel dia tsy virtoaly, fa ny fitaovana vita pirinty tena izy amin’ny endriny isan-karazany. varahina foil sosona. Amin’izao fotoana izao, noho ny fametrahana matevina ny singa elektronika. Fepetra manokana toy ny anti-interference sy wiring. Ny takelaka vita pirinty ampiasaina amin’ny vokatra elektronika vaovao dia tsy vitan’ny hoe manana sisiny ambony sy ambany ho an’ny tariby, fa manana foil varahina interlayer izay azo karakaraina manokana eo afovoan’ny boards. Ohatra, ny motherboards amin’izao fotoana izao dia ampiasaina. Ny ankamaroan’ny fitaovana vita pirinty dia mihoatra ny 4 sosona. Satria somary sarotra ny fanodinana ireo sosona ireo, dia matetika izy ireo no ampiasaina hananganana ireo sosona tariby herinaratra miaraka amin’ny tariby tsotra kokoa (toy ny Ground Dever sy Power Dever ao amin’ny rindrambaiko), ary matetika mampiasa fomba famenoana faritra midadasika ho an’ny tariby (toy ny ExternaI). P1a11e ary Fenoy ny rindrambaiko). ). Raha mila ampifandraisina ny sosona ambony sy ambany ary ny sosona afovoany, dia ampiasaina hifandraisana ny antsoina hoe “vias” voalaza ao amin’ny rindrambaiko. Miaraka amin’ny fanazavana etsy ambony, dia tsy sarotra ny mahatakatra ny hevitra mifandray amin’ny “multi-layer pad” sy ny “wiring layer setting”. Mba hanomezana ohatra tsotra, maro ny olona nahavita ny wiring ary nahita fa maro amin’ireo terminal mifandray no tsy manana pad rehefa vita pirinty. Raha ny marina, izany dia satria tsy noraharahain’izy ireo ny foto-kevitry ny “sosona” rehefa nanampy ny tranomboky fitaovana izy ireo ary tsy nanao sary sy fonosan-tena. Ny toetra mampiavaka ny pad dia faritana ho “Multilayer (Mulii-Layer). Tokony hotsarovana fa rehefa voafantina ny isan’ny sosona amin’ny solaitrabe ampiasaina dia ataovy izay hanakatona ireo sosona tsy ampiasaina ireo mba hisorohana ny olana sy ny fivilian-dalana.

2. Via (Via)

dia ny tsipika mampifandray ny sosona, ary ny lavaka iombonana dia nodorana ao amin’ny Wenhui ny tariby izay mila mifandray amin’ny sosona tsirairay, izay ny amin’ny alalan’ny lavaka. Ao anatin’izany dingana izany, misy sosona metaly voapetaka eo amin’ny cylindrical surface amin’ny rindrin’ny lavaka amin’ny alàlan’ny fametrahana simika mba hampifandraisana ny foil varahina izay mila mifandray amin’ny sosona afovoany, ary ny sisiny ambony sy ambany amin’ny via dia natao. amin’ny endrika pad tsotra, izay azo mivantana dia mifandray amin’ny tsipika eo amin’ny sisiny ambony sy ambany, na tsy mifandray. Amin’ny ankapobeny, misy ireto fitsipika manaraka ireto amin’ny fitsaboana ny vias rehefa mamolavola faritra:
(1) Minimize the use of vias. Once a via is selected, be sure to handle the gap between it and the surrounding entities, especially the gap between the lines and the vias that are easily overlooked in the middle layers and the vias. If it is Automatic routing can be solved automatically by selecting the “on” item in the “Minimize the number of vias” (Via Minimiz8TIon) submenu.
(2) The larger the current-carrying capacity required, the larger the size of the required vias. For example, the vias used to connect the power layer and ground layer to other layers will be larger.

3. silk screen layer (Overlay)

In order to facilitate the installation and maintenance of the circuit, the required logo patterns and text codes are printed on the upper and lower surfaces of the printed board, such as component label and nominal value, component outline shape and manufacturer logo, production date, etc. When many beginners design the relevant content of the silk screen layer, they only pay attention to the neat and beautiful placement of the text symbols, ignoring the actual PCB effect. On the printed board they designed, the characters were either blocked by the component or invaded the soldering area and wiped off, and some of the components were marked on the adjacent components. Such various designs will bring a lot to assembly and maintenance. inconvenient. The correct principle for the layout of the characters on the silk screen layer is: “no ambiguity, stitches at a glance, beautiful and generous”.

4. Ny mampiavaka ny SMD

There are a large number of SMD packages in the Protel package library, that is, surface soldering devices. The biggest feature of this type of device in addition to its small size is the single-sided distribution of pin holes. Therefore, when choosing this type of device, it is necessary to define the surface of the device to avoid “missing pins (Missing Plns)”. In addition, the relevant text annotations of this type of component can only be placed along the surface where the component is located.

5. Grid-like filling area (External Plane) and filling area (Fill)

Tahaka ny anaran’izy roa, ny faritra famenoana miendrika tambajotra dia ny fanodinana faritra lehibe amin’ny foil varahina ho tambajotra, ary ny faritra famenoana ihany no mitazona ny foil varahina. Matetika ny vao manomboka dia tsy mahita ny fahasamihafana misy eo amin’izy roa eo amin’ny solosaina amin’ny fizotran’ny famolavolana, raha ny marina, raha toa ianao ka manao zoom in dia afaka mahita izany amin’ny indray mitopy maso. Ny tena marina dia satria tsy mora ny mahita ny fahasamihafana misy eo amin’ny roa tonta amin’ny fotoana mahazatra, ka rehefa mampiasa azy dia vao mainka tsy mitandrina ny manavaka ny roa. Tokony hohamafisina fa ny voalohany dia manana fiantraikany mahery vaika amin’ny fanafoanana ny fitsabahana matetika amin’ny toetran’ny faritra, ary mety amin’ny filana. Toerana feno faritra midadasika, indrindra rehefa misy faritra sasany ampiasaina ho faritra voaaro, faritra voazara, na tariby misy herinaratra mahery vaika no tena mety. Ity farany dia matetika ampiasaina amin’ny toerana izay ilana faritra kely toy ny fiafaran’ny tsipika ankapobeny na faritra mihodina.

6. Pad

Ny pad no foto-kevitra mifandray matetika sy manan-danja indrindra amin’ny famolavolana PCB, fa ireo vao manomboka dia tsy miraharaha ny fisafidianana sy ny fanovana azy, ary mampiasa pads boribory amin’ny endrika mitovy. Ny fifantenana ny karazana pad amin’ny singa dia tokony handinika tanteraka ny endrika, ny habeny, ny fisehon’ny vibration sy ny hafanana ary ny fitarihana ny hery. Protel dia manome andiana pads samy hafa habe sy endrika ao amin’ny trano famakiam-boky fonosana, toy ny boribory, efamira, octagonal, boribory ary positioning pads, fa indraindray tsy ampy izany ary mila ovain’ny tenanao. Ohatra, ho an’ny pad izay miteraka hafanana, iharan’ny adin-tsaina bebe kokoa, ary amin’izao fotoana izao, dia azo natao ho “endrika ranomaso”. Ao amin’ny loko mahazatra TV PCB tsipika Output transformer Pin pad famolavolana, maro ny mpanamboatra no fotsiny amin’ity endrika ity. Amin’ny ankapobeny, ho fanampin’ireo voalaza etsy ambony ireo, ireto fitsipika manaraka ireto dia tokony hodinihina rehefa manitsy ny pad irery ianao:

(1) Rehefa tsy mifanaraka amin’ny halavany ny endrika, dia diniho ny fahasamihafana misy eo amin’ny sakan’ny tariby sy ny halavan’ny lafiny manokana amin’ny pad tsy lehibe loatra;

(2) Matetika dia ilaina ny mampiasa pads asymmetrika amin’ny halavan’ny asymmetrika rehefa mandehandeha eo anelanelan’ny zoro fitarihana singa;

(3) Ny haben’ny lavaka pad singa tsirairay dia tokony ovaina sy voafaritra manokana araka ny hatevin’ny tsimatra singa. Ny fitsipika dia ny haben’ny lavaka dia 0.2 hatramin’ny 0.4 mm lehibe kokoa noho ny savaivony pin.

7. Various types of membranes (Mask)

Ireo sarimihetsika ireo dia tsy ilaina fotsiny amin’ny fizotran’ny famokarana PcB, fa koa fepetra ilaina amin’ny lasantsy singa. Araka ny toerana sy ny fiasan’ny “membrane”, ny “membrane” dia azo zaraina ho singa ambonin’ny (na solder surface) soldering saron-tava (TOP na Ambany) sy ny singa ambonin’ny (na solder surface) solder saron-tava (TOp na BottomPaste Mask). . Araka ny dikan’ny anarana, ny sarimihetsika soldering dia sosona sarimihetsika izay ampiharina amin’ny pad mba hanatsarana ny solderability, izany hoe, ny faribolana mazava loko eo amin’ny birao maitso dia somary lehibe kokoa noho ny pad. Ny toe-javatra ny solder saron-tava dia ny mifanohitra amin’izany, satria Mba hampifanaraka ny vita birao amin’ny onjam-pandrefesana sy ny fomba soldering hafa, dia ilaina ny varahina foil amin’ny non-pad eo amin’ny solaitrabe tsy azo tinned. Noho izany dia tsy maintsy apetaka amin’ny faritra rehetra ankoatry ny pad ny sosona loko, mba tsy hidiran’ny vifotsy amin’ireo faritra ireo. Hita fa ao anatin’ny fifandraisana mifameno ireo membrane roa ireo. Avy amin’ity fifanakalozan-kevitra ity dia tsy sarotra ny mamaritra ny sakafo
Ny singa toy ny “Solder Mask En1argement” dia napetraka.

8. Ny tsipika manidina, ny tsipika manidina dia manana dikany roa:

(1) Fifandraisana tambajotra toy ny fingotra ho an’ny fijerena mandritra ny fametahana automatique. Aorian’ny famenoana ireo singa amin’ny alàlan’ny latabatry ny tamba-jotra sy ny fanaovana drafitra mialoha dia azonao atao ny mampiasa ny “Asehoy ny baiko” mba hijerena ny satan’ny fifandraisana amin’ny tamba-jotra eo ambanin’ny layout , Ahitsio tahan’ny lalana. Tena zava-dehibe io dingana io. Azo lazaina hoe maranitra ny antsy fa tsy manapa-kazo ho diso. Mitaky fotoana sy lanjany bebe kokoa izany! Ankoatra izany, rehefa vita ny wiring automatique, izay tambajotra mbola tsy napetraka, dia azonao atao koa ny mampiasa ity asa ity mba hahitana. Rehefa avy nahita ny tambajotra tsy mifandray dia azo onitra amin’ny tanana. Raha tsy azo onitra izany dia ampiasaina ny dikany faharoa amin’ny “tsipika manidina”, dia ny mampifandray ireo tambajotra ireo amin’ny tariby eo amin’ny solaitrabe vita pirinty ho avy. Tokony hiaiky fa raha ny biraon’ny fitetezam-paritra dia famokarana tsipika mandeha ho azy faobe, ity fitarihana manidina ity dia azo natao ho singa fanoherana miaraka amin’ny sandan’ny fanoherana 0 ohm sy ny elanelan’ny pad fanamiana.