Ny maha-zava-dehibe ny PCB miovaova cannot be underestimated in PCB manufacturing. Ny antony iray dia ny fironana mankany amin’ny miniaturization. Ankoatr’izay, ny fangatahana PCBS henjana dia mihamitombo noho ny fahamendrehana sy ny fiasan’ny fivorian’ny 3D. Na izany aza, tsy ny mpanamboatra PCB rehetra no mahay mihaona ny fizotry ny famokarana PCB sarotra sy hentitra. Ny takelaka boribory vita pirinty matevina dia vita amin’ny alàlan’ny fomba iray izay mampihena ny hatevin’ny tabilao henjana ho 0.25mm +/- 0.05mm. Io kosa dia mamela ny solaitrabe hampiasaina amin’ny rindranasa izay mitaky ny hiondranan’ny tabilao sy ny fametrahana azy ao anaty trano. The plate can be used for one-time bending installation and multi-bending installation.

Ity misy topy maso ny sasany amin’ireo toetra mampiavaka azy:

FR4 semi – toetra PCB malefaka

L Ny toetra manan-danja indrindra izay mety indrindra amin’ny fampiasanao azy dia ny malefaka sy afaka mifanaraka amin’ny habaka misy.

L Its versatility is increased by the fact that its flexibility does not impede its signal transmission.

L Maivana ihany koa.

Amin’ny ankapobeny, PCBS semi-malefaka dia fantatra ihany koa amin’ny vidiny lafo indrindra satria ny fizotran’ny famokarana azy ireo dia mifanaraka amin’ny fahaizan’ny mpamokatra efa misy.

L Samy mamonjy ny fotoana famolavolana sy ny fotoana ihaonana izy ireo.

L Izy ireo dia mpisolo tena azo atokisana indrindra, tsy izany indrindra satria misoroka olana maro izy ireo, ao anatin’izany ny fikorontanana sy ny fantsona.

Fomba fanaovana PCB

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Amin’ny ankapobeny dia mandrakotra ireto manaraka ireto ny fizotrany:

L fanapahana fitaovana

L Saron-tsarimihetsika maina

L Fanaraha-maso optika mandeha ho azy

L Browning

L laminated

Fanadinana taratra X-ray

Fitrandrahana

L electroplating

L Fanovana sary

L etching

L Fanontana amin’ny efijery

L Fanaparitahana sy fampandrosoana

L farany vita

L ny fanodinana fanaraha-maso ny halaliny

L Fitsapana herinaratra

L fanaraha-maso kalitao

Fonosana L

Inona avy ireo olana sy vahaolana mety amin’ny fanamboarana PCB?

Ny olana lehibe amin’ny famokarana dia ny fiantohana ny fandeferana amin’ny familiana ny familiana. Zava-dehibe ihany koa ny fiantohana fa tsy misy triatra resin na famonoana solika mety hiteraka olana ara-kalitao. Izany dia midika hoe manamarina ity manaraka ity mandritra ny familiana fanaraha-maso lalina:

L matevina

L Resin atiny

L fandeferana mihodina

Fitsapana fikosoham-bary fanodinana lalina A

Ny fikosoham-bary dia natao tamin’ny alàlan’ny fomba fanaovana saritany mba hanarahana ny hatevin’ny 0.25 mm, 0.275 mm ary 0.3 mm. Aorian’ny famoahana ny tabilao, hosedraina izy raha toa ka mahatanty ny fametahana 90 degre. Amin’ny ankapobeny, raha 0.283mm ny hateviny sisa, dia heverina ho simba ny fibre vera. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Fitsapana fanodinana ny fifehezana ny halalin’ny B

Miorina amin’ny voalaza etsy ambony, ilaina ny miantoka ny hatevin’ny varahina 0.188mm ka hatramin’ny 0.213mm eo anelanelan’ny sosona sakana solder sy L2. Mila fitandremana araka ny tokony ho izy ihany koa ny amin’ny ady mety hitranga, izay misy fiantraikany amin’ny fitoviana matevina amin’ny ankapobeny.

Fitsapana fikosoham-bary fanodinana lalina C

Ny fikolokoloana ny halalin’ny fanambadiana dia zava-dehibe mba hahazoana antoka fa ny refy dia napetraka tamin’ny 6.3 “x10.5” taorian’ny famoahana ny prototype tontonana. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.