Raha ny teknolojia maoderina dia mitombo haingana dia haingana izao tontolo izao, ary ny fitaomana azy dia afaka milalao mora foana amin’ny fiainantsika andavanandro. The way we live has changed dramatically and this technological advance has led to many advanced devices that we didn’t even think of 10 years ago. Ny fototr’ireto fitaovana ireto dia ny injeniera elektrika, ary ny fotony dia pirinty boribory pirinty (PCB).

Maitso ny PCB ary vatana henjana misy singa elektronika isan-karazany eo amboniny. These components are welded to the PCB in a process called “PCB assembly” or PCBA. Ny PCB dia misy substrate vita amin’ny fiberglass, sosona varahina izay mamorona ny soritry, lavaka mandrafitra ilay singa, ary ireo sosona mety ho anatiny sy ivelany. Ao amin’ny RayPCB, afaka manome sosona hatramin’ny 1-36 izahay ho an’ny PROTOTYPES marobe sy sosona 1-10 ho an’ny andiam-PCB marobe amin’ny famokarana volavola. For single-sided and double-sided PCBS, an outer layer exists but no inner layer.

The substrate and components are insulated with solder film and held together with epoxy resin.The welding mask can be green, blue or red, as is common in PCB colors. Ny saron-tava fehin-kibo dia hamela ilay singa hialana amin’ny fivezivezena fohy amin’ny làlana na singa hafa.

Ny dian-kazo varahina dia ampiasaina handefasana ireo signal elektronika manomboka amin’ny teboka iray mankany amin’ny iray hafa amin’ny PCB. These signals can be high-speed digital signals or discrete analog signals. Ireo tariby ireo dia azo atao matevina mba hanomezana hery / herinaratra ho an’ny famatsiana herinaratra.

Amin’ny ankabeazan’ny PCBS izay manome herinaratra na fivoarana avo lenta, dia misy fiaramanidina mitokana misaraka. Components on the top layer are connected to the internal GND plane or internal signal layer via “Vias”.

Ireo singa dia mivondrona ao amin’ny PCB ahafahan’ny PCB miasa araka ny namboarina. The most important thing is PCB function. Na dia tsy apetraka tsara aza ny fanoherana SMT bitika kely, na na tapaka aza ny lalana kely avy amin’ny PCB dia mety tsy mandeha ny PCB. Noho izany, zava-dehibe ny fanangonana singa amin’ny fomba mety. Ny PCB rehefa manangona singa dia antsoina hoe PCBA na PCB fivoriambe.

Miankina amin’ny famaritana nofaritan’ny mpanjifa na ny mpampiasa, ny asan’ny PCB dia mety ho sarotra na tsotra. PCB size also varies according to requirements.

The PCB assembly process has both automatic and manual processes, which we will discuss.

PCB sosona sy famolavolana

Araka ny voalaza etsy ambony, misy sosona famantarana marobe eo amin’ireo sosona ivelany. Now we will discuss the types of outer layers and functions.

Understand PCB board assembly process and feel the green charm of PCBD

1 – Substrate: Ity dia lovia henjana vita amin’ny fitaovana FR-4 izay “feno” na lasitra ny singa. Izany dia manome henjana ho an’ny PCB.

2- Copper layer: Thin copper foil is applied to the top and bottom of the PCB to make the top and bottom copper trace.

3- Saron-tava vy: ampiharina amin’ny sosona ambony sy ambany amin’ny PCB izy io. This is used to create non-conducting areas of the PCB and insulate the copper traces from each other to protect against short circuits. Ny maska ​​lasitra koa dia misoroka ny fantson-javatra tsy ilaina ary miantoka fa miditra ao amin’ilay faritra ny welding, toy ny lavaka sy pad. These holes connect the THT component to the PCB while the PAD is used to hold the SMT component.

4- Screen: The white labels we see on PCBS for component codes, such as R1, C1 or some description on PCBS or company logos, are all made of screen layers. Ny sosona lamba dia manome fampahalalana lehibe momba ny PCB.

There are 3 types of PCBS according to the substrate classification

1- Rigid PCB:

PCB no ankamaroan’ny fitaovana PCB hitantsika amin’ny karazana PCB isan-karazany. Ireo dia PCBS mafy, henjana ary mafy, samy hafa ny hateviny. The main material is fiberglass or simple “FR4”. FR4 dia midika hoe “flame retarder-4”. Ny toetra mampamono tena an’ny FR-4 dia mahatonga azy io hampiasaina amin’ny fitaovana elektronika indostrialy mafy orina. The FR-4 has thin layers of copper foil on both sides, also known as copper-clad laminates. Ny laminate varahina Fr-4 dia ampiasaina matetika amin’ny fanamafisam-pahefana, famatsiana herinaratra maody, mpamily maotera servo, sns. Etsy an-danin’izany, ny substrat PCB henjana iray hafa izay matetika ampiasaina amin’ny fitaovana ao an-tokantrano sy ireo vokatra IT dia antsoina hoe PCB phenolic taratasy. Izy ireo dia maivana, ambany hakitroka, mora vidy ary mora totohondry. Ny calculator, ny keyboard ary ny totozy dia isan’ny fampiharana azy.

2- Flexible PCB:

Made from substrate materials such as Kapton, flexible PCBS can withstand very high temperatures while being as thick as 0.005 inches. It can be easily bent and used in connectors for wearable electronics, LCD monitors or laptops, keyboards and cameras, etc.

3-metal core PCB:

In addition, another PCB substrate can be used like aluminum, which is very efficient for cooling.Ireo karazana PCBS ireo dia azo ampiasaina amin’ny rindranasa izay mitaky singa mafana toy ny leds mahery, diode laser, sns.

Installation technology type:

SMT: SMT dia midika hoe “haitao ambony”. Ireo singa SMT dia tena kely habe ary misy fonosana isan-karazany toy ny 0402,0603 1608 ho an’ny resistatera sy capacitor. Toy izany koa, ho an’ny circuit circuit ics, manana SOIC, TSSOP, QFP ary BGA izahay.

Ny fivorian’ny SMT dia tena sarotra ho an’ny tanan’olombelona ary mety ho fizotry ny fikarakarana fotoana, noho izany dia ny robot pickup sy automatique automatique no manao azy.

THT: THT dia mijoro amin’ny haitao mandroso. Components with leads and wires, such as resistors, capacitors, inductors, PDIP ics, transformers, transistors, IGBT, MOSFET, etc.

The components must be inserted on one side of the PCB on one component and pulled by the leg on the other side, cut the leg and welded. THT assembly is usually done by hand welding and is relatively easy.

Fepetran’ny fizotran’ny fivoriana:

Prior to the actual PCB fabrication and PCB assembly process, the manufacturer checks the PCB for any defects or errors in the PCB that could cause the failure. This process is called the Manufacturing design (DFM) process. Ireo mpanamboatra dia tsy maintsy manatanteraka ireo dingana DFM ifotony mba hahazoana antoka fa tsy misy kilema PCB.

1- Component layout considerations: Through-holes must be checked for components with polarity. Like electrolytic capacitors must be checked polarity, diode anode and cathode polarity check, SMT tantalum capacitor polarity check. Ny làlan’ny lohany / lohany IC dia tsy maintsy voamarina.

Ny singa mitaky ny filentehan’ny hafanana dia tokony hanana toerana ampy handraisana ireo singa hafa mba tsy hikasika ny fidinan’ny hafanana.

2-Hole and through-hole spacing:

The spacing between holes and between holes and traces should be checked. Tsy tokony hifanindry ny rindrina sy ny lavaka.

3- Brazing pad, thickness, line width shall be taken into account.

By performing DFM inspections, manufacturers can easily reduce manufacturing costs by reducing the number of scrap panels. This will help in fast steering by avoiding DFM level failures. At RayPCB, we provide DFM and DFT inspection in circuit assembly and prototyping. Ao amin’ny RayPCB, mampiasa fitaovana OEM manara-penitra izahay hanomezana tolotra PCB OEM, fametahana onja, fitsapana karatra PCB ary fivoriambe SMT.

Dingana tsikelikely PCB Assembly (PCBA):

Dingana 1: asio apetaka solder amin’ny alàlan’ny modely

First, we apply solder paste to the area of the PCB that fits the component. This is done by applying solder paste to the stainless steel template. Ny môdely sy ny PCB dia miaraka amina fampitaovana mekanika, ary ny paty solder dia ampiharina tsara amin’ny varavarana rehetra ao amin’ny solaitrabe amin’ny alàlan’ny mpangataka iray. Apply solder paste evenly with applicator. Noho izany dia tokony hampiasaina ao amin’ny mpangataka ny pacte solder mety. Rehefa esorina ny mpangataka dia hijanona ao amin’ny faritra irian’ny PCB ny paty. Mametaka solika miloko 96.5% vita amin’ny tin, misy volafotsy 3% sy varahina 0.5%, maimaim-poana. After heating in Step 3, the solder paste will melt and form a strong bond.

Step 2: Automatic placement of components:

Ny dingana faharoa amin’ny PCBA dia ny fametrahana ireo singa SMT ao amin’ny PCB. Izany dia atao amin’ny alàlan’ny fampiasana robot pick and place. Amin’ny ambaratonga famolavolana, mamorona rakitra ny mpamorona ary manome izany ho an’ny robot mandeha ho azy. Ity rakitra ity dia manana ny fandrindrana X, Y efa voalamina mialoha ho an’ny singa tsirairay ampiasaina ao amin’ny PCB ary mamaritra ny toerana misy ireo singa rehetra. Using this information, the robot only needs to place the SMD device accurately on the board. The pick and place robot will pick up components from its vacuum fixture and place them accurately on the solder paste.

Talohan’ny fahatongavan’ireo milina pickotic robotic sy fametrahana azy, ny teknisiana dia haka singa mampiasa tweezers ary hametraka azy ireo ao amin’ny PCB amin’ny alàlan’ny fijerena tsara ny toerana misy azy ireo ary hialana amin’ny tanan-tànana. This results in high levels of fatigue and poor vision for technicians, and leads to a slow PCB assembly process for SMT parts. Ka ny mety ho lesoka dia avo.

Rehefa matotra ny teknolojia, ny robot mandeha ho azy izay mandray sy mametraka singa dia mampihena ny enta-mavesatry ny teknisiana, ahafahan’ny fametrahana singa haingana sy marina. Ireo robot ireo dia afaka miasa 24/7 tsy misy havizanana.

Dingana 3: welding mihodina

The third step after setting up the elements and applying the solder paste is reflux welding. Reflow welding is the process of placing the PCB on a conveyor belt with components. The conveyor then moves the PCB and components into a large oven, which produces a temperature of 250 o C. Ny mari-pana dia ampy handrendahana ny solder. Ny solder miempo avy eo mitazona ny singa amin’ny PCB ary mamorona ny mpiray. After high temperature treatment, the PCB enters the cooler. These coolers then solidify the solder joints in a controlled manner. Ity dia hametraka fifandraisana maharitra eo amin’ny singa SMT sy ny PCB. Raha misy PCB misy lafiny roa, araka ny voalaza etsy ambony, ny lafiny PCB misy singa kely na kely kokoa dia hotsaboina aloha manomboka amin’ny dingana 1 ka hatramin’ny 3, ary avy eo mankany amin’ny ilany hafa.

Understand PCB board assembly process and feel the green charm of PCBD

Dingana 4: Fanaraha-maso kalitao sy fanaraha-maso

Aorian’ny famolahana refow, azo inoana fa diso ny singa satria misy ny fihetsika tsy mety ao anaty fitoeram-bokatra PCB, izay mety hiteraka fifandraisana fohy na misokatra. These defects need to be identified, and this identification process is called inspection. Ny fanaraha-maso dia azo atao tanana sy mandeha ho azy.

A. Manual check:

Because the PCB has small SMT components, visual inspection of the board for any misalignment or malfunction can cause technician fatigue and eye strain. Noho izany, ity fomba ity dia tsy azo atao amin’ny alàlan’ny tabilao SMT mialoha noho ny valiny tsy marina. Na izany aza, ity fomba ity dia mety amin’ny takelaka misy singa THT sy ny hakitroky ny singa ambany.

B. Detection optika:

Ity fomba ity dia azo atao amin’ny PCBS be dia be. Ny fomba dia mampiasa milina mandeha ho azy miaraka amina fakan-tsary avo lenta sy fakan-tsary avo lenta amin’ny zoro isan-karazany mba hijerena ireo tonon-tsolika avy amin’ny lalana rehetra. Miankina amin’ny kalitaon’ny mpiray solder, ny hazavana dia haneho ny fiarahan’ny solder amin’ny lafiny samihafa. This automatic optical inspection (AOI) machine is very fast and can process large quantities of PCBS in a very short time.

CX – ray inspection:

The X-ray machine allows technicians to scan the PCB to see internal defects. This is not a common inspection method and is only used for complex and advanced PCBS. If not used properly, these inspection methods may result in rework or PCB obsoletion. Mila atao matetika ny fanaraha-maso hisorohana ny fahatarana, ny asa ary ny vidin’ny fitaovana.

Dingana 5: fametahana sy fangejana ny singa THT

Ireo singa amin’ny alàlan’ny lavaka dia mahazatra amin’ny takelaka PCB maro. These components are also called plated through holes (PTH). Ny fitarihan’ireto singa ireto dia handalo lavaka ao amin’ny PCB. Ireo lavaka ireo dia mifandray amin’ny lavaka hafa ary amin’ny alàlan’ny dian-by varahina. Rehefa ampidirina sy atsofoka ao anatin’ireto lavaka ireto ireo singa THT ireo dia mifandray amina elektrika amin’ny lavaka hafa ao amin’ilay PCB mitovy amin’ilay circuit natao izy ireo. These PCBS may contain some THT components and many SMD components, so the welding method described above is not suitable for THT components in the case of SMT components such as reflow welding. Ka ireo karazany roa lehibe amin’ny mpiorina THT izay miraikitra na mivondrona dia

A. Manual welding:

Manual welding methods are common and often require more time than an automated setup for SMT. Matetika ny teknisianina dia tendrena hametraka singa iray isaky ny mandeha ary hampita ny birao amin’ireo teknisianina hafa mampiditra singa hafa ao amin’ilay solaitrabe iray ihany. Noho izany, ny board circuit dia hafindra manodidina ny tsipika fivoriambe hahazoana ny singa PTH hameno azy. Izany no mahatonga ny fizotrany maharitra, ary maro ny orinasan-tsolika PCB sy ny orinasa mpamokatra no tsy mampiasa ny singa PTH amin’ny endriny mihodina. Saingy ny singa PTH dia mijanona ho singa ankafizin’ny ankamaroan’ny mpamorona tariby.

B. Wire soldering:

Ny dikan-teny mandeha ho azy ny welding manual dia welding welding. Amin’ity fomba ity, raha apetraka eo amin’ny PCB ny singa PTH dia apetraka amin’ny fehikibo conveyor ny PCB ary afindra amin’ny lafaoro voatokana. Eto, onjan’ny solder solten no miparitaka ao amin’ny substrate an’ny PCB izay misy ilay singa mitondra. Hofeheziny avy hatrany ny pin rehetra. However, this method only works with single-sided PCBS and not double-sided PCBS, as melted solder on one side of the PCB can damage components on the other. Aorian’io dia afindra ny PCB ho an’ny fizahana farany.

Dingana 6: Fanaraha-maso farany sy fizahan-toetra

PCB dia vonona amin’ny fitsapana sy ny fizahana izao. This is a functional test in which electrical signals and power are given to the PCB at the specified pins and the output is checked at the specified test point or output connector. This test requires common laboratory instruments such as oscilloscopes, digital multimeters, and function generators

Ity fitsapana ity dia ampiasaina hijerena ireo toetra mampiavaka sy mandeha amin’ny herinaratra ao amin’ny PCB ary hanamarina ny endrika ankehitriny, ny herinaratra, ny analog ary ny dizitaly nomerika ary ny famolavolana faribolana voafaritra ao amin’ny PCB takiana

Raha misy ny masontsivana ny PCB mampiseho valiny tsy azo ekena, ny PCB dia hariana na esorina arakaraka ny fomban’ny orinasa mahazatra. Ny dingana fitsapana dia zava-dehibe satria mamaritra ny fahombiazana na ny tsy fahombiazan’ny fizotran’ny PCBA manontolo.

Dingana 7: Fanadiovana farany, famaranana ary fandefasana:

Now that the PCB has been tested in all aspects and declared normal, it is time to clean up unwanted residual flux, finger grime and oil. Fitaovana fanadiovana tosidra miorina amin’ny vy mahery amin’ny alàlan’ny rano deionisialy dia ampy hanadio ireo karazana loto rehetra. Ny rano deionized dia tsy manimba ny fizaran-tany PCB. Aorian’ny fanasana, maina ny PCB amin’ny rivotra voafehy. Ny PCB farany izao dia vonona ho feno entana ary halefa.