Product : IC package substrate
Materjal: Si10u
Saff: 2 Saffi
Ħxuna tar-ram: 12um
Ħxuna rfinuta: 0.2mm
Surface : Gold
Toqba Minima: 0.15mm
Ħxuna tad-deheb 5U
Traċċa Min / Spazju: 40um / 45um
Application : IC package substrate