Rigid Flex PCBA design and manufacturing

Rigid Flex PCBA design and manufacturing

Reinforcing material: glass fiber cloth base

Insulating resin: polyimide resin (PI)

Product thickness: soft plate 0.15mm; Hard board 0.5mm; (tolerance ± 0.03mm)

Single chip size: it can be customized according to customer supplied drawings

Copper foil thickness: 18 μ m(0.5oz)

Solder resist film / oil: yellow film / black film / white film / green oil

Coating and thickness: OSP (12um-36um)

Fire rating: 94-V0

Temperature resistance test: thermal shock 288 ℃ 10sec

Dielectric constant: Pi 3.5; AD 3.9;

Processing cycle: 4 days for samples; 7 days of mass production;

Storage environment: dark and vacuum storage, temperature < 25 ℃, humidity < 70%

مصنوعات جون خاصيتون:

1. iPCB can be customized to process HDI blind hole impedance process and other difficult Rigid Flex PCBA design and manufacturing;

2. Support OEM and ODM OEM, from drawing design to circuit board production and SMT processing, and cooperate with suppliers with one-stop service;

3. Strictly control the quality and meet the ipc2 standard;

اپليڪيشن جو دائرو

Products are widely used in mobile phones, home appliances, industrial control, industry and other fields.