O le a le HDI (High Density Interconnect) PCB laupapa?

High density Interconnect (HDI) PCB, o se ituaiga o gaosiga laupapa matagaluega lolomi (tekinolosi), o le faaaogaina o micro-tauaso pu, tanumia tekinolosi pu, o se laupapa matagaluega ma tulaga maualuga le tufatufaina density. Ona o le faʻaauau pea o le atinaʻeina o tekinolosi mo manaʻoga eletise eletise maualuga, e tatau i le komiti matagaluega ona tuʻuina atu le faʻaogaina o le impedance ma uiga o le ac, maualuga le gafatia o le felauaiga, faʻaitiitia le faʻamalolo le manaʻomia (EMI) ma isi. Fa’aaogā le Stripline, fa’asologa o le Microstrip, e mana’omia ai le fa’asologa o le tele-layer. Ina ia faʻaitiitia le faʻafitauli lelei o le tuʻuina atu o faʻailoga, o mea faʻapipiʻi ma le maualalo o le dielectric coefficient ma le maualalo o le attenuation rate o le a faʻaaogaina. Ina ia fetaui ma le miniaturization ma le seti o mea faaeletonika, o le mamafa o le laupapa matagaluega o le a faateleina pea e faafetaiaia le manaoga.

HDI (high density interconnection) laupapa ta’avale e masani ona aofia ai pu tauaso leisa ma pu tauaso masini;
E masani lava e ala i le tanu o le pu, tauaso pu, overlapping pu, staggered pu, satauro tanumia pu, e ala i le pu, pu tauaso faatumu electroplating, laina manifinifi tamai va, ipu microhole ma isi faiga e ausia ai le conduction i le va o totonu ma fafo laulau, masani o le tauaso e le sili atu ile 6mil le lautele ole tanu.

HDI laupapa matagaluega e vaevaeina i le tele ma soʻo se fesoʻotaʻiga faʻapipiʻi

Fa’atonu muamua HDI fausaga: 1+N+1 (oomi faalua, laser tasi)

Fa’atonuga lona lua HDI fausaga: 2 + N + 2 (oomi mo le 3 taimi, laser mo le 2 taimi)

Fa’atonuga lona tolu HDI fausaga: 3 + N + 3 (oomi 4 taimi, laser 3 taimi) Fa’atonuga lona fa

fausaga HDI: 4+N+4 (oomi 5 taimi, leisa 4 taimi)

Ma so’o se layer HDI