Upu Tomua:

Faatasi ai ma le televave atinae o PCB alamanuia, PCB ua faasolosolo agai agai i le itu o le maualuga le atoatoa laina lelei, laʻititi avanoa, maualuga foliga faʻatusatusa (6: 1-10: 1). O le pu apamemea manaʻomia o 20-25um, ma DF laina mamao ≤4mil laupapa. E masani lava, PCB kamupani i ai le faʻafitauli o le electroplating ata tifaga clamping. Ata tifaga kiliva o le a mafua ai se tuʻusaʻo puʻupuʻu taamilosaga, afaina ai le TASI-TAIMI fua o PCB laupapa ala AOI asiasiga, ogaoga ata tifaga kiliva poʻo manatu le mafai ona toe faʻasaʻo saʻo e mafua ai fasi.

Faʻata ata o le ata electroplating kilipa ata tifaga faʻafitauli:

Faʻafefea ona foia le faʻafitauli o PCB laupapa plating ata tifaga ata

Auiliiliga o le mataupu faavae o PCB laupapa clamping ata tifaga

(1) Afai o le ‘apamemea mafiafia o kalafi electroplating laina e sili atu nai lo le mafiafia o matutu ata, o le a mafua ai ata tifaga clamping. (O le mafiafia ata tifaga mafiafia o lautele fale gaosi PCB o 1.4mil)

(2) Afai o le mafiafia o ‘apamemea ma apa i luga o kalafi electroplating laina sili atu le mafiafia o matutu ata, ata tifaga ono mafua mai.

Auiliiliga ata tifaga clamping laupapa PCB

1. Faigofie e kilipi ata tifaga laupapa ata ma ata

Faʻafefea ona foia le faʻafitauli o PCB laupapa plating kiliva ata tifaga?

In FIG. 3 and FIG. 4, it can be seen from the pictures of the physical plate that the circuit is relatively dense, and there is a large difference between the ratio of length and width in the engineering design and layout, and the adverse current distribution. The minimum line gap of D/F is 2.8mil (0.070mm), the smallest hole is 0.25mm, the plate thickness is 2.0mm, the aspect ratio is 8:1, and the hole copper is required to be more than 20Um. E aofia i le faʻagasologa faigata laupapa.

2. Iloiloina o mafuaʻaga mo le puʻeina o ata

O le taimi nei density o kalafi electroplating e tele ma le apamemea plating e tele mafiafia. There is no edge strip at both ends of the fly bar, and thick film is plated in the high current area. O le sese o le taimi nei o povi e tele atu nai lo le mea moni gaosiga ipu. O le vaalele C / S ma le vaalele S / S e fesoʻotaʻi faʻasolosolo.

Papatusi kilipa ma laʻititi 2.5-3.5mil avanoa.

O le tufatufaina nei o le le toniga, apamemea plating ogāumu mo se taimi umi e aunoa ma le faʻamamaina o le anode. Sese nei (sese sese pe sese eria ipu) O le puipuiga taimi nei o PCB laupapa i apamemea ogāumu e umi tele.

 O le faʻatulagaina o le poloketi e le talafeagai, o le lelei electroplating eria o le poloketi ata e sese, ma isi. PCB board line gap is too small, difficult board line graphics special easy clip film.

Faʻaleleia atili le polokalame mo le ata tifaga

1. faʻaititia le kalafi taimi nei density, talafeagai faʻalautelega o apamemea plating taimi.

2. Faʻateleina le uʻamea apamemea mafiafia o le ipu mafolafola talafeagai, faʻaititia le uʻamea apamemea density o le kalafi talafeagai, ma foliga faʻaititia le uʻamea apamemea mafiafia o le kalafi.

3. O le mafiafia apamemea o le pito i lalo platen ua suia mai 0.5OZ i le 1 / 3oz apamemea ipu pito i lalo. O le plating ‘apamemea mafiafia o le ipu ua faʻateleina e tusa ma le 10Um e faʻaititia ai le taimi nei density o le kalafi ma le plating’ apamemea mafiafia o le kalafi.

4. Mo le laupapa faʻavasegaina <4mil faʻatauga 1.8-2.0mil faʻamamago ata tifaga faia.

5. O isi polokalame e pei o le fesuiaʻiga o le faʻavasegaina o tisaini, faʻafouga o taui, laina kilia, tipi mama ma le PAD mafai foi faʻaititia le faʻaititia o ata tifaga kilipa.

6. Electroplating gaosiga metotia faʻatonutonu o ata tifaga ipu ma laʻititi avanoa ma faigofie kilipa

1. FA: Muamua taumafai le fasimea clamping pito i itu uma o le flobar laupapa. Ina ua maeʻa le mafiafia apamemea, laina lautele / laina mamao ma impedance e agavaʻa, maeʻa etching le flobar laupapa ma pasi AOI asiasiga.

2. Faʻamamaina ata: mo le ipu ma le D / F linegap <4mil, o le televave o le saoasaoa o le mou atu ata e tatau ona fetuʻunaʻi lemu.

3. Tomai o le aufaigaluega FA: faʻalogo i le taimi nei density iloiloga pe a faʻailoa mai le gaosiga o le taimi nei o le ipu ma faigofie ata tifaga. E masani lava, o le pito maualalo laina avanoa o le ipu mafolafola e laititi atu i le 3.5mil (0.088mm), ma le taimi nei density o electroplated ‘apamemea o loʻo pulea i totonu ≦ 12ASF, lea e le faigofie ona gaosia ata tifaga. I se faʻaopopoga i laina laina aemaise lava laupapa faigata e pei ona faʻaalia i lalo:

Faʻafefea ona foia le faʻafitauli o PCB laupapa plating ata tifaga ata

Le maualalo D / F avanoa o lenei kalafi laupapa o 2.5mil (0.063mm). I lalo o le tuutuuga o le lelei laugatasia o le gantry laina eletise, e fautuaina e faʻaaoga AS 10ASF o loʻo iai nei le faʻataʻitaʻiga FA.

Faʻafefea ona foia le faʻafitauli o PCB laupapa plating kiliva ata tifaga?

Ole laina laʻititi maualalo o le laupapa kalafi D / F o le 2.5mil (0.063mm), faʻatasi ai ma laina tutoʻatasi ma le tufatufa faʻasoasoa, e le mafai ona aloese mai le iʻuga o ata tifaga ata i lalo o le tuutuuga o le lelei tutusa o laina eletise o tagata lautele gaosi. O le taimi nei density o graphic electroplating ‘apamemea o 14.5ASF * 65 minute e gaosia ata tifaga kilipa, ua fautuaina o le kala eletise taimi nei density o ≦ 11ASF tofotofoga FA.

Aafiaga tau le tagata lava ia ma aotelega

Sa ou auai i le PCB faʻagasologa poto masani mo le tele o tausaga, masani uma PCB fale gaosi faia laupapa ma tamai laina avanoa sili atu pe itiiti ifo o le ai ai ata tifaga clamping, o le eseʻesega o fale gaosi taʻitasi eseese vaega o le leaga tifaga clamping faʻafitauli, nisi kamupani i ai ni nai ata tifaga clamping faafitauli, nisi kamupani maua tele ata tifaga clamping faafitauli. The following factors are analyzed:

1. ituaiga eseese PCB laupapa faʻavae ituaiga e eseʻese, PCB gaosiga faʻagasologa faigata e ese.

2. E tofu le kamupani ma pulega eseese auala ma auala.

3. mai le vaʻaiga o le suʻesuʻega o aʻu tausaga e tele o faʻaputuputuina poto masani, i se tamai ipu e tatau ona mataala i le muamua laina avanoa e naʻo le faʻaaogaina o sina laʻititi o le taimi nei ma talafeagai e faʻalautele ai le taimi o apamemea plating, o faʻatonuga nei e tusa ai o le poto masani o le taimi nei density ma le apamemea plating o loʻo faʻaaogaina e iloilo ai se taimi lelei, uai atu i le metotia ipu ma auala faʻagaioiga, faʻatatau i le laina maualalo mai le 4 mil ipu pe itiiti ifo, taumafai se lele e tatau ona i ai le FA laupapa le asiasiga AOI e aunoa ma le pusa gafa, I le taimi lava e tasi, e faʻatinoina foi sona sao i le lelei faʻatonutonuina ma le puipuia, ina ia o le avanoa o le faia o ata tifaga kiliva i le tele o gaosiga o le a matua laititi.

I loʻu manatu, lelei lelei PCB lelei manaʻomia e le gata i le poto masani ma agavaʻa, ae faʻapena foi metotia lelei. E faʻamoemoe foʻi i le faʻatinoga o tagata ile vaega o gaosiga.

O le eletise eletise e ese mai le ipu eletise uma, o le eseesega autu o loʻo taʻoto i laina laina o ituaiga eseese o ipu eletise, o isi laupapa laina ata latou te le tutusa tufatufaina, faʻatasi ai ma le lautele laina lautele ma le mamao, o loʻo i ai le vaʻaia, a nai laina tuʻusaʻo, tutoʻatasi pu uma ituaiga o faʻapitoa laina ata. O le mea lea, O LE tusitala e sili atu ona naunau e faʻaoga le FA (faʻailoga o loʻo iai nei) agavaʻa e fofo pe puipuia ai le faʻafitauli o le mafiafia o ata. O le faʻaleleia gaioiga gaioiga e laʻititi, vave ma aoga, ma o le puipuiga aafiaga e mautinoa.