Gaosia o HDI PCB: PCB mea ma faʻamatalaga auiliili

Le lelei o HDI PCB

Seʻi o tatou vaʻavaʻai totoʻa i le aʻafiaga. Ole faʻateleina ole ato e faʻatagaina matou e faʻapuʻupuʻu ala eletise ile va o vaega. Faatasi ai ma le HDI, na matou faʻateleina le numera o laina eletise i luga o laupepa i totonu o le PCB, ma faʻaititia ai le aofaʻi o laina e manaʻomia mo le mamanu. Faʻaitiitia le numera o faaputuga mafai tuʻu sili atu fesoʻotaʻiga i luga o le laupapa e tasi ma faʻaleleia vaega tuʻuina atu, faʻapipiʻiina ma fesoʻotaʻiga. From there, we can focus on a technique called interconnect per Layer (ELIC), which helps design teams move from thicker boards to thinner flexible ones to maintain strength while allowing the HDI to see functional density.

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HDI PCB rely on lasers rather than mechanical drilling. In turn, the HDI PCB design results in a smaller aperture and smaller pad size. Faʻaitiitia le gafatia faʻatagaina le ‘au au e faʻateleina le faʻatulagaga o le laupapa eria. O le faapuupuuina o auala eletise ma mafai ai ona sili atu le malosi le faʻaogaina o le uaea e faʻaleleia ai le faʻamaoni o le ata ma faʻavave ai le faʻagaioiga o faʻailo. Matou te mauaina se faʻaopoopoga faʻamanuiaga ile tele ona matou te faʻaititia le avanoa o le faʻaaofia ma capacitance faʻafitauli.

E le faʻaaogaina faʻaoga HDI PCB i ni pu, ae o ni pu tauaso ma tanu. O le faʻasolosolo lelei ma le saʻo o le tuʻuina o tanu ma pupu tauaso e faʻaititia ai le mamafa o le masini i luga o le ipu ma puipuia ai se avanoa e tau ai. I se faʻaopopoga, oe mafai ona faʻaogaina faʻaputu i totonu-pu e faʻalauteleina fesoʻotaʻiga manatu ma faʻaleleia le faʻatuatuaina. Lou faʻaaogaina luga o pads mafai foi ona faʻaititia leiloa leiloa e ala i le faʻaititia o le koluse tolopo ma le faʻaititia o aafiaga parasite.

E manaʻomia le galulue faʻatasi ole HDI

Gaosiga gaosi (DFM) manaʻomia se magafagafa, tonu PCB mamanu auala ma fesoʻotaʻi fesoʻotaʻiga ma gaosi ma gaosi. A o matou faʻaopopoina HDI i le DFM faila, uaʻi atu i auiliiliga i le ata, gaosiga, ma gaosiga tulaga na atili ai ona taua ma potopoto ma faʻataʻitaʻi mataupu e tatau ona talanoaina. I se faapuupuuga, o le mamanu, prototyping ma gaosiga gaioiga o HDI PCBS manaʻomia vavalalata galulue faatasi ma mafaufau i le faapitoa DFM tulafono talafeagai i le poloketi.

O se tasi o itu taua o le HDI tisaini (faʻaaogaina leisa viliina) ono i tala atu o le agavaʻa o le gaosi oloa, assembler, poʻo le gaosiina, ma manaʻomia faʻatonuga fesoʻotaʻiga e uiga i le saʻo ma le ituaiga o viliina faʻatulagaina manaʻomia. Ona o le maualalo o le tatalaina o fua ma maualuga maualuga faʻataʻotoina o HDI PCBS, na tatau ai i le ‘au tisaini ona faʻamautinoa o tagata gaosi ma gaosi e mafai ona faʻafetaiaʻia le potopotoga, toefaʻaleleia ma uelo manaʻoga o HDI ata. O le mea lea, ‘au tisaini galulue i HDI PCB ata tatau tatau ona lelei i le laʻasaga metotia faʻaogaina e gaosia laupapa.

Iloa lau matagaluega laupapa mea ma auiliiliga

Talu ai HDI gaosiga faʻaaogaina eseese ituaiga o leisa viliina gaioiga, o le talanoaga i le va o le au au, gaosi oloa ma gaosi tatau tatau taulaʻi atu i le ituaiga mea o le laupapa pe a talanoaina le viliina faʻagasologa. O le oloa talosaga e unaʻia le faʻagasologa o gaioiga ono i ai le tele ma le mamafa manaʻoga e faʻasolosolo ai talanoaga i se tasi itu poʻo seisi. Maualalo taimi masani talosaga ono manaʻomia mea e ese mai masani FR4. I se faʻaopopoga, faʻaiuga e uiga i le ituaiga o FR4 mea e aʻafia ai faʻaiuga e uiga i le filifiliga o viliina faiga poʻo isi mea gaosi oloa. A o nisi faiga viliina i totonu o le kopa faigofie, o isi e le masani ona ofi i tioata alava.

I le faʻaopopoina i le filifilia o le ituaiga mea saʻo, e tatau foʻi ona mautinoa e le ‘au fai faʻaupuga e mafai e le gaosi oloa ma le gaosi oloa ona faʻaaogaina le saʻo o le ipu mafolafola ma le faʻapipiʻiina o metotia. Faʻatasi ai ma le faʻaaogaina o le viliina laser, o le aperture ratio faʻaititia ma le loloto ratio o pu na faʻaaogaina mo plating faʻatumuina faʻaititia. E ui lava o le mafiafia o papatusi faʻatagaina mo tamaʻi avanoa, o mea manaʻomia manaʻoga o le poloketi e mafai ona faʻamaoti mai ai ni manifinifi papatusi e ono mafai ona le faʻamalieina i lalo o ni siʻosiʻomaga tulaga. E tatau ona siaki e le ‘au faʻataʻitaʻiga le agavaʻa o le tagata gaosi oloa e faʻaaoga le metotia o le “interconnect layer” ma vili pu i le loloto saʻo, ma ia mautinoa o le vailaʻau vailaʻau na faʻaaogaina mo le electroplating o le a faʻatumuina pu.

Faʻaaogaina tekonolosi ELIC

O le mamanu o HDI PCBS faʻataʻitaʻi ELIC tekonolosi mafai ai e le ‘au tisaini e atiaʻe sili alualu i luma PCBS, lea e aofia ai le tele o faaputuga o faaputuga apamemea faatumu microholes i le pad. O se iʻuga o le ELIC, e mafai e PCB mamanu ona faʻaaoga lelei le mafiafia, fesoʻotaʻiga laʻitiiti e manaʻomia mo le televave o taʻamilosaga. Talu ai e faʻaaogaina e le ELIC microholes faʻatumuina i le kopa mo le fesoʻotaʻiga, e mafai ona fesoʻotaʻi i le va o soʻoga e lua e aunoa ma le faʻavaivaia o le laupapa matagaluega.

Filifiliga filifiliga e afaina ai faʻavasega

Soʻo se talanoaga ma tagata gaosi oloa ma gaosi oloa e uiga i le HDI design e tatau foʻi ona taulaʻi atu i le faʻatulagaina saʻo o vaega maualuga-maualuga. O le filifilia o vaega e aʻafia ai le lautele o laina, tulaga, faʻaputuga ma le pu tele. Mo se faʻataʻitaʻiga, HDI PCB tisaini masani ona aofia ai le mafiafia faʻasologa o laina polo (BGA) ma le vaʻai lelei BGA e manaʻomia ai le sola ese pin. O mea moni e faʻaleagaina ai le sapalai o le paoa ma faʻailo le faʻamaoni faʻapea foi ma le tino faʻapitoa o le laupapa e tatau ona amanaʻia pe a faʻaaogaina nei masini. O nei mea taua e aofia ai le mauaina o talafeagai vavaeʻesega i le va o le pito i luga ma lalo faaputuga e faʻaititia felafolafoaʻiga crosstalk ma e pulea EMI i le va o totonu faʻavasega vaega.Symmetrically vavaega vaega o le a fesoasoani e puipuia le tutusa faʻaletonu luga o le PCB.

Gauai atu i faʻailo, paoa ma le faʻamaoni tino

I le faʻaopopoga i le faʻaleleia o le faʻailo faʻamaoni, oe mafai foi faʻalauteleina le malosi faʻamaoni. Talu ai ona o le HDI PCB o loʻo faʻataʻamilomilo le vaega o le eleele i le pito i luga, ua faʻaleleia atili ai le faʻamaoni. O le vaega pito i luga o le laupapa o loʻo i ai le grounding layer ma le power supply layer, lea e mafai ona faʻafesoʻotaʻi i le grounding layer e ala i tauaso poʻo microholes, ma faʻaititia ai le aofaʻi o vaʻalele hole.

HDI PCB faʻaititia le numera o ala-ala e ala i le pito i totonu o le laupapa. I le isi itu, faʻaititia le numera o perforations i le pailate eletise maua ai sili tele tolu:

O le vaega tele o le apamemea fafagaina AC ma DC nei i totonu o le malamala paoa pin

L tetee faʻaititia i le taimi nei ala

L Ona o le maualalo inductance, o le saʻo fesuiaʻi nei mafai ona faitau le paoa paʻu.

O leisi vaega taua o talanoaga o le faʻatumauina le laʻititi laina lautele, saogalemu vavaʻa ma ala auala tutusa. I le lomiga mulimuli, amata ona ausia toniga ‘apamemea mafiafia ma wiring laugatasia i le taimi o le mamanu faʻagasologa ma alu i luma ma le gaosiga ma gaosiga gaioiga.

Le lava o le saogalemu va avanoa e mafai ona taʻitaʻia ai i le tele o toega ata o loʻo totoe i le taimi o loʻo i totonu o le ata tifaga matutu, lea e mafai ona taʻitaʻia ai i ni auala pupuu. I lalo ifo o le laʻititi laina lautele mafai foi ona mafua ai faʻafitauli i le taimi o le ufiufi faʻagasologa ona o le vaivai mitiia ma matala matagaluega. E tatau foi i ‘au faʻataʻitaʻi ma tagata gaosi oloa ona mafaufau e faʻatumauina le tulaga laugatasia o se auala e faʻatonutonu ai le faʻailoaina o laina laina.

Faʻamautu ma faʻaogaina tulafono faʻapitoa e mamanuina ai

Maualuga-density faʻataʻitaʻiga manaʻomia laʻititi fafo itu, finer wiring ma vavalalata vaega vavalalata, ma o lea e manaʻomia ai se eseʻese mamanu faʻagasologa. O le HDI PCB gaosiga gaioiga faʻalagolago i leisa viliina, CAD ma CAM polokalama, leisa faʻatonu ata faʻataʻitaʻiga, faʻapitoa gaosiga meafaigaluega, ma tagata faʻatautaia tomai. O le faʻamanuiaina o le gaioiga atoa e faʻalagolago i se vaega o tulafono faʻavae e faʻailoaina ai le manaʻomia o manaʻoga, o le lautele o le taʻavale, o le pu tele, ma isi mea e aʻafia ai le faʻatulagaga. Developing detailed design rules helps select the right manufacturer or manufacturer for your board and lays the foundation for communication between teams.