zhinji PCB dhizaini vanofarira, kunyanya vanotanga, havanyatso nzwisisa akasiyana siyana muPCB dhizaini. Ivo havazive basa rayo uye kushandiswa kwayo. Heino tsananguro yakarongeka yemunhu wese:

1. Mechanical layer, sezvinoreva zita, kutaridzika kwePCB board yese yekuumbwa kwemuchina. Muchokwadi, kana tichitaura nezve mechaniki layer, tinoreva kutaridzika kwese kwePCB board. Inogona zvakare kushandiswa kuseta zviyero zvebhodhi redunhu, data mamaki, kurongeka mamaki, mirairo yegungano uye rumwe ruzivo rwemuchina. Ruzivo urwu rwunosiyana zvichienderana nezvinodiwa nekambani yekugadzira kana PCB mugadziri. Uye zvakare, iyo mechanical layer inogona kuwedzerwa kune mamwe maseru kuburitsa uye kuratidza pamwechete.

2. Chengetedza kunze kwepamusoro (yakarambidzwa wiring layer), inoshandiswa kutsanangura nzvimbo iyo zvikamu uye wiring zvinogona kuiswa zvakanaka pabhodhi redunhu. Dhirowa nzvimbo yakavharwa pane iyi layer senzvimbo inoshanda yekufambisa. Otomatiki marongerwo uye nzira hazvigoneke kunze kwenzvimbo ino. Iyo yakarambidzwa wiring layer inotsanangura muganhu patinoisa maitiro emagetsi emhangura. Izvi zvinoreva kuti, mushure mokunge tatanga kutsanangura iyo yakarambidzwa wiring layer, mune ramangwana wiring process, iyo wiring ine maitiro emagetsi haigoni kudarika yakarambidzwa wiring. Pamuganhu wemutsetse, pane kazhinji kacho tsika yekushandisa Keepout layer se mechanical layer. Iyi nzira haina kururama, saka zvinokurudzirwa kuti uite mutsauko, kana zvisina kudaro fekitari yebhodhi ichafanirwa kuchinja maitiro kwauri nguva dzose paunogadzira.

3. Chiratidzo chechiratidzo: Chiratidzo chechiratidzo chinonyanya kushandiswa kuronga waya pabhodhi redunhu. Kusanganisira Top layer (yepamusoro layer), Pazasi layer (pazasi layer) uye 30 MidLayer (yepakati layer). Pamusoro uye Pazasi maseketi anoisa midziyo, uye mativi emukati anofambiswa.

4. Top paste and Bottom paste are the top and bottom pad stencil layers, which are the same size as the pads. This is mainly because we can use these two layers to make the stencil when we do SMT. Just dug a hole the size of a pad on the net, and then we cover the stencil on the PCB board, and apply the solder paste evenly with a brush with solder paste, as shown in Figure 2-1.

5. Pamusoro Solder uye Pazasi Solder Iyi ndiyo solder mask kudzivirira mafuta egirini kuti asavharwe. Tinowanzoti “vhura hwindo”. Iyo yakajairwa mhangura kana wiring yakafukidzwa nemafuta egirinhi nekukasira. Kana tikashandisa solder mask maererano Kana ikabatwa, inodzivirira mafuta egirini kuti asafukidze uye afumure mhangura. Kusiyana pakati pezviviri kunogona kuonekwa mumufananidzo unotevera:

6. Internal plane layer (simba remukati / pasi pasi): Rudzi urwu rwechigadziro runoshandiswa chete kumapuranga akawanda, anonyanya kushandiswa kuronga mitsara yemagetsi uye mitsara yepasi. Tinodaidza maviri-layer board, mana-layer board, uye matanhatu-layer board. Nhamba yezviratidzo zvechiratidzo uye mukati mesimba / pasi pasi.

7. Silkscreen layer: Silkscreen layer inonyanya kushandiswa kuisa ruzivo rwakadhindwa, senge component outline and labels, akasiyana annotation characters, etc. Altium inopa maviri silk screen layer, Top Overlay uye Bottom Overlay, kuisa epamusoro sirika screen mafaira uye. iyo yepasi silk skrini mafaera zvichiteerana.

8. Multi layer (multi-layer): Mapedhi uye inopinda vias pabhodhi redunhu inofanira kupinda mukati mebhodhi rose redunhu uye kumisa magetsi ekubatanidza ane akasiyana conductive pateni akaturikidzana. Naizvozvo, iyo sisitimu yakagadzira abstract layer-multi-layer . Kazhinji, mapedhi uye vias zvinofanirwa kurongeka pamateru akawanda. Kana iyi layer ikadzimwa, mapads uye vias hazvigone kuratidzwa.

9. Drill Drawing (drilling layer): Chigadziro chekuchera chinopa ruzivo rwekuchera panguva yekugadzira bhodhi rekugadzira (zvakadai semapedhi, vias zvinoda kucherwa). Altium inopa zvidimbu zviviri zvekuchera: Drill gridi uye Drill dhizaini.