Mushure mokunge mhangura yakapfeka laminate inogadziriswa kuti ibudise Pcb bhodhi, zvakasiyana-siyana kuburikidza nemakomba, uye maburi egungano, zvikamu zvakasiyana-siyana zvinounganidzwa. Mushure mekuunganidza, kuitira kuti zvikamu zvisvike pakubatana nedunhu rega rega rePCB, zvinodikanwa kuita Xuan welding process. Brazing yakakamurwa kuita nzira nhatu: wave soldering, reflow soldering uye manual soldering. Iyo socket-yakaiswa zvikamu zvinowanzobatanidzwa ne wave soldering; iyo brazing yekubatanidza pamusoro-yakamisikidzwa zvikamu zvinowanzo shandisa reflow soldering; mativi ega ega uye zvikamu zviri zvega zvega (yemagetsi chrome) nekuda kwekugadzwa kwekuita zvinodiwa uye munhu kugadzirisa welding. Iron) welding.

1. Solder resistance yemhangura yakapfeka laminate

Copper clad laminate ndiyo substrate zvinhu zvePCB. Panguva yekubhuroka, inosangana nekusangana kwezvinhu zvinopisa zvakanyanya nekukasira. Naizvozvo, iyo Xuan welding process inzira yakakosha ye “thermal shock” kune copper clad laminate uye bvunzo yekudzivirira kupisa kwemhangura clad laminate. Copper clad laminates inovimbisa kunaka kwezvigadzirwa zvavo panguva yekupisa kwekupisa, icho chinhu chakakosha chekuongorora kupisa kwekudzivirira kwemhangura clad laminates. Panguva imwecheteyo, kuvimbika kwemhangura yakapfeka laminate panguva yeXuan welding inoenderanawo neyayo yekudhonza-kure simba, svuura simba pasi pekushisa kwepamusoro, uye hunyoro uye kupisa kupisa. Nokuda kwezvinodiwa zvekugadzirisa zvinodikanwa zvemhangura dzakapfeka laminates, kuwedzera kune zvakajairwa kunyudza kuramba zvinhu, mumakore achangopfuura, kuitira kuvandudza kuvimbika kwemhangura yakapfeka laminates muXuan welding, kumwe kuyerwa kwekuita kwekushandisa uye zvinhu zvekuongorora zvakawedzerwa. Zvakadai sekutora unyoro uye kupisa kupisa bvunzo (kurapa kwe3 h, ipapo 260 ℃ dip soldering bvunzo), mwando kunyura reflow soldering bvunzo (yakaiswa pa30 ℃, hunyoro hunyoro 70% kwenguva yakatarwa, yereflow soldering bvunzo) zvichingodaro. . Zvigadzirwa zvemhangura zvakapfeka laminate zvisati zvabuda mufekitori, mugadziri wemhangura akapfeka laminate achaita hutsinye hwekudip solder resistance (inozivikanwawo sekuti thermal shock blistering) bvunzo zvinoenderana nechiyero. Yakadhindwa yedunhu bhodhi vagadziri vanofanirwawo kuona chinhu ichi nenguva mushure mekunge copper clad laminate ichipinda mufekitori. Panguva imwecheteyo, mushure mekunge sampu yePCB yagadzirwa, mashandiro acho anofanirwa kuyedzwa nekuteedzera wave solder mamiriro muzvikamu zvidiki. Mushure mekusimbisa kuti iyi mhando ye substrate inosangana nezvinodiwa nemushandisi maererano nekuramba kunyudza solder, iyo PCB yerudzi urwu inogona kugadzirwa-zhinji uye kutumirwa kune yakazara muchina fekitori.

Nzira yekuyera kupikisa kwevanotengesa kwemhangura yakapfeka laminates yakangofanana neyepasi rose (GBIT 4722-92), American IPC standard (IPC-410 1), uye Japanese JIS standard (JIS-C-6481-1996) . Zvinonyanya kudiwa ndezvi:

①Iyo nzira yekumisikidza ndeye “inoyangarara solder nzira” (yemuenzaniso inoyangarara pamusoro pesolder pamusoro);

②Saizi yemuenzaniso ndeye 25 mm X 25 mm;

③Kana tembiricha yekuyera tembiricha iri mercury thermometer, zvinoreva kuti chinzvimbo chakafanana chemusoro wemercury nemuswe mune solder ndeye (25 ± 1) mm; iyo IPC chiyero ndeye 25.4 mm;

④Kudzika kweiyo solder yekugezera hakusi pasi pe40 mm.

Zvinofanira kucherechedzwa kuti: tembiricha kuyerwa chinzvimbo ane akanyanya kukosha pesvedzero pamusoro yakarurama uye yechokwadi ratidziro pamwero dip solder kuramba bhodhi. Kazhinji, iyo inopisa sosi ye solder tin iri pazasi pebhati remarata. Iyo yakakura iyo (yakadzama) chinhambwe pakati penzvimbo yekuyeresa tembiricha uye pamusoro peiyo solder, iyo yakakura kutsauka pakati petembiricha ye solder uye tembiricha yakayerwa. Panguva ino, kudzikira kwetembiricha yemvura yakadzika pane tembiricha yakayerwa, nguva yakareba yendiro ine dip solder resistance inoyerwa nesample float welding method to bubble.

2. Wave soldering processing

Mune wave soldering process, tembiricha ye soldering ndiyo chaiyo tembiricha ye solder, uye tembiricha iyi ine hukama nerudzi rwekutengesa. Tembiricha yewelding inofanirwa kudzorwa pasi pe250’c. Tembiricha yakaderera welding inokanganisa kunaka kwewelding. Sezvo tembiricha ye soldering inowedzera, iyo dip soldering nguva inopfupikiswa zvakanyanya. Kana tembiricha yekunyungudutsa yakakwira zvakanyanya, zvinokonzeresa kuti dunhu (copper chubhu) kana iyo substrate iite blistering, delamination, uye yakakomba warpage yebhodhi. Naizvozvo, tembiricha welding inofanira kunyatsodzorwa.

Tatu, reflow welding processing

Kazhinji, iyo reflow soldering tembiricha yakadzikira zvishoma pane wave soldering tembiricha. Kumisikidzwa kweiyo reflow soldering tembiricha inoenderana neanotevera maficha:

① Mhando yemidziyo yekuyerera inotengeswa;

②Mamiriro ekugadzika ekumhanya kwemutsara, nezvimwewo;

③Rudzi uye ukobvu hwe substrate zvinhu;

④ PCB saizi, nezvimwe.

Iyo yakatarwa tembiricha ye reflow soldering yakasiyana nePCB pamusoro tembiricha. Pane imwechete seti tembiricha ye reflow soldering, tembiricha yepamusoro yePCB zvakare yakasiyana nekuda kwerudzi uye ukobvu hweiyo substrate zvinhu.

Munguva ye reflow soldering process, kupisa kwekudzivirira kwekushisa kweiyo substrate yepamusoro tembiricha uko iyo foil yemhangura inozvimba (mabhubhu) inoshanduka nekupisa kwekupisa kwePCB uye kuvapo kana kusavapo kwekunyorova kwekunyorova. Zvinogona kuonekwa kubva kuMufananidzo 3 kuti kana preheating tembiricha yePCB (yepamusoro tembiricha ye substrate) yakadzikira, muganho wekudzivirira kupisa weiyo substrate yepasi tembiricha uko dambudziko rekuzvimba rinoitika zvakare rakaderera. Pasi pemamiriro ekuti tembiricha yakaiswa ne reflow soldering uye preheating tembiricha ye reflow soldering inogara iripo, tembiricha yepasi inodonha nekuda kwekunyorova kwe substrate.

Ina, manual welding

Mukugadzirisa welding kana kupatsanura manual welding yeakakosha macomponents, tembiricha yepamusoro yemagetsi ferrochrome inofanirwa kunge iri pasi pe260 ℃ yebepa-based copper clad laminates, uye pasi pe300 ℃ yegirazi fiber jira-based copper clad laminates. Uye sezvinobvira kupfupisa welding nguva, izvo zvakajairika zvinodiwa; bepa substrate 3s kana zvishoma, girazi fiber jira substrate ndeye 5s kana pasi.