Inventory yezvikonzero zvevarombo PCB bemhapemha

1. Gomba

Iyo pinholes inokonzerwa nehydrogen adsorbed pamusoro pezvikamu zvakaputirwa, uye haisunungurwi kwenguva yakareba. Ita kuti mushonga weplating usakwanise kunyorova pamusoro pezvikamu zvakapfava, kuitira kuti plating layer isagone kuiswa electrolytically. Sezvo ukobvu hwejasi munzvimbo yakatenderedza hydrogen evolution poindi inowedzera, pini inoumbwa panzvimbo yehydrogen evolution. Inoratidzwa negomba rakatenderera rinopenya uye dzimwe nguva muswe muduku unokwira. Kana iyo plating solution ikashaya wetting agent uye yazvino density yakakwira, pinholes inoumbwa zviri nyore.

2. Pockmark

Gomba rinokonzerwa nekusachena kwepamusoro penzvimbo yakapfava, kunyura kwechinhu chakasimba, kana kumiswa kwechinhu chakasimba mukugadzirisa. Kana yasvika pamusoro pebasa rekushanda pasi pechiito chemunda wemagetsi, inoshambadzirwa pairi, iyo inobata electrolysis uye inopinza nyaya idzi dzakasimba muMutambo we electroplating, zviduku zviduku (makomba) anoumbwa. Chimiro ndechekuti inopenya, hapana chinopenya chiitiko, uye hapana chimiro chakamisikidzwa. Muchidimbu, inokonzerwa netsvina workpiece uye tsvina plating mhinduro.

3. Mhepo mitsetse

Mhepo inoyerera streaks inokonzerwa nekuwedzera kwekuwedzera kana yakakwira cathode ikozvino density kana yakakwirira complexing agent, iyo inoderedza cathode ikozvino kushanda, zvichikonzera kuwanda kwehydrogen evolution. Kana iyo plating mhinduro iri kuyerera zvishoma nezvishoma uye cathode ichifamba zvishoma nezvishoma, iyo hydrogen gasi inokanganisa kurongeka kwemakristasi e electrolytic panguva yekusimuka kunopesana nepamusoro peiyo workpiece, ichigadzira pasi-kusvika-kumusoro gasi kuyerera mitsetse.

4. Kuvhara (kufumurwa)

Masking imhaka yekuti iyo yakapfava kupenya pamapini ari pamusoro peiyo workpiece haina kubviswa, uye iyo electrolytic deposition coating haigone kuitwa pano. Iyo yepasi zvinhu inoonekwa mushure me electroplating, saka inonzi yakafumurwa (nekuti kupenya kwakapfava ndeye translucent kana transparent resin chikamu).

5. Iyo yekupfekedza ine brittle

Mushure meSMD electroplating, mushure mekucheka mbabvu uye kuumba, zvinogona kuonekwa kuti kune kuputika mumakona emapini. Kana paine kutsemuka pakati peiyo nickel layer uye substrate, inotongwa kuti nickel layer ine brittle. Kana pakatsemuka pakati pe tin layer ne nickel layer, zvinoonekwa kuti tin layer i brittle. Chikonzero che brittleness kazhinji chinowedzera, kupenya kwakanyanyisa, kana kuwanda kwekusagadzikana kana kusvibiswa kwehupenyu mune yeplating mhinduro.