PCB laminated dhizaini dhizaini dhizaini uye yakajairika laminated chimiro

Usati wagadzira multilayer pcb bhodhi, mugadziri anofanirwa kutanga aona dhizaini bhodhi chimiro chinoshandiswa zvinoenderana nechiyero chedunhu, saizi yebhodhi redunhu uye electromagnetic kuenderana (EMC) zvinodiwa, ndiko kuti, kusarudza kushandisa 4 akaturikidzana, 6 akaturikidza, kana Mamwe akaturiki emabhodhi edunhu. . Mushure mekuona nhamba yezvikamu, sarudza kuti ungaisa kupi mukati memagetsi emagetsi uye nzira yekuparadzira zviratidzo zvakasiyana pazvikamu izvi. Iyi ndiyo sarudzo ye multilayer PCB stack chimiro.

ipcb

Laminated chimiro chinhu chakakosha chinokanganisa mashandiro eEMC emabhodhi ePCB, uye zvakare inzira yakakosha yekudzvanya kukanganiswa kwemagetsi. Ichi chinyorwa chinozivisa zvinoenderana neiyo multilayer PCB board stack chimiro.

Mushure mekuona huwandu hwesimba, pasi uye zvikwangwani zvezviratidzo, kurongeka kwadzo inyaya iyo injinjiniya yega yega PCB haigone kudzivirira;

The general principle of layer arrangement:

1. Kuti uone iyo laminated chimiro che multilayer PCB board, zvimwe zvinhu zvinoda kutariswa. Kubva pakuona kwetambo, iyo yakawanda mitsara, zviri nani wiring, asi mari uye kuoma kwekugadzira bhodhi kuchawedzerawo. Kune vagadziri, ingave iyo laminated chimiro chakaenzana kana kwete ndicho chinongedzo chinoda kutariswa kana PCB mabhodhi anogadzirwa, saka sarudzo yehuwandu hwematanho inoda kutarisisa zvinodiwa zveese maficha kuti uwane yakanakisa chiyero. Kune vagadziri vane ruzivo, mushure mekupedza pre-layout yezvikamu, ivo vanozotarisa pakuongorora kwePCB wiring bottleneck. Batanidza nemamwe maturusi eEDA kuti uongorore wiring density yedare redunhu; wobva wabatanidza nhamba nemhando dzemitsara yechiratidzo ine zvakakosha wiring zvinodiwa, senge mitsara yekusiyanisa, mitsara inonzwisisika yechiratidzo, nezvimwewo, kuona huwandu hwemasaini masiginecha; zvino maererano nerudzi rwemagetsi emagetsi, kuparadzaniswa uye kupesana-kupindira Izvo zvinodiwa kuti uone nhamba yezvikamu zvemagetsi zvemukati. Nenzira iyi, nhamba yezvikamu zvebhodhi rose redunhu rinonyanya kutsanangurwa.

2. Pasi pechikamu chepamusoro (chechipiri chechipiri) indege yepasi, iyo inopa chigadziro chekudzivirira chidziviriro uye ndege inotaridzirwa kune wiring yepamusoro; iyo inonzwisisika yechiratidzo chemukati inofanira kunge iri pedyo nemukati wemagetsi emukati (yemukati simba / pasi pasi), uchishandisa yakakura yemukati yemagetsi layer Copper film kuti ipe nhovo yechiratidzo chechiratidzo. Iyo yakakwirira-yekumhanyisa chiratidzo chekufambisa dhizaini mudenderedzwa inofanirwa kunge iri chiratidzo chepakati dhishi uye yakapetwa pakati pemaviri emukati emagetsi akaturikidzana. Nenzira iyi, firimu remhangura rezvikamu zviviri zvemagetsi zvemukati zvinogona kupa electromagnetic shielding ye-high-speed signal transmission, uye panguva imwe chete, inogona kunyatsogadzirisa mwaranzi wechiratidzo chepamusoro-soro pakati pezvikamu zviviri zvemagetsi zvemukati pasina kukonzera. kupindira kwekunze.

3. Zvose zviratidzo zvezviratidzo zviri pedyo sezvinobvira kune ndege yepasi;

4. Edza kudzivisa mitsara miviri yezviratidzo zvakananga kune imwe neimwe; zviri nyore kuunza crosstalk pakati pezviratidziro zvepadhuze, zvichikonzera kutadza kushanda kwedunhu. Kuwedzera ndege yepasi pakati pematanho maviri echiratidzo anogona kunyatso kudzivirira crosstalk.

5. Mhedzisiro huru yesimba iri padyo sezvinobvira kwairi zvinoenderana;

6. Funga nezve symmetry yezvakagadzirwa laminated.

7. Pakurongeka kwemabhobhobhobho, zvakaoma kuti mabhobho eamai aripo adzore tambo dzinoenderana kureba. Kune iyo bhodhi-level inoshanda frequency pamusoro pe50MHZ (tarisa kune iyo mamiriro pazasi 50MHZ, ndapota zorora zvakakodzera), zvinokurudzirwa kuronga musimboti:

The component surface and the welding surface is a complete ground plane (nhoo);Hapana adjacent parallel wiring layers;Ese masignal layers ari pedyo sezvinobvira kune pasi plane;

Chiratidzo chekiyi chiri padhuze nepasi uye hachidariki chikamu.

Ongorora: Kana uchimisikidza chaiwo PCB akaturikidzana, iyo misimboti iri pamusoro inofanira kuchinjika kugona. Kubva pakunzwisisa kwemitemo iri pamusoro apa, maererano nezvinodiwa chaizvo zvebhodhi rimwe chete, zvakadai se: kana kiyi ye wiring layer, magetsi, kupatsanurwa kwepasi kunodiwa, nezvimwewo, Sarudza kurongeka kwezvikamu, uye usaite ‘ t kungoikopa nemazvo, kana kubatirira pairi.

8. Multiple pasi pasi mukati magetsi akaturikidzana anogona zvinobudirira kuderedza pasi impedance. Semuyenzaniso, iyo A sign layer uye B sign layer inoshandisa yakaparadzana pasi ndege, izvo zvinogona kunyatso kudzikisa zvakajairika mode kupindira.

Iyo inowanzoshandiswa layered chimiro: 4-layer board

Izvi zvinotevera zvinoshandisa muenzaniso we4-layer board kuratidza maitiro ekugadzirisa kurongeka uye kusanganiswa kweakasiyana-siyana laminated zvimiro.

Kune anowanzo shandiswa 4-layer mabhodhi, kune anotevera stacking nzira (kubva kumusoro kusvika pasi).

(1) Siganl_1 (Pamusoro), GND (Inner_1), SIMBA (Inner_2), Siganl_2 (Pazasi).

(2) Siganl_1 (Pamusoro), SIMBA (Inner_1), GND (Inner_2), Siganl_2 (Pazasi).

(3) SIMBA (Pamusoro), Siganl_1 (Inner_1), GND (Inner_2), Siganl_2 (Pazasi).

Zviripachena, Sarudzo 3 inoshaya kubatana kunoshanda pakati pesimba remagetsi uye pasi uye haifanirwe kutorwa.

Zvino sarudzo 1 ne2 dzinofanira kusarudzwa sei?

Mumamiriro ezvinhu akajairwa, vagadziri vanosarudza sarudzo 1 sechimiro cheiyo 4-layer board. Chikonzero chesarudzo hachisi chekuti Sarudzo 2 haigone kutorwa, asi kuti general PCB board inongoisa zvikamu padenga repamusoro, saka zvakafanira kutora Sarudzo yekutanga.

Asi kana zvikamu zvinoda kuiswa pamativi ose epamusoro nepamusoro, uye dielectric ukobvu pakati pesimba remukati uye pasi pasi yakakura uye kubatanidza kwakashata, zvakakosha kufunga kuti ndeipi iyo ine mitsetse yezviratidzo zvishoma. YeSarudzo 1, kune mitsetse yezviratidzo zvishoma pazasi, uye firimu remhangura rakakura-nzvimbo rinogona kushandiswa kubatanidza neSIMBA; pane zvinopesana, kana zvikamu zvakanyanya kurongwa pazasi, Sarudzo 2 inofanira kushandiswa kugadzira bhodhi.

Kana chimiro chelaminated chikagamuchirwa, simba remagetsi uye pasi pevhu zvakatobatanidzwa. Tichifunga nezvezvinodiwa zve symmetry, chirongwa 1 chinowanzo gamuchirwa.

6-layer board

Mushure mokupedzisa kuongororwa kwechimiro chelaminated che 4-layer board, zvinotevera zvinoshandisa muenzaniso we-6-layer board kusanganiswa kuenzanisira kurongeka uye kusanganiswa kwe6-layer board uye nzira inosarudzwa.

(1) Siganl_1 (Pamusoro), GND (Inner_1), Siganl_2 (Inner_2), Siganl_3 (Inner_3), simba (Inner_4), Siganl_4 (Pazasi).

Sarudzo 1 inoshandisa 4 zviratidzo zvechiratidzo uye 2 mukati mesimba / pasi pasi, ine mamwe masignal layers, ayo anobatsira kune wiring basa pakati pezvikamu, asi kukanganisa kweiyi mhinduro kunowedzerawo kuoneka, izvo zvinoratidzwa muzvikamu zviviri zvinotevera:

① Ndege yemagetsi nendege yepasi zvakaparadzana, uye hazvina kubatanidzwa zvakakwana.

② Chiratidzo chechiratidzo Siganl_2 (Inner_2) uye Siganl_3 (Inner_3) yakatarisana zvakananga, saka kuparadzaniswa kwechiratidzo hakuna kunaka uye crosstalk iri nyore kuitika.

(2) Siganl_1 (Pamusoro), Siganl_2 (Inner_1), SIMBA (Inner_2), GND (Inner_3), Siganl_3 (Inner_4), Siganl_4 (Pazasi).

Scheme 2 Kuenzaniswa nechirongwa 1, iyo dhizaini yemagetsi uye ndege yepasi zvakabatanidzwa zvizere, izvo zvine zvimwe zvakanakira pane chirongwa 1, asi.

Siganl_1 (Pamusoro) uye Siganl_2 (Inner_1) uye Siganl_3 (Inner_4) uye Siganl_4 (Pazasi) zvikwangwani zvechiratidzo zvakatarisana zvakananga kune mumwe nemumwe. Iyo yekusarudzika chiratidzo haina kunaka, uye dambudziko recrosstalk harina kugadziriswa.

(3) Siganl_1 (Pamusoro), GND (Inner_1), Siganl_2 (Inner_2), SIMBA (Inner_3), GND (Inner_4), Siganl_3 (Pazasi).

Kuenzaniswa neChirongwa 1 neChirongwa chechipiri, Scheme 2 ine imwe shoma yechiratidzo layer uye imwe yemukati yemagetsi layer. Kunyangwe iwo maseru aripo e wiring akaderedzwa, chirongwa ichi chinogadzirisa zvakajairwa zveScheme 3 uye Scheme 1.

① Ndege yemagetsi nendege yepasi zvakabatanidzwa zvakasimba.

② Imwe neimwe chiratidzo chechiratidzo chiri padhuze nechomukati chemagetsi layer, uye inonyatso kuparadzaniswa kubva kune mamwe masignal layer, uye crosstalk haisi nyore kuitika.

③ Siganl_2 (Inner_2) iri pedyo nemagetsi maviri emukati GND (Inner_1) uye SIMBA (Inner_3), iyo inogona kushandiswa kutumira zviratidzo zvepamusoro-soro. Iwo maviri emukati emagetsi akaturikidzana anogona kunyatso dzivirira kupindira kubva kunze kwenyika kune Siganl_2 (Inner_2) layer uye kupindira kubva kuSiganl_2 (Inner_2) kune kunze kwenyika.

Mumativi ese, chirongwa chechitatu chiri pachena kuti ndicho chakanyanya kugadziridzwa. Panguva imwecheteyo, chirongwa che3 zvakare chinowanzoshandiswa laminated chimiro che 3-layer board. Kuburikidza nekuongororwa kwemienzaniso miviri iri pamusoro apa, ndinotenda kuti muverengi ane imwe nzwisiso yemaitiro e-cascading, asi mune dzimwe nguva, imwe chirongwa hachikwanisi kuzadzisa zvose zvinodiwa, izvo zvinoda kutariswa kwekutanga kwemaitiro akasiyana-siyana ekugadzira. Nehurombo, nekuda kwekuti dhizaini redhizaini dhizaini yakanyatso kuenderana nehunhu hweiyo chaiyo dunhu, iyo anti-kukanganisa kuita uye magadzirirwo akatarisana nemasekete akasiyana akasiyana, saka chokwadi aya misimboti haana chakatarwa chekutarisa. Asi chii chine chokwadi ndechekuti dhizaini dhizaini 6 (yemukati simba remukati uye yepasi pasi inofanira kubatanidzwa zvakasimba) inoda kusangana kutanga mukugadzira, uye kana masaini ekumhanya-mhanya achida kufambiswa mudunhu, ipapo dhizaini dhizaini 2 (high-speed signal transmission layer in the circuit) Inofanirwa kunge iri chiratidzo chepakati nepakati uye sandwiched pakati pezvikamu zviviri zvemagetsi emukati) inofanira kugutsikana.

10-layer board

PCB yakajairika 10-layer board dhizaini

Kutevedzana kwewaya kwakajairwa ndeye TOP-GND—signal layer—power layer—GND—signal layer—power layer—signal layer—GND—BOTTOM

Iyo wiring sequence pachayo haina kurongeka, asi kune mamwe maitiro uye misimboti yekuimisa: Semuenzaniso, ari padyo neiyo dhizaini yepamusoro uye yepasi pasi anoshandisa GND kuve nechokwadi EMC maitiro ebhodhi rimwechete; semuenzaniso, imwe neimwe yechiratidzo layer ingangoshandisa iyo GND layer sereferensi Ndege; simba rinoshandiswa mubhodhi rimwe chete rinonyanya kuiswa pachidimbu chemhangura; iyo inobatwa, yakakwirira-kumhanya, uye inofarira kuenda pamwe nemukati wemukati wekusvetuka, nezvimwe.