Zvinoreva uye basa rePCB layers

1. Drilling layer: dhiri yekuchera inopa ruzivo rwekuchera panguva yekugadzira maitiro e Yakadhindwa Circuit Board (semuenzaniso, iyo via gomba repadhi rinoda kudhiriwa).

2. Chiratidzo chechiratidzo: chiratidzo chechiratidzo chinonyanya kushandiswa kuronga waya pabhodhi redunhu.

3. Solder mask: shandisa pendi yependi, senge solder mask, kune zvikamu zvose kunze kwepadhi kudzivirira tini kubva pakuiswa kune zvikamu izvi. Iyo solder mask inoshandiswa kuenzanisa padhi mukugadzira maitiro uye inogadzirwa otomatiki.

4. Solder paste protective layer, s-md patch layer: ine basa rakafanana neyo solder resist layer, kunze kweiyo inopindirana bonding pad yepamusoro bonded components panguva yekushivirira kwemichina.

5. Yakarambidzwa wiring layer: inoshandiswa kutsanangura nzvimbo iyo zvikamu uye wiring zvinogona kuiswa zvinobudirira pa Yakadhindwa Circuit Board. Dhirowa nzvimbo yakavharwa pane iyi layer senzvimbo inoshanda yewaya. Haikwanise kuiswa otomatiki nekufambiswa kunze kwenzvimbo ino.

6. Silk screen layer: sirika screen layer ndiyo inonyanya kushandiswa kuisa ruzivo rwekudhinda, senge ratidziro uye kumaka kwezvikamu, mavara akasiyana-siyana ezvinyorwa, nezvimwewo. Kazhinji, mavara akasiyana-siyana ari pachiratidziro chepamusoro chekudhinda, uye skrini yepasi. kudhinda layer inogona kuvharwa.

7. Internal power supply / grounding layer: rudzi urwu rwechifukidzo rinongoshandiswa kumapuranga akawanda uye rinonyanya kushandiswa kuronga tambo dzemagetsi uye waya dzepasi nhamba yechiratidzo chechiratidzo uye simba remukati / pasi pasi.

8. Mechanical layer: inowanzo shandiswa kuseta zviyero zvese, data marks, alignment mamaki, mirairo yegungano uye mamwe ma mechanic information yedunhu redunhu. Mashoko acho anosiyana zvichienderana nezvinodiwa nekambani yekugadzira kana PCB mugadziri. Uye zvakare, iyo mechanical layer inogona kusungirirwa kune mamwe ma layer kuti ibudise kuratidza pamwe chete.