Tsanangudzo yekutanga yebhodhi redunhu

Chekutanga – Zvinodiwa zvePCB nzvimbo

1. Nharaunda pakati pemakondukita: iyo mitsetse yemitsara yepakati ndeyewo mutsara kune mutsetse, uye chinhambwe chiri pakati pemitsara nemapadhi hachifanirwe kuva pasi pe4MIL. Kubva pamaonero ekugadzirwa, kukura kuri nani kana mamiriro achibvumidza. Kazhinji, 10 MIL yakajairika.
2. Pad gomba dhayamita uye padhi pahupamhi: maererano nemamiriro ezvinhu ePCB mugadziri, kana iyo pad gomba dhayamita yakadhirowa nemichina, iyo shoma haingave isingasviki 0.2mm; Kana laser drilling ikashandiswa, iyo shoma haifaniri kunge iri pasi pe4mil. Iyo gomba dhayamita kushivirira kwakasiyana zvishoma zvichienderana nemahwendefa akasiyana, uye inogona kudzorwa mukati me 0.05mm kazhinji; Iyo shoma pad upamhi haifanire kuve isingasviki 0.2mm.
3. Kupatsanurana pakati pemapadhi: Zvinoenderana nekugona kugadzirisa kwevagadziri vePCB, nzvimbo yacho haifanire kunge iri pasi pe0.2MM. 4. Nharaunda pakati pepepa remhangura uye mupendero weplate inofanira kunge isingasviki 0.3mm. Kana pakaiswa mhangura yakakura-nzvimbo, kazhinji pane chinhambwe chemukati kubva pamupendero weplate, iyo inowanzoiswa se20mil.

-Kusina magetsi kuchengetedza kureba

1. Upamhi, kureba uye kupatsanurwa kwemabhii: Pamavara akadhindwa pasirikirini yesirika, tsika dzakajairwa dzakadai se5/30 uye 6/36 MIL dzinowanzoshandiswa. Nokuti kana mashoko acho ari maduku zvikuru, kugadziridzwa uye kudhindwa kuchasvibiswa.
2. Kureba kubva kusiriki skrini kusvika padhi: sirika sikirini haibvumidzwe kukwira padhi. Nekuti kana iyo solder pad yakafukidzwa nesiriki skrini, sirika sikirini haigone kuputirwa netini, iyo inokanganisa kuunganidzwa kwezvikamu. Kazhinji, mugadziri wePCB anoda kuchengetedza nzvimbo ye8mil. Kana nzvimbo yemamwe mabhodhi ePCB iri padyo, nzvimbo ye4MIL inogamuchirwa. Kana iyo sirika sikirini yakavhara netsaona padhi yekubatanidza panguva yekugadzira, mugadziri wePCB anozobvisa otomatiki sirika sikirini yakasara padhi rekubatanidza panguva yekugadzira kuti ive nechokwadi cheti pane yekubatanidza padhi.
3. 3D kureba uye kuchinjika spacing pane mechaniki chimiro: Paunenge uchiisa zvinhu paPCB, funga kana yakachinjika kutungamira uye kureba kwenzvimbo kuchizopesana nezvimwe zvimiro zvemakanika. Naizvozvo, panguva yekugadzira, zvinodikanwa kuti utarise zvizere kuchinjika kwechimiro chenzvimbo pakati pezvikamu, pamwe nepakati pePCB yakapedzwa uye goko rechigadzirwa, uye kuchengetedza nzvimbo yakachengeteka yechinhu chimwe nechimwe chakanangwa. Izvo zviri pamusoro ndezvimwe zvinodikanwa zvepakati zvePCB dhizaini.

Zvinodiwa kuburikidza neyepamusoro-density uye yakakwirira-kumhanya multilayer PCB (HDI)

Inowanzo kupatsanurwa muzvikamu zvitatu, zvinoti gomba rebofu, gomba rakavigwa uye neburi
Gomba rakamisikidzwa: inoreva gomba rekubatanidza riri mukati mechikamu chemukati chebhodhi redunhu rakadhindwa, risingazopfuuri kusvika pamusoro pebhodhi redunhu rakadhindwa.
Kuburikidza negomba: Gomba iri rinopfuura nepadunhu rese redunhu uye rinogona kushandiswa mukati mekubatana kana sekuisa nekumisikidza gomba rezvikamu.
Bofu gomba: Inowanikwa pamusoro uye pasi pepamusoro pebhodhi redunhu rakadhindwa, rine humwe hudzamu, uye rinoshandiswa kubatanidza chimiro chepamusoro uye chimiro chemukati pazasi.

Nekuwedzera kwekukurumidza uye miniaturization yezvigadzirwa zvepamusoro-soro, kuenderera mberi kwekuvandudzwa kwe semiconductor yakasanganiswa yedunhu kubatanidzwa uye nekukurumidza, zvinodiwa zvehunyanzvi zvemabhodhi akadhindwa zvakakwirira. Waya dziri paPCB dzakatetepa uye dzakatetepa, wiring density yakakwira nepamusoro, uye maburi ari paPCB madiki uye madiki.
Kushandisa laser bofu gomba seyakanyanya micro kuburikidza negomba ndeimwe yeakakosha matekinoroji eHDI. Iyo laser bofu gomba ine diki aperture uye maburi akawanda inzira inoshanda yekuwana yakakwira waya density yeHDI board. Sezvo kune akawanda laser mapofu maburi semapoinzi ekusangana mumabhodhi eHDI, kuvimbika kwemagomba e laser bofu kunotarisisa kuvimbika kwezvigadzirwa.

Chimiro chegomba mhangura
Zviratidzo zvakakosha zvinosanganisira: kukora kwemhangura yekona, ukobvu hwemhangura hwegomba madziro, gomba rekuzadza gomba (pazasi mhangura ukobvu), kukosha kwedhayamita, nezvimwe.

Stack-up dhizaini zvinodiwa
1. Yega yega routing layer inofanirwa kunge iine iri padyo referensi layer (simba rekupa kana stratum);
2. Iyo yakatarisana huru yemagetsi dhizaini uye stratum ichachengetwa iri padiki chinhambwe kupa yakakura coupling capacitance.

Muenzaniso we4Layer ndeuyu
SIG-GND (PWR)-PWR (GND)-SIG; 2. GND-SIG(PWR)-SIG(PWR)-GND
Iyo dhizaini spacing ichave yakakura kwazvo, iyo isiri yakaipa chete kune impedance control, interlayer coupling uye nhovo; Kunyanya, nzvimbo yakakura pakati pemagetsi emagetsi inoderedza capacitance yebhodhi, iyo isingakodzeri kusefa ruzha.