Pasina yanhasi PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. HDI tekinoroji inobvumira vagadziri kuisa zvidiki zvidiki padhuze nepadhuze. Yakakwirira pasuru density, diki saizi bhodhi uye mashoma matete anounza inokanganisa maitiro kune PCB dhizaini.

Kubatsira kweHDI

Let’s take a closer look at the impact. Kuwedzera kwepacity density kunotibvumira kupfupisa nzira dzemagetsi pakati pezvinhu. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Kuderedza huwandu hwematanho kunogona kuisa kwakawanda kubatana pane imwechete bhodhi uye kugadzirisa chinzvimbo kuiswa, wiring uye kubatana. Kubva ipapo, tinokwanisa kutarisa nezvehunyanzvi hunodaidzwa kunzi interconnect paRukoko (ELIC), iyo inobatsira magadzirirwo emapoka kutama kubva kumabhodhi madiki kuenda kumatete anotetepa ekuchengetedza simba vachibvumira iyo HDI kuti ione kushanda kwakaringana.

HDI PCBS rely on lasers rather than mechanical drilling. Nekudaro, Iyo HDI PCB dhizaini inokonzeresa mukuzuka kudiki uye padiki padiki saizi. Kuderedza kuzarura kwakabvumira timu yekugadzira kuti iwedzere marongerwo enzvimbo yebhodhi. Kupfupisa nzira dzemagetsi uye kugonesa kuwedzeredza wiring kunovandudza chiratidzo chekuvimbika kweiyo dhizaini uye inomhanyisa kugadzirisa chiratidzo. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

HDI PCB dhizaini haishandisi kuburikidza nemakomba, asi mapofu uye akaviga maburi. Kudzadzarika uye kuiswa kwakaringana kwekuvigwa uye maburi mapofu kunoderedza kumanikidza kumanikidza pahwendefa uye kunodzivirira chero mukana wekupokana. Uye zvakare, iwe unogona kushandisa yakaturikidzana kuburikidza-maburi kusimudzira ekubatanidza mapoinzi uye nekuvandudza kuvimbika. Kushandisa kwako pamapadhi kunogona zvakare kudzikisa kurasikirwa kwemasaini nekuderedza kunonoka kwemuchinjikwa uye kudzikisira hutachiona.

Kugadzirwa kweHDI kunoda kubatana

Kugadzira dhizaini (DFM) inoda inofungidzirwa, chaiyo pcb dhizaini nzira uye inowirirana kutaurirana nevagadziri uye vagadziri. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Muchidimbu, dhizaini, prototyping uye yekugadzira yeHDI PCBS inoda kubatana kwekubatana uye kutarisisa kune yakatarwa DFM mitemo inoshanda kune chirongwa.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Ziva rako redunhu bhodhi zvinhu uye maratidziro

Nekuti kugadzirwa kweHDI kunoshandisa akasiyana maseru ekuchera laser, hurukuro pakati peboka rekugadzira, mugadziri uye mugadziri anofanirwa kutarisa pamhando yemabhodhi pavanenge vachikurukura nezvekuchera kwacho. Icho chigadzirwa chishandiso chinokurudzira dhizaini dhizaini inogona kuva nehukuru uye huremu zvinodiwa izvo zvinofambisa hurukuro mune imwe nzira kana imwe. High frequency applications may require materials other than standard FR4. Pamusoro pezvo, zvisarudzo nezverudzi rweFR4 zvinhu zvinokanganisa sarudzo nezve kusarudzwa kwenzira dzekuchera kana zvimwe zviwanikwa zvekugadzira. Nepo mamwe masisitimu achibaya nemhangura zviri nyore, mamwe haapindire mukati megirazi magirazi.

Pamusoro pekusarudza chaicho mhando yezvinhu, dhizaini dhizaini inofanirwa zvakare kuona kuti mugadziri nemugadziri vanogona kushandisa chaiyo ndiro ukobvu uye marata maitiro. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Kunyangwe mahwendefa mukobvu achibvumidza apasi madiki, izvo zvinoda kuitwa zveprojekti zvinogona kudoma mahwendefa matete ayo anogona kukundikana pasi pemamwe mamiriro ezvakatipoteredza. Dhizaini yekugadzira yaifanirwa kutarisa kuti mugadziri aive nekwanisi yekushandisa nzira ye “interconnect layer” nekuboora maburi pakadzika kwakaringana, uye nekuona kuti mushonga wemakemikari unoshandiswa pakuzadza magetsi unozadza maburi.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Nekuda kweEELIC, zvigadzirwa zvePCBB zvinogona kutora mukana wekubatana kwakakomba, kwakaomarara kunodiwa kumatunhu epamusoro-soro. Nekuti ELIC inoshandisa makobvu-akazara emhangura-akazara ekubatanidza, inogona kubatanidzwa pakati pematanho maviri pasina kushomeka bhodhi redunhu.

Chinhu chinosarudzwa chinokanganisa marongerwo

Chero kutaurirana nevagadziri uye vagadziri zvine chekuita neHDI dhizaini inofanirwa zvakare kutarisisa pamatanho chaiwo ezvinhu zvakakurisa-kuwanda. The selection of components affects wiring width, position, stack and hole size. Semuenzaniso, HDI pcb magadzirirwo anowanzo sanganisira dense bhora grid array (BGA) uye yakapatsanuka BGA BGA inoda pini kutiza. Zvinhu zvinokanganisa magetsi uye nekuvimbika chiratidzo pamwe nekuvimbika kwepanyama kwebhodhi zvinofanirwa kuzivikanwa kana uchishandisa izvi zvishandiso. Izvi zvinhu zvinosanganisira kuwana kusarudzika kwakakodzera pakati pematanho epamusoro uye ezasi kudzikisira kuwiriranisa crosstalk uye kudzora EMI pakati pezvikamu zvemasaini zvemukati.Symmetrically spaced components will help prevent uneven stress on the PCB.

Teerera kune chiratidzo, simba uye kutendeka kwemuviri

Kunze kwekuvandudza kuvimbika kwemasaini, iwe unogona zvakare kuwedzera kusimba kwesimba. Nekuti iyo HDI PCB inofambisa iyo yekumisikidza padenga padyo nepamusoro, simba rekuvimbika rinovandudzwa. Denga repamusoro pebhodhi rine denderedzwa rekusimbisa uye dura rekugovera magetsi, iro rinogona kusunganidzwa kune iyo yekumisidzana nhete kuburikidza nemakomba mapofu kana microholes, uye inoderedza huwandu hwemaburi endege.

HDI PCB inoderedza huwandu hwemakomba-kuburikidza nemukati mebhodhi. In turn, reducing the number of perforations in the power plane provides three major advantages:

Iyo yakakura nzvimbo yemhangura inodyisa AC uye DC yazvino muchip simba pini

L resistance decreases in the current path

L Nekuda kwekudzikira kwakadzika, iko iko iko kushandura ikozvino kunogona kuverenga pini yemagetsi.

Imwe poindi yakakosha yekukurukurirana ndeyekuchengetedza yakaderera tambo upamhi, yakachengeteka nzvimbo uye track yakafanana. Pane yekupedzisira nyaya, tanga kuwana yunifomu yemhangura ukobvu uye wiring zvakafanana panguva yekugadzira maitiro uye enderera neyakagadzirwa uye yekugadzira maitiro.

Kusava nenzvimbo dzakachengeteka kunogona kutungamira mukuwandisa kwemafirimu panguva yemukati yakaoma firimu maitiro, ayo anogona kutungamira kumatunhu mapfupi. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Dhizaina matimu uye vagadziri vanofanirwa zvakare kufunga nezvekuchengetedza njanji senzira yekudzora chiratidzo chetambo impedance.

Gadzira uye shandisa yakatarwa dhizaini mitemo

Yakakwirira-density masisitimu anoda madiki ekunze zviyero, zvakanakisa wiring uye akasimba chikamu chinzvimbo, uye nekudaro zvinoda akasiyana dhizaini maitiro. Iyo HDI pcb yekugadzira maitiro inotsamira pane laser kuchera, CAD uye CAM software, laser yakananga imaging maitiro, akasarudzika ekugadzira michina, uye opareta hunyanzvi. Kubudirira kweichi chiitiko chose kunoenderana muchikamu nemitemo yekugadzira iyo inoratidza impedance zvinodiwa, conductor upamhi, saizi gomba, uye zvimwe zvinhu zvinokanganisa marongerwo. Kugadzira yakadzama dhizaini dhizaini kunobatsira kusarudza chaicho chigadzirwa kana mugadziri webhodhi rako uye nekuisa hwaro hwekutaurirana pakati pezvikwata.