In PCB naqshadeynta, fiilooyinka waa tallaabo muhiim ah oo lagu dhammaystirayo naqshadeynta alaabta. Waxa la odhan karaa diyaargarow hore ayaa loo sameeyay. Dhammaan PCB-ga, habka naqshadaynta fiilooyinka ayaa leh xadka ugu sarreeya, xirfadaha ugu fiican, iyo culeyska shaqada ee ugu weyn. Xargaha PCB waxaa ka mid ah fiilooyinka hal dhinac ah, fiilooyinka laba-geesoodka ah iyo fiilooyinka kala duwan. Waxa kale oo jira laba siyood oo fiilooyinka: silig toos ah iyo fiilooyinka isdhexgalka. Kahor inta aadan si toos ah u xirin, waxaad isticmaali kartaa is dhexgal si aad horay ugu xirto khadadka baahida badan. Cidhifyada dhamaadka wax-soo-gelinta iyo dhamaadka wax-soo-saarka waa in laga fogaadaa inay ku dhegganaadaan isbarbar-dhigga si looga fogaado faragelinta milicsiga. Haddii loo baahdo, silig dhulka ah waa in lagu daraa si go’doon ah, iyo fiilooyinka labada lakab ee isku xiga waa in ay siman yihiin midba midka kale. Isku-xidhka dulinku waa sahlan tahay in la is barbar dhigo.

The layout rate of automatic routing depends on a good layout. The routing rules can be preset, including the number of bending times, the number of vias, and the number of steps. Generally, explore the warp wiring first, quickly connect the short wires, and then perform the labyrinth wiring. First, the wiring to be laid is optimized for the global wiring path. It can disconnect the laid wires as needed. And try to re-wire to improve the overall effect.

The current high-density PCB design has felt that the through-hole is not suitable, and it wastes a lot of valuable wiring channels. In order to solve this contradiction, blind and buried hole technologies have emerged, which not only fulfill the role of the through-hole It also saves a lot of wiring channels to make the wiring process more convenient, smoother, and more complete. The PCB board design process is a complex and simple process. To master it well, a vast electronic engineering design is required. Only when personnel experience it by themselves can they get the true meaning of it.

1 Daawaynta korontada iyo siliga dhulka

Xitaa haddii fiilooyinka ku jira guddiga PCB-ga oo dhan si fiican loo dhammeeyo, faragelinta ay sababtay tixgelinta aan habooneyn ee korontada iyo siliga dhulka ayaa hoos u dhigi doona waxqabadka alaabta, mararka qaarkoodna xitaa waxay saameeyaan heerka guusha alaabta. Sidaa darteed, waa in si dhab ah loo qaataa fiilooyinka korontada iyo dhulka, iyo faragelinta buuqa ee ka yimaada fiilooyinka korontada iyo dhulka waa in la yareeyo si loo hubiyo tayada alaabta.

Every engineer who is engaged in the design of electronic products understands the cause of the noise between the ground wire and the power wire, and now only the reduced noise suppression is described:

(1) Waxaa si fiican loo yaqaan in lagu daro capacitor decoupling inta u dhaxaysa korontada iyo dhulka.

(2) Balaadhka xadhkaha korontada iyo dhulka inta suurtogalka ah, waxa fiican in siliga dhulka uu ka balaadhan yahay siliga korontada, xidhiidhkoodu waa: silig dhulka>powerfid>silig silig, sida caadiga ah ballaca siliga signalku waa: 0.2～ 0.3mm, ugu badan Balaadhka caatada ah wuxuu gaari karaa 0.05 ~ 0.07mm, xarigga korantaduna waa 1.2 ~ 2.5 mm.

For the PCB of the digital circuit, a wide ground wire can be used to form a loop, that is, to form a ground net to use (the ground of the analog circuit cannot be used in this way)

(3) U isticmaal lakabka naxaasta ah ee bed-weyn sidii silig dhulka ah, oo ku xidh meelaha aan la isticmaalin ee looxa wareegtada daabacan ee dhulka sida silig dhulka ah. Ama waxaa laga samayn karaa loox multilayer ah, iyo korontada iyo fiilooyinka dhulka ayaa ku fadhiya midkiiba hal lakab.

2 Common ground processing of digital circuit and analog circuit

Many PCBs are no longer single-function circuits (digital or analog circuits), but are composed of a mixture of digital and analog circuits. Therefore, it is necessary to consider the mutual interference between them when wiring, especially the noise interference on the ground wire.

Inta jeer ee wareegga dhijitaalka ah ayaa sarreeya, iyo dareenka wareegga analoogga waa mid xooggan. Xariiqda calaamadda, xariiqda calaamadda-soo noqnoqda-sare waa in ay ka fogaato inta suurtogalka ah aaladda wareegga analoogga ee xasaasiga ah. Marka la eego khadka dhulka, PCB-ga oo dhan wuxuu leeyahay hal nood oo keliya oo adduunka ka baxsan, markaa dhibaatada dhijitaalka ah iyo dhulka analogga ah waa in lagu xalliyaa gudaha PCB-ga, dhulka dhijitaalka ah iyo dhulka analooga ah ee ku dhex jira guddiga ayaa dhab ahaantii kala go’ay oo way kala duwan yihiin. aan isku xidhnayn, laakiin isku xidhka (sida furayaasha, iwm.) isku xidhka PCB-ga iyo adduunka ka baxsan. Waxa jira xidhiidh gaaban oo u dhexeeya dhulka dhijitaalka ah iyo dhulka analooga ah. Fadlan ogow in uu jiro hal dhibic oo kaliya. Waxa kale oo jira sababo aan caadi ahayn oo ku saabsan PCB-ga, kaas oo lagu go’aamiyo naqshadaynta nidaamka.

3 Xariiqda calaamaduhu waxay dul saartaa lakabka korantada (dhulka).

Xadhkaha boodhka badan ee daabacan ee daabacan, sababtoo ah ma jiraan fiilooyinka badan oo ku hadhay lakabka khadka signalka oo aan la dhigin, ku darida lakabyo badan ayaa sababi doona qashinka waxayna kordhinayaan shaqada wax soo saarka, qiimaha ayaa kordhin doona si waafaqsan. Si aad u xalliso iska hor imaadkan, waxaad ka fiirsan kartaa fidinta lakabka korantada (dhulka). Lakabka awoodda waa in marka hore la tixgeliyaa, iyo lakabka dhulka labaad. Sababtoo ah waxaa ugu wanaagsan in la ilaaliyo daacadnimada sameynta.

4 Treatment of connecting legs in large area conductors

Dhulka ballaaran ee dhulka (korontada), lugaha qaybaha guud ayaa ku xiran. Daaweynta lugaha isku xira waxay u baahan tahay in si buuxda loo tixgeliyo. Marka la eego waxqabadka korantada, way fiicantahay in lagu xidho suufka lugaha qaybta dusha naxaasta. Waxa jira khataro qarsoon oo aan loo baahnayn oo ku jira alxanka iyo isku-xidhka qaybaha, sida: ① alxanka wuxuu u baahan yahay kuleyliyeyaasha awoodda sare leh. ②Waa ay fududahay in la keeno kala goysyada alxanka. Sidaa darteed, labadaba waxqabadka korantada iyo shuruudaha nidaamka labadaba waxaa loo sameeyaa suufyo iskutallaab ah, oo loo yaqaan gaashaan kulaylka, oo badanaa loo yaqaan suufka kulaylka (Thermal), sidaa darteed kala-goysyada alxanka ee la taaban karo ayaa laga yaabaa inay soo baxaan sababtoo ah kulaylka xad-dhaafka ah ee qaybta inta lagu jiro alxanka. Galmada si weyn ayaa loo dhimay. Habaynta lugta awoodda (dhulka) ee guddiga multilayer waa isku mid.

5 Doorka nidaamka shabakada ee fiilooyinka

Nidaamyo badan oo CAD ah, fiilooyinka waxaa go’aamiya nidaamka shabakada. Shabakadu aad bay u cufan tahay oo waddadu way korodhay, laakiin tallaabadu aad bay u yar tahay, iyo xaddiga xogta goobta ku taal aad bay u badan tahay. Tani waxay si lama huraan ah u yeelan doontaa shuruudo sare oo loogu talagalay booska kaydinta aaladda, iyo sidoo kale xawaaraha xisaabinta ee alaabada elektiroonigga ah ee ku saleysan kumbuyuutarka. Saamayn weyn Wadooyinka qaarkood waa kuwo aan sax ahayn, sida kuwa ay ku jiraan suufka lugaha qayb ka mid ah ama iyada oo lagu dhejinayo godadka iyo godadka go’an. Shabakado aad u yar iyo kanaalo aad u yar ayaa saameyn weyn ku leh heerka qaybinta. Sidaa darteed, waa in uu jiraa hab si fiican u kala fogaaday oo macquul ah si uu u taageero fiilooyinka.

The distance between the legs of standard components is 0.1 inches (2.54mm), so the basis of the grid system is generally set to 0.1 inches (2.54 mm) or an integral multiple of less than 0.1 inches, such as: 0.05 inches, 0.025 inches, 0.02 Inches etc.

6 Design Rule Check (DRC)

Ka dib marka la dhammeeyo naqshadeynta xargaha, waxaa lagama maarmaan ah in si taxadar leh loo hubiyo in naqshadeynta xargaha ay la kulanto sharciyada uu dejiyo naqshadeeyaha, isla mar ahaantaana, waa lagama maarmaan in la xaqiijiyo in xeerarku ay buuxinayaan shuruudaha habka wax soo saarka guddiga daabacan. Kormeerka guud wuxuu leeyahay dhinacyada soo socda:

(1) Haddii masaafada u dhaxaysa xariiqda iyo xariiqda, xariiqda iyo qaybta suufka, xariiqda iyo godka, qaybta suufka iyo dalool, dalool iyo dalool ay tahay mid macquul ah, iyo haddii ay buuxinayso shuruudaha wax soo saarka.

(2) Balaadhka xadhka korantada iyo xadhkaha dhulka ma ku haboon yihiin? Korontada iyo xariiqda dhulka miyay si adag isugu xidhan yihiin Ma jirtaa meel PCB ka mid ah oo siliga dhulka la ballaarin karo?

(3) Haddii tillaabooyinka ugu wanaagsan loo qaaday xariiqyada calaamadaha muhiimka ah, sida dhererka ugu gaaban, xariiqda ilaalinta ayaa lagu daraa, iyo xariiqda wax soo saarka iyo xariiqda wax soo saarka ayaa si cad loo kala saaray.

(4) Haddii ay jiraan fiilooyinka dhulka oo kala duwan oo loogu talagalay wareegga analoogga iyo wareegga dhijitaalka ah.

(5) Haddii sawirada (sida calaamadaha iyo sharraxaadaha) ee lagu daray PCB-ga ay keeni doonaan calaamad gaaban oo wareeg ah.

(6) Wax ka beddel qaababka toosan ee aan la rabin.

(7) Is there a process line on the PCB? Whether the solder mask meets the requirements of the production process, whether the solder mask size is appropriate, and whether the character logo is pressed on the device pad, so as not to affect the quality of the electrical equipment.

(8) Haddii cidhifka bannaanka ee lakabka dhulka awoodda ee guddiga multilayer la dhimo, sida bireed naxaas ah lakabka dhulka koronto bannaanka guddiga, taas oo keeni karta wareeg gaaban.