In design, layout is an important part. The quality of the layout result will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step to a successful PCB design. Especially the pre-layout is the process of thinking about the entire circuit board, signal flow, heat dissipation, structure and other structures. If the pre-layout fails, no amount of effort will be needed.

PCB layout design The design process flow of printed circuit boards includes schematic design, electronic component database registration, design preparation, block division, electronic component configuration, configuration confirmation, wiring and final inspection. In the process of the process, no matter which process is found to be a problem, it must be returned to the previous process for reconfirmation or correction.

Maqaalkani waxa uu marka hore soo bandhigayaa xeerarka naqshadaynta qaabka PCB iyo farsamooyinka, ka dibna wuxuu sharxayaa sida loo naqshadeeyo loona kormeero qaabka PCB, laga bilaabo shuruudaha DFM qaabeynta, shuruudaha naqshadaynta kuleylka, shuruudaha daacadnimada calaamadaha, shuruudaha EMC, dejinta lakabka iyo shuruudaha qaybinta dhulka, iyo modules awood. Shuruudaha iyo dhinacyada kale si faahfaahsan ayaa loo falanqeyn doonaa, oo la soco tifaftiraha si aad u ogaato faahfaahinta.

Xeerarka qaabeynta PCB

1. Xaaladaha caadiga ah, dhammaan qaybaha waa in lagu hagaajiyaa isla dusha sare ee wareegga wareegga. Kaliya marka qaybaha heerka ugu sarreeya ay aad u cufan yihiin, ayaa lagu rakibi karaa qalabka qaar dhererkoodu xaddidan yahay iyo jiilka kulaylka yar, sida chip resistors, capacitors chip, iyo chip capacitors. Chip IC, iwm ayaa la dhigayaa lakabka hoose.

2. Marka la eego dhismaha hubinta waxqabadka korantada, qaybaha waa in lagu dhejiyaa shabkada oo loo habeeyaa si siman ama siman midba midka kale si ay u noqdaan kuwo nadiif ah oo qurux badan. Xaaladaha caadiga ah, qaybaha looma oggola inay is-kordhiyaan; habaynta qaybaha waa in ay ahaadaan kuwo cufan, qaybahana waa in lagu habeeyaa qaabka oo dhan. Qaybintu waa isku mid oo cufan.

3. The minimum distance between adjacent land patterns of different components on the circuit board should be above 1mm.

4. Masaafada u jirta cidhifka guddiga wareegga guud ahaan kama yarayn 2MM. Qaabka ugu fiican ee looxa wareegga waa leydi, iyo saamiga dhinaca waa 3: 2 ama 4: 3. Marka cabbirka wareegga wareegga uu ka weyn yahay 200MM by 150MM, tixgeli waxa guddiga wareeggu uu u adkeysan karo xoogga makaanikada.

PCB layout design skills

Naqshadeynta qaabeynta PCB-ga, waa in la falanqeeyaa cutubyada guddiga wareegga, iyo naqshadeynta qaabeynta waa in lagu saleeyaa shaqada bilawga ah. Marka la dejinayo dhammaan qaybaha wareegga, mabaadi’da soo socota waa in la buuxiyaa:

1. U diyaari booska unug kasta oo wareeg ah oo shaqaynaya si waafaqsan socodka wareegga, si qaabayntu ugu habboonaato wareegga ishaarada, calaamaduna waxa lagu hayaa isla jihadii intii suurtogal ah [1].

2. Take the core components of each functional unit as the center and lay out around him. The components should be uniformly, integrally and compactly arranged on the PCB to minimize and shorten the leads and connections between the components.

3. Wareegyada ku shaqeeya mawjadaha sare, waa in la tixgeliyaa cabbirada qaybinta ee u dhexeeya qaybaha. Wareegyada guud, qaybaha waa in loo habeeyaa si isku mid ah sida ugu macquulsan, taas oo aan ahayn qurux kaliya, laakiin sidoo kale si sahlan loo rakibo oo si sahlan loo soo saaro wax soo saarka.

Sida loo naqshadeeyo loona kormeero qaabka PCB

1. DFM requirements for layout

1. Waddada habka ugu wanagsan ayaa la go’aamiyay, dhammaan aaladahana waxaa la saaray sabuuradda.

2. The origin of the coordinates is the intersection of the left and lower extension lines of the board frame, or the lower left pad of the lower left socket.

3. The actual size of the PCB, the location of the positioning device, etc. are consistent with the process structure element map, and the device layout of the area with restricted device height requirements meets the requirements of the structure element map.

4. Booska wareegga garaaca, qalabka dib-u-dejinta, iftiinka tilmaamaya, iwm.

5. Qaabka sare ee looxa waxa uu leeyahay shucaac siman oo ah 197mil, ama waxa loo qaabeeyey si waafaqsan sawirka cabbirka qaabdhismeedka.

6. Looxyada caadiga ah waxay leeyihiin geesaha habka 200mil; Dhinacyada bidix iyo midig ee diyaaradda dhabarku waxay leeyihiin cidhifyo ka badan 400mil, dhinacyada sare iyo hoose waxay leeyihiin geeso ka badan 680mil. Meelaynta qalabku kama hor imanayso booska furitaanka daaqadda.

7. All kinds of additional holes (ICT positioning hole 125mil, handle bar hole, elliptical hole and fiber holder hole) that need to be added are all missing and set correctly.

8. Qalabka biin-gaaban, jihada aaladda, garoonka qalabka, maktabadda aaladaha iwm ee lagu farsameeyay alxanka mawjada waxay tixgalinayaan shuruudaha alxanka hirarka.

9. The device layout spacing meets the assembly requirements: surface mount devices are greater than 20mil, IC is greater than 80mil, and BGA is greater than 200mil.

10. Qaybaha curyaaminta waxay leeyihiin in ka badan 120 mils masaafada dusha sare ee qaybta, mana jiraan wax qalab ah oo ku yaal aagga qaybaha curyaaminta ee dusha alxanka.

11. Ma jiraan qalab gaaban oo u dhexeeya qalabka dhaadheer, mana jiraan qalab balastik ah iyo kuwa gaaban iyo kuwa yar yar ee dhexda u dhexeeya 5mm inta u dhaxaysa qalabka dhererkoodu ka weyn yahay 10mm.

12. Aaladaha dabaysha waxay leeyihiin calaamado xariirta polarity. Jihooyinka X iyo Y ee isku nooc ee qaybaha fur-intu waa isku mid.

13. All devices are clearly marked, no P*, REF, etc. are not clearly marked.

14. Waxaa jira 3 meelaynta korka oogada oo ay ku jiraan aaladaha SMD, kuwaas oo lagu dhejiyay qaabka “L”. Masaafada u dhaxaysa badhtamaha calaamadaynta meelaynta iyo cidhifka looxa ayaa ka weyn 240 mayl.

15. Haddii aad u baahan tahay in aad samayso boarding processing, qaabeynta waxaa loo arkaa in ay fududeeyaan boarding iyo PCB processing iyo kulan.

16. Cidhifyada jajaban (cidhifyada aan caadiga ahayn) waa in lagu buuxiyaa iyada oo la adeegsanayo godad wax lagu shiido iyo godadka shaambada. Daloolka shaambada waa bannaan aan biraha lahayn, guud ahaan dhexroorka 40 mayl iyo 16 mayl cidhifka u jira.

17. The test points used for debugging have been added in the schematic diagram, and they are placed appropriately in the layout.

Marka labaad, shuruudaha naqshadeynta kuleylka ee qaabka

1. Heating components and exposed components of the casing are not in close proximity to wires and heat-sensitive components, and other components should also be properly kept away.

2. The placement of the radiator takes into account the convection problem, and there is no interference of high components in the projection area of ​​the radiator, and the range is marked on the mounting surface with silk screen.

3. Nashqadaynta waxay ku xisaabtamaysaa kanaalada kuleyliyaha macquulka ah oo siman.

4. Capacitor-ka korantada waa in si fiican looga soocaa qalabka kuleylaha sare.

5. Tixgeli kala daadinta kulaylka aaladaha awoodda sare leh iyo aaladaha hoostiisa.

Saddexaad, shuruudaha daacadnimada calaamadda qaabeynta

1. The start-end matching is close to the sending device, and the end matching is close to the receiving device.

2. Place decoupling capacitors close to related devices

3. Place crystals, crystal oscillators and clock drive chips close to related devices.

4. Xawaaraha sare iyo xawaaraha hooseeya, dhijitaalka ah iyo analoogga ayaa si gaar ah loo habeeyey iyadoo loo eegayo cutubyada.

5. Go’aami qaab dhismeedka baska ee baska iyadoo lagu salaynayo falanqaynta iyo natiijada jilitaanka ama khibrada jirta si loo hubiyo in shuruudaha nidaamka la buuxiyey.

6. If it is to modify the board design, simulate the signal integrity problem reflected in the test report and give a solution.

7. The layout of the synchronous clock bus system meets the timing requirements.

Afar, shuruudaha EMC

1. Inductive devices that are prone to magnetic field coupling, such as inductors, relays, and transformers, should not be placed close to each other. When there are multiple inductance coils, the direction is vertical and they are not coupled.

2. Si looga fogaado faragelinta elektromagnetic ee u dhaxaysa qalabka ku yaal dusha alxanka ee looxa kaligiis ah iyo sabuuradda ku dhow, waa in aan qalab xasaasi ah iyo aaladaha shucaaca xooggan la saarin dusha alxanka ee sabuuradaha.

3. The interface components are placed close to the edge of the board, and appropriate EMC protection measures have been taken (such as shielding shells, hollowing out of the power supply ground, etc.) to improve the EMC capability of the design.

4. Wareegga ilaalinta ayaa la dhigayaa meel u dhow wareegga isdhexgalka, iyadoo la raacayo mabda’a ilaalinta koowaad ka dibna shaandhaynta.

5. Fogaanta u jirta jirka gaashaanka iyo qolofta gaashaanka ilaa jirka gaashaanka iyo gaashaanka qolofta daboolka ayaa ka badan 500 mils ee aaladaha leh awoodda gudbinta sare ama gaar ahaan xasaasiga ah (sida oscillators crystals, crystals, iwm.).

6. A 0.1uF capacitor is placed near the reset line of the reset switch to keep the reset device and reset signal away from other strong devices and signals.

Five, layer setting and power supply and ground division requirements

1. Marka laba lakab oo calaamad ah ay si toos ah isugu xigaan, xeerarka fiilooyinka toosan waa in la qeexaa.

2. Lakabka korantada ee ugu muhiimsan wuxuu ku dheggan yahay lakabka dhulka ee u dhigma inta ugu badan ee suurtogalka ah, lakabka korantaduna wuxuu la kulmaa qaanuunka 20H.

3. Each wiring layer has a complete reference plane.

4. Looxyada lakabyada badan waa la dahaadhay oo walxaha xudunta u ah (CORE) waa mid simmetrical ah si looga hortago dagaal-ku-soo-baxa ay sababto qaybinta aan sinnayn ee cufnaanta maqaarka naxaasta iyo dhumucda dhexdhexaadka ah ee aan sinnayn.

5. Dhumucda looxa waa in aanu dhaafin 4.5mm. Kuwa leh dhumucdiisu ka weyn tahay 2.5mm (diyaarad dhabarka ka weyn 3mm), farsamayaqaanadu waa inay xaqiijiyaan in aanay dhibaato ku jirin habaynta PCB-ga, isku-xidhka, iyo qalabka, dhumucda guddiga kaadhka PC-ga waa 1.6mm.

6. Marka saamiga dhumucda-ilaa-dhexroor ee fiilada uu ka weyn yahay 10:1, waxaa xaqiijin doona soo saaraha PCB.

7. The power and ground of the optical module are separated from other power and ground to reduce interference.

8. Awoodda iyo farsamaynta dhulka ee qaybaha muhiimka ah waxay buuxiyaan shuruudaha.

9. Marka xakamaynta impedance loo baahan yahay, xuduudaha dejinta lakabka ayaa buuxiya shuruudaha.

Six, power module requirements

1. Naqshadeynta qaybta korantada waxay hubisaa in fiilooyinka wax-soo-saarka iyo soo-saarka ay yihiin kuwo siman oo aan dhaafin.

2. Marka looxa kaligiis ahi uu koronto siiyo sabuuradda hoose, dhig wareegga filter-ka u dhigma meel u dhow shabka korantada ee looxa-kaliya iyo halka laga galo awoodda sabuuradda hoose.

Toddoba, shuruudo kale

1. Qaabaynta ayaa tixgalinaysa habsami u socodka guud ee fiilooyinka, iyo socodka xogta ugu muhiimsan waa macquul.

2. Hagaajin shaqooyinka pin ee ka saarida, FPGA, EPLD, darawalka baska iyo aaladaha kale si waafaqsan natiijooyinka qaabaynta si aad u wanaajiso qaabka.

3. Nashqadaynta waxay tixgalinaysaa kororka ku haboon ee booska fiilooyinka cufan si looga fogaado xaalada aan la marin karin.

4. Haddii qalab gaar ah, qalab gaar ah (sida 0.5mmBGA, iwm.), iyo hababka gaarka ah la qaatay, muddada bixinta iyo habsocodka si buuxda loo tixgeliyey, oo ay xaqiijiyeen soo saarayaasha PCB iyo shaqaalaha habsocodka.

5. Xidhiidhka u dhigma biinanka xidhiidhiyaha gusset-ka ayaa la xaqiijiyay si looga hortago jihada iyo jihaynta xidhiidhiyaha gusset-ka in la rogo.

6. If there are ICT test requirements, consider the feasibility of adding ICT test points during layout, so as to avoid difficulty in adding test points during the wiring phase.

7. When a high-speed optical module is included, the layout of the optical port transceiver circuit is prioritized.

8. Ka dib marka qaabaynta la dhammeeyo, 1:1 sawir urureedka ayaa la siiyay shaqaalaha mashruuca si ay u hubiyaan in xulashada xidhmada qalabku ay sax tahay marka loo eego qaybta qalabka.

9. Furitaanka daaqada, diyaaradda gudaha ayaa loo arkaa in dib loo celinayo, waxaana la dhigay meel ku habboon fiilooyinka mamnuucida.