I. Horudhac

Siyaabaha lagu xakameynayo faragelinta Guddiga PCB waxay kala yihiin:

1. Yaree aagga loop-ka habka kala duwanaanshaha.

2. Yaree soo noqoshada qaylada soo noqnoqda ee soo noqnoqda (shaandhaynta, go’doominta iyo isbarbardhigga).

3. Yaree korantada qaabka caadiga ah (nakhshad dhulka). 47 mabaadi’da xawaaraha sare ee PCB EMC design II. Soo koobida mabaadi’da naqshadaynta PCB

Mabda’a 1: inta jeer ee saacada PCB waxay dhaaftay 5MHZ ama wakhtiga kor u kaca wuxuu ka yar yahay 5ns, guud ahaan waxay u baahan tahay isticmaalka naqshadaynta boodhka lakabyada badan.

Reason: The area of ​​signal loop can be well controlled by adopting multi-layer board design.

Mabda’a 2: Looxyada lakabyada badan, lakabyada fiilooyinka muhiimka ah (lakabyada ay ku jiraan xariiqyada saacadaha, basaska, xadhkaha calaamadaha interfiga, xadadka raadiyaha, dib u habeynta xariiqyada signalada, chip xulashada khadadka calaamadaha, iyo xariiqyada calaamadaha kala duwan) waa inay ahaadaan kuwo ku xiga. ilaa diyaaradii dhulka oo dhamaystiran. Waxaa fiican inta u dhaxaysa laba diyaaradood oo dhulka ah.

Reason: The key signal lines are generally strong radiation or extremely sensitive signal lines. Wiring close to the ground plane can reduce the signal loop area, reduce the radiation intensity or improve the anti-interference ability.

Mabda’a 3: Looxyada hal lakab ah, labada dhinac ee xadhkaha calaamadaha muhiimka ah waa in lagu daboolaa dhulka.

Sababta: Calaamadaha muhiimka ah ayaa lagu daboolay dhulka labada dhinacba, dhinaca kale, waxay yareyn kartaa aagga wareegga calaamadda, dhinaca kale, waxay ka hortagi kartaa is-dhaafsiga u dhexeeya xariiqda calaamadaha iyo xariiqyada kale ee calaamadaha.

Mabda’a 4: Guddi laba-lakab ah, dhul ballaaran oo dhul ah waa in lagu dhejiyaa diyaaradda saadaasha ee khadka muhiimka ah, ama la mid ah guddi hal dhinac ah.

Sababta: waxay la mid tahay in calaamadda muhiimka ah ee guddiga multilayer ay ku dhowdahay diyaaradda dhulka.

Mabda’a 5: Boodhka multilayer, diyaaradda korontadu waa in ay dib u celisaa 5H-20H marka loo eego diyaaradda dhulka ku xigta (H waa masaafada u dhaxaysa sahayda korontada iyo diyaaradda dhulka).

Reason: The indentation of the power plane relative to its return ground plane can effectively suppress the edge radiation problem.

Principle 6: The projection plane of the wiring layer should be in the area of ​​the reflow plane layer.

Reason: If the wiring layer is not in the projection area of ​​the reflow plane layer, it will cause edge radiation problems and increase the signal loop area, resulting in increased differential mode radiation.

Principle 7: In multi-layer boards, there should be no signal lines larger than 50MHZ on the TOP and BOTTOM layers of the single board. Reason: It is best to walk the high-frequency signal between the two plane layers to suppress its radiation to the space.

Mabda’a 8: Looxyada kelida ah ee leh heerarka hawlgelinta ee ka sarreeya 50MHz, haddii lakabka labaad iyo lakabka penultimate ay yihiin lakabyo fiilooyinka, lakabyada Sare iyo Boottom waa in lagu daboolaa foornada naxaasta ah ee dhulka leh.

Sababta: Way fiicantahay in lagu socdo ishaarada-soo noqnoqda sare ee u dhaxaysa labada lakab ee diyaaradda si loo xakameeyo shucaaca meel bannaan.

Principle 9: In a multilayer board, the main working power plane (the most widely used power plane) of the single board should be in close proximity to its ground plane.

Sababta: Diyaaradda korontada ku dhow iyo diyaaradda dhulka ayaa si wax ku ool ah u yareyn karta wareegga wareegga wareegga korontada.

Principle 10: In a single-layer board, there must be a ground wire next to and parallel to the power trace.

Sababta: yaree aagga laydhka hadda jira.

Principle 11: In a double-layer board, there must be a ground wire next to and parallel to the power trace.

Sababta: yaree aagga laydhka hadda jira.

Mabda’a 12: Naqshadda lakabka ah, isku day inaad iska ilaaliso lakabyada fiilooyinka ku xiga. Haddii ay lagama maarmaan tahay in lakabyada fiilooyinka ay isku dhow yihiin midba midka kale, waa in si habboon loo kordhiyo kala fogaanshaha lakabka ee u dhexeeya labada lakab, iyo kala fogaanshaha lakabka u dhexeeya lakabka fiilooyinka iyo wareegga signalka waa in la yareeyaa.

Sababta: Raad-raacyada isbar-bar-dhigga ee lakabyada fiilooyinka ee ku xiga waxay sababi karaan hadal-is-dhaafsi.

Mabda’a 13: Lakabyada diyaaradda ee ku xiga waa in ay iska ilaaliyaan in ay isku dul dhacaan diyaaradahooda saadaalinta.

Sababta: Marka saadaasha isdhaafsadaan, awoodda isku-xidhka ee lakabyada waxay keeni doontaa in buuqa lakabyada dhexdooda isku lammaaniyo midba midka kale.

Mabda’a 14: Markaad naqshadaynayso qaabka PCB, si buuxda u fiirso mabda’a naqshadaynta ee ku dhejinta xariiq toosan oo la socota jihada socodka signalka, iskuna day inaad iska ilaaliso dib u soo noqoshada hore iyo dib.

Reason: Avoid direct signal coupling and affect signal quality.

Mabda’a 15: Marka module badan lagu dhejiyo isla PCB, wareegyada dhijitaalka ah iyo wareegyada analooga ah, iyo xawaaraha sare iyo xawaaraha hooseeya waa in si gaar ah loo dhigaa.

Sababta: Ka fogow faragelinta labada dhinac ee wareegyada dhijitaalka ah, wareegyada analooga ah, wareegyada xawaaraha sare leh, iyo wareegyada xawaaraha hooseeya.

Mabda’a 16: Marka ay jiraan wareegyo sare, dhexdhexaad ah, iyo xawaare hoose oo isku mid ah guddiga wareegga isku mar, raac xawaaraha sare iyo xawaaraha dhexdhexaadka ah oo ka fogow is-dhexgalka.

Reason: Avoid high-frequency circuit noise from radiating to the outside through the interface.

Principle 17: Energy storage and high-frequency filter capacitors should be placed near unit circuits or devices with large current changes (such as power supply modules: input and output terminals, fans and relays).

Sababta: Jiritaanka capacitors kaydinta tamarta waxay yarayn kartaa aagga loop ee wareegyada waaweyn ee hadda jira.

Principle 18: The filter circuit of the power input port of the circuit board should be placed close to the interface. Reason: to prevent the line that has been filtered from being coupled again.

Mabaadi’da 19: PCB-ga, shaandhaynta, ilaalinta iyo qaybaha go’doominta ee wareegga is-dhexgalka waa in lagu dhejiyaa meel u dhow is-dhexgalka.

Reason: It can effectively achieve the effects of protection, filtering and isolation.

Principle 20: If there is both a filter and a protection circuit at the interface, the principle of first protection and then filtering should be followed.

Sababta: Wareegga ilaalinta waxaa loo isticmaalaa in lagu xakameeyo koronto-dhaafka dibadda iyo qulqulka. Haddii wareegga ilaalinta la dhigo ka dib wareegga shaandhada, wareegga shaandhada waxaa dhaawacmi doona koronto-dhaafka iyo qulqulka.