Waa maxay HDI (High Density Interconnect) guddiga PCB?

Cufnaanta High Interconnect (HDI) PCB, waa nooc ka mid ah wax soo saarka guddiga wareegga daabacan (teknoolajiyada), isticmaalka dalool yar-indho la’aan, technology godka la aasay, guddiga wareegga leh cufnaanta qaybinta xad sare. Sababtoo ah horumarinta joogtada ah ee tignoolajiyada shuruudaha korantada xawaaraha sare leh, guddiga wareeggu waa inuu bixiyaa xakamaynta xakamaynta sifooyinka ac, awoodda gudbinta sare ee soo noqnoqda, yaraynta shucaaca aan loo baahnayn (EMI) iyo wixii la mid ah. Isticmaalka Stripline, qaab-dhismeedka Microstrip, naqshadeynta lakabyo badan ayaa lagama maarmaan noqota. Si loo yareeyo dhibaatada tayada ee gudbinta calaamadaha, walxaha dahaarka leh iskudhafka dielectric hooseeya iyo heerka hoos u dhigista ayaa la qaadan doonaa. Si loo waafajiyo miniaturization-ka iyo diyaarinta qaybaha elektiroonigga ah, cufnaanta guddiga wareegga ayaa si joogto ah loo kordhin doonaa si loo daboolo baahida.

HDI (isku-xirnaanta cufnaanta sare) guddiga wareegga inta badan waxaa ku jira dalool indho-la’aan laysarka iyo godka indhoolaha farsamada;
Guud ahaan iyada oo loo marayo dalool la aasay, dalool indho la’aan ah, dalool is dulsaaran, dalool is-tallaab ah, dalool ka gudba, dalool indho la’aan ah oo buuxinaya electroplating, khad khafiif ah oo yar yar, microhole saxan iyo habab kale si loo gaaro habka u dhexeeya lakabyada gudaha iyo dibadda, badanaa indhoole dhexroorka la aasay kama badna 6mil.

Guddiga wareegga HDI wuxuu u qaybsan yahay dhowr iyo lakab kasta oo isku xira

Qaab dhismeedka heerka koowaad ee HDI: 1+N+1 (laba jeer oo la cadaadiyo, leys hal mar)

Qaab dhismeedka labaad ee HDI: 2+N+2 (cadaadis 3 jeer, leysarka 2 jeer)

Habka saddexaad ee HDI: 3+N+3 (cadaadi 4 jeer, leysarka 3 jeer) Dalabka afraad

Qaab dhismeedka HDI: 4+N+4 (cadaadis 5 jeer, leysarka 4 jeer)

Iyo HDI kasta